JPH0344364U - - Google Patents
Info
- Publication number
- JPH0344364U JPH0344364U JP10281989U JP10281989U JPH0344364U JP H0344364 U JPH0344364 U JP H0344364U JP 10281989 U JP10281989 U JP 10281989U JP 10281989 U JP10281989 U JP 10281989U JP H0344364 U JPH0344364 U JP H0344364U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- chip
- input
- support body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
Description
第１図は一実施例を用いた等倍センサーの例を
示す断面図、第２図は一実施例における入出力コ
ネクタ部を示す図であり、Ａは部分断面図、Ｂは
部分平面図、第３図、第４図、第５図はそれぞれ
他の実施例を示す部分平面図、第６図はさらに他
の実施例を示す部分断面図である。第７図はセン
サーＩＣチツプの実装基板としてプリント配線基
板を用いた場合の問題点を示す断面図である。
１６……支持フレーム、２２……プリント配線
基板、２４……センサーＩＣチツプ、２６……ガ
ラスキヤツプ、２８……駆動回路素子、３４……
両面接着テープ、３６，３８，４２……ねじ、４
０，４４……入出力コネクタ、４６……ピン。
FIG. 1 is a sectional view showing an example of a same-magnification sensor using one embodiment, and FIG. 2 is a diagram showing an input/output connector part in one embodiment, where A is a partial sectional view, B is a partial plan view, 3, 4, and 5 are partial plan views showing other embodiments, and FIG. 6 is a partial sectional view showing still another embodiment. FIG. 7 is a sectional view showing problems when a printed wiring board is used as a mounting board for a sensor IC chip. 16... Support frame, 22... Printed wiring board, 24... Sensor IC chip, 26... Glass cap, 28... Drive circuit element, 34...
Double-sided adhesive tape, 36, 38, 42...Screw, 4
0, 44...Input/output connector, 46...pin.
Claims (1)
に画像読取りセンサーＩＣチツプ及び駆動回路Ｉ
Ｃチツプが搭載され、前記プリント配線基板の裏
面が接着剤により支持体に接着されているととも
に、前記入出力コネクタ部の近傍で前記プリント
配線基板が前記支持体にねじ止めされている密着
型センサーユニツト。 Image reading sensor IC chip and drive circuit I are mounted on the surface of the printed wiring board with input/output connectors.
A close-contact type sensor on which a C chip is mounted, the back side of the printed wiring board is adhered to the support body with an adhesive, and the printed wiring board is screwed to the support body near the input/output connector part. unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10281989U JPH0344364U (en) | 1989-08-31 | 1989-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10281989U JPH0344364U (en) | 1989-08-31 | 1989-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0344364U true JPH0344364U (en) | 1991-04-24 |
Family
ID=31651694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10281989U Pending JPH0344364U (en) | 1989-08-31 | 1989-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0344364U (en) |
-
1989
- 1989-08-31 JP JP10281989U patent/JPH0344364U/ja active Pending
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