JPH0345438Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to the structure of an IC socket suitable for testing flat type IC packages.

[Conventional technology]

In the conventional flat type IC package, as shown in Figure 7, the base of the lead P' of the package P is
P′a and the contact portion P′b to be soldered during mounting are formed in a stepped shape, thereby facilitating mounting. On the other hand, regarding IC sockets for testing flat type IC packages P, conventional
As shown in FIGS. 10 to 10, contact pins 15 connected to leads P' of an IC package to be mounted are arranged in rows on the substrate 11 (see FIG. 10), and each contact pin 15 are separated from each other by a partition wall 13. Thus, when the IC package P is housed in the accommodating portion 12 of the base 11, each lead P' is inserted into the corresponding slit 1.
4 and the main body of the IC package P is pressed by the holding plate 17, thereby connecting the leads P' and the contact pins 15.
Further, when making this connection, it is necessary to take sufficient consideration to prevent deformation or damage of the lead P', electrical connection with the contact pin, positioning of the IC package P, etc. as the socket is used for testing.

[Problem that the invention attempts to solve]

However, in conventional IC sockets, the height of the partition wall 13 is lowered or the thickness of the partition wall 13 is reduced in order to prevent deformation of the lead P' due to contact or collision with the partition wall 13. If it is made thinner and the width of the slit 14 is increased, it becomes difficult to accurately position the package P, and as a result, the contact between the lead P' and the contact pin 14 becomes incomplete, and the electrical connection between the two becomes difficult. cannot be adequately secured. Furthermore, there have been other inconveniences such as damage to the partition wall 13 itself. Furthermore, when the IC package P is housed in the housing portion 12 of the base plate 11 (see FIG. 10), the lower surface of the contact portion P'b at the tip of the lead P' is brought into contact with the contact pin 15. This was a problem because the IC package P was deformed and damaged, resulting in insufficient electrical connection when the IC package P was mounted. Furthermore, in order to prevent the package P from wobbling within the housing section 12, the distance l ₁ (see FIG. 8) between the partition walls 13, 13 that separate the housing section 12 is equal to the width l ₂ (the width of the package P main body). (see Figure 7) should be approximately equal (l ₁ ≧ l ₂ ), but in this case, the partition wall 13 should be approximately equal to the portion of the lead P' that reaches the base P'a, that is, approximately the same as that of the lead P'. Positioning is accomplished by guiding it into the slit 14 along its entire length. This allows the lead to
The positioning and electrical connection between P' and the contact pin can be ensured, but at the same time, if the IC package P is removed in an inclined state with respect to the partition wall 13, as shown in FIG.
A problem arises in that P' comes into contact with the corner or side surface of the partition wall 13, and as a result, the lead is deformed or damaged. To solve this problem, the partition wall 13 can be used as a lead.
When guiding P′ is made shallow, that is, when positioning is performed only by the tip of lead P′,
The IC package becomes loose within the housing section 2, and the electrical connection between the lead P' and the contact pin 14 becomes unstable.

In view of these circumstances, this invention is designed to
When the lead P' is mounted in the socket, the electrical connection between the lead P' and the contact pin is ensured without deforming or damaging the lead P', and the insertion and removal of the lead P' into and out of the slit 14 is extremely smooth. The purpose is to provide an IC socket that can be used for

[Means and actions for solving problems]

In the IC socket according to the present invention, a concave portion capable of accommodating the IC package upside down is formed in the base, and a concave portion is provided on the peripheral wall of the concave portion to be connected to the lead of the IC package housed in the base. A partition wall is provided to partition the contact pins from each other, and a protrusion is formed to protrude inwardly from the partition wall other than at both ends of the partition wall group, and to restrict the swinging of the IC package. .

〔Example〕

1 to 5 show an embodiment of the IC socket according to the present invention. In the figures, 1 is a base, 2 is molded in the center of the base 1, and can accommodate an IC package P even if it is turned upside down. A hole 3 is a recess shaped like this, a partition wall 3 is provided upright on the peripheral wall of the recess 2 and is arranged in a row at the same pitch as the leads P' of the IC package P, and 3' is a hole arranged in the center of the group of partition walls 3. The central partition wall (see Figures 2, 3, and 4) is provided, 3'' is a partition wall at both ends that is provided on both the left and right sides of the 3 group of partition walls and is higher than the partition walls 3 and 3', and 3a is the partition wall in the figure. A tapered portion 3b is formed on the left side of the upper end of each of the three groups of partition walls and guides the insertion and removal of the lead P′.
A tapered part 4 formed on the right side of the upper end of each group of partition walls for the same purpose is defined by adjacent partition walls 3, 3', and 3'', and a package P is accommodated in the storage part 2. A slit formed to receive the contact portion P′b of the lead P′, 5 is the lead to be connected.
Each partition wall 3, 3', arranged in a row on the base 1 corresponding to P',
The contact pins 6 are separated by 3" and the connecting portions 5a with the leads P' are arranged in the slits 4. The contact pins 6 are spaced apart on each row of the 3 groups of partition walls and are separated from each other between the rows. protrudes into the housing part 2 from the partition wall 3 at a suitable location facing the IC package P by a dimension equal to or less than the gap formed between the partition wall 3 and the IC package P;
When the package P is accommodated in the storage section 2, it is placed at a plurality of points P ₁ , P ₂ , P ₃ , P ₄ (see Fig. 2).
Reference numeral 7 denotes a holding plate for the IC package P, which is pivotally attached to the base 1 so as to be openable and closable.

Since the IC socket according to the present invention is constructed as described above, the width of the opening end of the slit 4 is substantially wider than the width l of the bottom part (see Fig. 3) due to the tapered parts 3a and 3b. Therefore, when the IC package P is accommodated in the recess 2, the lead P' is inserted into the slit 4 through the tapered parts 3a and 3.
This can be done very easily with b as a guide. At this time, the lead P' is not inserted into the slit 4 over its entire length, that is, the base P'a is not inserted, and as shown in FIG.
A gap g=(l ₁ −l ₂ )/2 is formed between the IC package P and the main body of the IC package P, but the protrusion 6 connects the IC package P to a plurality of points P ₁ , P ₂ , P ₃ , its position is restricted through the side of _P4 , so that the package P
is accurately positioned within the housing 2. Therefore, the contact portion P'b of each lead P' and the corresponding connection portion 5a of the contact pin 5 are electrically connected reliably and stably. In this case, if the lead P' were to be deformed, the lead would collide with the partition wall in a conventional socket, making it impossible to insert it into the slit. Even if there is such a deformed lead, the tapered part 3
a, 3b, it is possible to insert the lead P' into the slit, and once inserted, the lead P' can be corrected into the correct shape during insertion. Furthermore, when taking out the IC package P housed in the storage section 2, even if the package P is taken out in an inclined state with respect to the partition wall 3, etc., as shown in FIG.
Since the relief for the lead P' is formed by
Further, even when the IC package P is taken out in a state in which it is tilted upward to the left, contrary to the state shown in FIG. It can be removed from the housing part 2 very smoothly without being deformed by the partition walls 3, 3'. Also, recess 2
As shown in FIGS. 4 and 5, the IC package P has a sufficient depth to accommodate the IC package P turned upside down. Contact part of lead P′
P'b is pressed, and a reliable and stable electrical connection between lead P' and contact pin 5 can be established in the same manner as above. At this time, the base P′a of lead P′ is the connection point P′b
However, since the lead P' is positioned downward by the step-like distance difference, when the package P is pulled out in an inclined state with respect to the partition wall, the base P'a tends to come into contact with the partition wall. However, since the protrusion 6 protrudes from an appropriate partition wall 3 near the center other than the partition walls 3'' at both ends, the base P'a does not actually come into contact with any partition wall. If the package P is housed in an inverted position, the upper surface of the connection part P'b will be connected to the connection part 5a of the contact pin 5, so the contact that should be soldered when the package P is mounted. The lower surface of the portion P'b is not damaged or deformed, so that the electrical connection of the leads P' can be made very reliably during the mounting of the package P.

Incidentally, the angles and dimensions of the tapered portions 3a, 3b, etc. in the above embodiment are set to appropriate values depending on the IC package to which it is applied, and the number of protrusions 6 to be formed may be increased or decreased as necessary.

[Effect of idea]

As mentioned above, the IC socket according to the present invention
It enables extremely smooth and reliable testing of IC packages without impairing the functionality of the package.
Furthermore, the IC package after testing has the advantage that it does not cause any problems during mounting.

[Brief explanation of the drawing]

Figures 1 to 5 show an embodiment of the IC socket of the present invention, Figure 1 is a partial perspective view showing the structure of the main part of the base that can accommodate the IC package, and Figure 2 shows the structure of the main part of the base that can accommodate the IC package. Figure 3 is a partial sectional view showing the relationship between the IC package leads and the partition wall when the IC package is removed from the slit, and Figures 4 and 5 are
6 to 10 are cross-sectional views of the main parts of the respective bases showing the state when the package cage is housed upside down.
The figures relate to a conventional IC socket, Fig. 6 is a perspective view showing the overall structure, and Fig. 7 is an IC to be accommodated.
A perspective view of the package, Figure 8 is a perspective view showing the main parts of the base, and Figure 9 is a perspective view of the package when it is removed from the slit.
FIG. 10, which is a diagram showing the relationship between the leads of the IC package and the partition wall, is a longitudinal sectional view of the main part of the socket in which the package is housed. DESCRIPTION OF SYMBOLS 1...Base, 2...Recess, 3, 3', 3''...Partition wall, 3a, 3b...Tapered part, 4...Slit, 5...Contact pin, 6...Protrusion, 7...
Presser plate.

Claims (1)

[Scope of utility model registration request] In an IC socket, a flat IC package having stepped leads is attached to a socket base, and the leads are connected to contact pins housed in the socket base. a recess for accommodating an IC package; a partition wall arranged in a row on a peripheral wall of the recess to partition the contact pins;
and a protrusion that protrudes inward from some of the partition walls located at positions other than both ends of the partition wall group and that protrudes from or comes into contact with a side surface of the IC package accommodated in the recess. Featured IC
socket.