JPH0343960B2 - - Google Patents

Info

Publication number
JPH0343960B2
JPH0343960B2 JP23169686A JP23169686A JPH0343960B2 JP H0343960 B2 JPH0343960 B2 JP H0343960B2 JP 23169686 A JP23169686 A JP 23169686A JP 23169686 A JP23169686 A JP 23169686A JP H0343960 B2 JPH0343960 B2 JP H0343960B2
Authority
JP
Japan
Prior art keywords
pressure
mold clamping
clamping cylinder
electromagnetic relief
primary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP23169686A
Other languages
Japanese (ja)
Other versions
JPS63239000A (en
Inventor
Akihiko Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiki Seisakusho KK
Original Assignee
Meiki Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiki Seisakusho KK filed Critical Meiki Seisakusho KK
Priority to JP23169686A priority Critical patent/JPS63239000A/en
Priority to DE8787114128T priority patent/DE3778811D1/en
Priority to US07/101,406 priority patent/US4963221A/en
Priority to EP87114128A priority patent/EP0262635B1/en
Priority to AT87114128T priority patent/ATE75661T1/en
Publication of JPS63239000A publication Critical patent/JPS63239000A/en
Publication of JPH0343960B2 publication Critical patent/JPH0343960B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B7/00—Presses characterised by a particular arrangement of the pressing members
    • B30B7/02—Presses characterised by a particular arrangement of the pressing members having several platens arranged one above the other

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Control Of Presses (AREA)
  • Press Drives And Press Lines (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

（産業上の利用分野） 本発明はプリント配線基板等を加熱加圧により
プレス成形するホツトプレスに係り、特にICカ
ードの成形のように低圧の出力保持を必要とする
ホツトプレスに関する。 （従来の技術） 従来、ホツトプレスは第４図に示す単動型の型
締シリンダ３０のラム３０ａを電磁リリーフ弁の
設定圧により所定の出力で上昇させ、多層のプリ
ント配線基板間の接着樹脂を加熱加圧してプレス
成形を行ない、その後、ラムは自重で降下するよ
うになつている。 このようなホツトプレスの型締シリンダの油圧
力を制御するために使用する電磁リリーフ弁の圧
力制御は、電磁リリーフ弁の特性上、最低圧力の
設定には限度がある。 このため低圧にてホツトプレスの熱板内の被処
理板体を圧縮しようとすると精確な制御ができな
かつた。 特に大型ホツトプレスの場合大きな型締力を必
要とし型締シリンダも型締力に応じて大きな直径
を備えたものになる。しかしこの場合、高い型締
ス力が得られる反面、ラム径が大きくなると型締
力を低くしようとするとき電磁リリーフ弁型締シ
リンダ内の圧力を低い圧力に設定しなければなら
ない。従来の電磁リリーフ弁を使用した型締圧力
の制御ではこのような場合精確な圧力制御が得ら
れなかつた。このため型締シリンダを複数設けた
サイドシリンダ方式がある。 これは、初め一方のサイドシリンダにて高速低
圧型閉めをして、型が閉じた後高圧にて主型締シ
リンダを含めた全シリンダによつて圧縮を行う装
置となつている。 （発明が解決しようとする問題点） しかしながら、上記の型締力を分割する装置で
は、たとえば、型締力が0.6〜13トンおよび28〜
600トンの範囲の出力制御はできても、13〜28ト
ンの中間領域の出力制御ができなくなる。またラ
ム径を大きくして高出力の型締力を得た場合に
は、低出力を保持することができないため、接触
圧が０Kg／cm2や低出力の状態から最高の所定圧力
まで広範囲に連続して圧力制御が必要なICカー
ド等の成形品を製造するには不向きであつた。 さらにICカードの成形では、非常に薄いカー
ドプレート間で熱硬化性の接着樹脂を加熱溶融さ
せ、低圧で圧締し、接着樹脂を一様に溶かすこと
が必要である。その後、高圧にして型締する。こ
の際熱硬化した接着樹脂がこの接着剤の抵抗に相
応してラムの押圧力を停止させることができなけ
ればカードプレート間から接着樹脂がはみ出すと
いう問題が生じる。 このような事情に鑑みて本発明は、ICカード
等の被プレス成形品をホツトプレスする際、最初
低圧に出力を制御し、被プレス成形品の接着樹脂
が一様に溶けた後、高圧にて適正な圧締を行なつ
て広範囲の圧力制御を可能にしたホツトプレスを
提供することを目的としている。 （問題点を解決するための手段） 上記目的を達成するため、本発明のホツトプレ
スは、固定盤と、該固定盤に対して移動自在に設
けられた可動盤との間に被プレス成形品を加圧圧
締するための熱板を配設し、さらに 前記可動盤を駆動させる複動型の型締シリンダ
と、 この型締シリンダの一次側および二次側管路に
それぞれ電磁リリーフ弁と方向制御弁を備えて前
記型締シリンダの一次側圧力と二次側圧力を均衡
させ、しかも一次側と二次側の圧力差により所定
の型締力を得て低圧駆動可能な圧力制御回路とを
設けてなることを特徴としている。 （作用） このような構成としたことから、ホツトプレス
成形を行なう際、型締シリンダの一次側と二次側
に設けられた電磁リリーフ弁の差圧により圧力制
御を行なうため、各電磁リリーフ弁の設定圧が特
性上問題のある低圧でなく適正な圧力に設定して
も、型締力を所望の低出力に保持し、かつ出力を
低圧から高圧まで連続的に制御可能となる。 （実施例） 本発明の実施例を図面に基づいて説明する。ホ
ツトプレスにおいては、熱板は蒸気又は電気によ
つて加熱され、150〜400℃程度に昇温される。 第２図において、１は固定盤、２は可動盤、３
は型締シリンダであつて、固定盤１と型締シリン
ダ３のつば部とは上下に所定の間隔を置いて相対
向するように配置されている。 可動盤２は型締シリンダ３に挿嵌したラム３ａ
の先端部に固定され、固定盤１に対して離間接近
自在となつている。型締シリンダ３のつば部には
水平方向に突出する４つの突出部６が形成され、
それぞれの突出部６にはステー４が立設され、各
ステー４は可動盤２の四隅に形成された貫通孔を
貫通し、固定盤１はステー４の上端部に固定され
ている。 ７は型締シリンダ３のつば部に立設された階段
状の段板で、これらはステー４の数に応じて４本
設けられている。各段板７には上下方向に所定の
間隔を置いて段差による座部８ａ，８ｂ，８ｃを
各々形成している。 固定盤１と可動盤２との間には、プリント配線
基板やICカード等の被プレス成形品を載置し、
加圧・圧締するため、複数の熱板９，…が設けら
れ、熱板９の４つの角部には、それぞれ段板７に
載置されるブラケツト１０が取付けられる。 ブラケツト１０は上位に位置する熱板９から下
位にかけてそれぞれ長さを短くし各座部８ａ，８
ｂ，８ｃに対応して載置されるブラケツト１０
ａ，１０ｂ，１０ｃとなつている。 上記固定盤１の下面および可動盤２の上面のそ
れぞれには、断熱板１１，１２が取付けられてお
り、熱板９からの固定盤１又は可動盤２への熱伝
導が遮断されるようになつている。 次に、本発明の特徴部分を示す構成について第
１図を参照して説明する。 ここで第２図に示す型締シリンダ３は、複動式
の油圧シリンダであつて、一次側および二次側に
それぞれ圧油の供給・排出を行なう油口１３，１
４が設けられている。 油口１３，１４には、それぞれ油圧ポンプ１
５，１６からの圧油を供給するための一次側およ
び二次側管路１７，１８が接続されている。各管
路１７，１８のそれぞれには一対の側路１７ａ，
１７ｂ，１８ａ，１８ｂが接続され、油圧ポンプ
１５，１６側側路１７ａ，１８ａにはポート２位
置方向制御弁１９，２０が設けられ、されに油口
１３，１４側の側路１７ｂ，１８ｂには電磁リリ
ーフ弁２１，２２が設けられている。 また、各電磁リリーフ弁２１，２２の設定圧を
より適切なものとするため負荷や油圧回路の環境
条件により変化する圧力変動をフイードバツクし
て作動時の型締シリンダ３の一次側および二次側
の圧力を逐次検知させる圧力センサ２３を設けて
いる。 次に本発明の油圧回路における圧力制御につい
て説明する。 まず、型締シリンダの一次側および二次側にお
けるピストン径に基づき、一次側および二次側圧
力があらかじめ定めた圧力になるように電磁リリ
ーフ弁２１，２２の設定圧を設定する。 そして方向制御弁１９，２０のソレノイドＰを
励磁してポンプ１５，１６からの油圧をそれぞれ
管路１７，１８を通じて型締シリンダ３内に供給
する。このとき電磁リリーフ弁２１，２２との設
定圧をあらかじめ定めた圧力に設定して一次側と
二次側との圧力差を所定値にすることにより求め
る型締力を得る。 これによりポンプ１５からの油圧は、電磁リリ
ーフ弁２１の設定圧に応じて油口１３から型締シ
リンダ３内に供給され、所望の低圧出力の保持が
可能となる。 したがつて、電磁リリーフ弁２２の設定圧を電
磁リリーフ弁２１の適正な最低設定圧に対応させ
れば、電磁リリーフ弁２１は電磁リリーフ弁の特
性上有効に作動する範囲で最低設定圧力から最高
設定圧力まで連続的に逐次変化させることができ
る。 ここで上記圧力制御のより具体的な例について
説明する。第１図において、ラム３ａの大径部に
おける直径をDA、小径部における直径をDB、ラ
ム３ａによつて２つの室に画成される型締シリン
ダ３の下側のチヤンバＡにおけるラム３ａの面積
をSA、上側のチヤンバＢにおけるラム３ａの面
積をSB、電磁リリーフ弁２１の設定圧をPA、電
磁リリーフ弁２２の設定圧をPBとして、各チヤ
ンバＡ，Ｂにおけるラム３ａの出力FA，FBおよ
びラム３ａの熱板９に対する圧締力FABを求める
ことにする。 ここに具体的な数値の一例として、ラム３ａの
直径DA＝356mm、DB＝300mm、電磁リリーフ弁２
１の設定圧PA＝10Kg／cm2、電磁リリーフ弁２２
の設定圧PB＝35Kg／cm2とする。 (i) チヤンバＡにおけるラムの出力FA チヤンバＡにおけるラム３ａの面積 SA＝π×（DA／２）2 ＝π／４×（35.6cm）2 ＝995.4cm2 ラム３ａの出力 FA＝SA・PA ＝995.4cm2×10Kg／cm2 ＝9954Kg ≒10ton (ii) チヤンバＢにおけるラムの出力FA チヤンバＢにおけるラム３ａの面積 SB＝π×（DA／２）2−π（DB／２）2 ＝π／４｛（DA／２）2−（DB／２）2｝ ＝π／４｛（35.6cm）2−（30cm）2｝ ＝288.5cm2 ラム３ａの出力FB＝SB・PB ＝288.5cm2×35Kg／cm2 ＝10097.5Kg≒10ton (iii) ラムの圧締力FAB FAB＝FA−FB ＝10ton−10ton ＝0ton すなわち、本発明においては、ラム３ａの熱板
９に対する圧締力を零にすることができる。しか
も、この零の圧締力は安定に保持することができ
る。 つぎにこの圧締力を零から漸次増加させていく
場合の例について述べる。 この場合は、ラム３ａの出力FAとFBとの差圧
を零から漸次増加させていけばよい。具体的に
は、電磁リリーフ弁２２の設定圧を上記と同様に
PB＝35Kg／cm2に保持し、かつ前述したと同様の
条件の下で、電磁リリーフ弁２１の設定圧PAを
10Kg／cm2から増加させる。 下記の表は、電磁リリーフ弁２１の設定圧PA
を10Kg／cm2から15Kg／cm2、20Kg／cm2、25Kg／cm2…
…に変えた場合に得られるラム３ａの出力FA，
FBおよび圧締力FABを示すものである。これらの
計算式は前記と同様である。 (Industrial Application Field) The present invention relates to a hot press for press-molding printed wiring boards and the like by applying heat and pressure, and particularly relates to a hot press that requires low-pressure output maintenance, such as the molding of IC cards. (Prior Art) Conventionally, in a hot press, the ram 30a of the single-acting mold clamping cylinder 30 shown in FIG. Press molding is performed by heating and pressurizing, and then the ram descends under its own weight. Due to the characteristics of the electromagnetic relief valve, there is a limit to the setting of the minimum pressure in the pressure control of the electromagnetic relief valve used to control the hydraulic pressure of the mold clamping cylinder of such a hot press. For this reason, when attempting to compress the plate to be processed within the hot plate of the hot press at low pressure, accurate control could not be achieved. Particularly in the case of a large-sized hot press, a large mold clamping force is required, and the mold clamping cylinder also has a large diameter in accordance with the mold clamping force. However, in this case, although a high mold clamping force can be obtained, if the ram diameter becomes large, the pressure in the electromagnetic relief valve mold clamping cylinder must be set to a low pressure when attempting to lower the mold clamping force. In such cases, accurate pressure control could not be obtained by controlling mold clamping pressure using conventional electromagnetic relief valves. For this reason, there is a side cylinder method in which a plurality of mold clamping cylinders are provided. This is a device that first closes the mold at high speed and low pressure using one side cylinder, and after the mold is closed, compression is performed at high pressure using all cylinders including the main mold clamping cylinder. (Problems to be Solved by the Invention) However, in the device that divides the mold clamping force described above, for example, the mold clamping force is 0.6 to 13 tons and 28 to
Even if it is possible to control the output in the 600 ton range, it will not be possible to control the output in the intermediate range of 13 to 28 tons. In addition, when increasing the ram diameter to obtain a high mold clamping force, it is not possible to maintain a low output, so the contact pressure can be varied over a wide range from 0 kg/cm 2 or low output to the highest predetermined pressure. It was unsuitable for manufacturing molded products such as IC cards that require continuous pressure control. Furthermore, when molding IC cards, it is necessary to heat and melt thermosetting adhesive resin between extremely thin card plates and press them together under low pressure to uniformly melt the adhesive resin. After that, the mold is clamped under high pressure. At this time, if the thermoset adhesive resin cannot stop the pressing force of the ram in accordance with the resistance of the adhesive, a problem arises in that the adhesive resin protrudes from between the card plates. In view of these circumstances, the present invention, when hot-pressing a press-molded product such as an IC card, first controls the output to a low pressure, and after the adhesive resin of the press-molded product has uniformly melted, it is hot-pressed at a high pressure. The object of the present invention is to provide a hot press that performs appropriate clamping and enables pressure control over a wide range. (Means for Solving the Problems) In order to achieve the above object, the hot press of the present invention has a molded product to be pressed between a fixed platen and a movable platen movable with respect to the fixed platen. A double-acting mold clamping cylinder is provided with a hot plate for pressurizing and clamping, and also drives the movable platen, and an electromagnetic relief valve and directional control are installed in the primary and secondary pipes of this mold clamping cylinder, respectively. A pressure control circuit is provided which is equipped with a valve to balance the primary side pressure and secondary side pressure of the mold clamping cylinder, and can obtain a predetermined mold clamping force by the pressure difference between the primary side and the secondary side and can be driven at a low pressure. It is characterized by being (Function) With this configuration, when performing hot press molding, pressure is controlled by the differential pressure between the electromagnetic relief valves provided on the primary and secondary sides of the mold clamping cylinder, so each electromagnetic relief valve is Even if the set pressure is set to an appropriate pressure rather than a low pressure that is problematic in terms of characteristics, the mold clamping force can be maintained at a desired low output, and the output can be continuously controlled from low pressure to high pressure. (Example) An example of the present invention will be described based on the drawings. In a hot press, a hot plate is heated by steam or electricity, and the temperature is raised to about 150 to 400°C. In Figure 2, 1 is a fixed plate, 2 is a movable plate, 3
is a mold clamping cylinder, and the stationary platen 1 and the collar of the mold clamping cylinder 3 are arranged vertically to face each other with a predetermined distance therebetween. The movable platen 2 has a ram 3a inserted into the mold clamping cylinder 3.
It is fixed to the tip of the fixed plate 1 and can be moved away from and approached the fixed plate 1. Four protrusions 6 that protrude in the horizontal direction are formed on the collar of the mold clamping cylinder 3.
A stay 4 is provided upright on each protrusion 6, each stay 4 penetrates through holes formed at the four corners of the movable plate 2, and the fixed plate 1 is fixed to the upper end of the stay 4. Reference numeral 7 denotes a stepped plate erected on the collar portion of the mold clamping cylinder 3, and four of these are provided depending on the number of stays 4. Each stepped plate 7 has stepped seat portions 8a, 8b, and 8c formed at predetermined intervals in the vertical direction. Between the fixed platen 1 and the movable platen 2, press-formed products such as printed wiring boards and IC cards are placed.
A plurality of hot plates 9, . The length of the bracket 10 is shortened from the upper heating plate 9 to the lower part, and each seat part 8a, 8
Bracket 10 placed corresponding to b, 8c
a, 10b, 10c. Heat insulating plates 11 and 12 are attached to the lower surface of the fixed platen 1 and the upper surface of the movable platen 2, respectively, so as to block heat conduction from the hot plate 9 to the fixed platen 1 or the movable platen 2. It's summery. Next, a configuration showing the characteristic parts of the present invention will be explained with reference to FIG. The mold clamping cylinder 3 shown in FIG. 2 is a double-acting hydraulic cylinder, and oil ports 13 and 1 supply and discharge pressure oil to the primary side and the secondary side, respectively.
4 is provided. The oil ports 13 and 14 each have a hydraulic pump 1.
Primary side and secondary side pipes 17 and 18 for supplying pressure oil from 5 and 16 are connected. Each of the pipes 17 and 18 has a pair of side passages 17a,
17b, 18a, 18b are connected, port 2 position directional control valves 19, 20 are provided in the side passages 17a, 18a on the side of the hydraulic pumps 15, 16, and side passages 17b, 18b on the side of the oil ports 13, 14 are provided. is provided with electromagnetic relief valves 21 and 22. In addition, in order to make the set pressure of each electromagnetic relief valve 21, 22 more appropriate, pressure fluctuations that change depending on the load and the environmental conditions of the hydraulic circuit are fed back to the primary and secondary sides of the mold clamping cylinder 3 during operation. A pressure sensor 23 is provided to sequentially detect the pressure. Next, pressure control in the hydraulic circuit of the present invention will be explained. First, based on the piston diameters on the primary and secondary sides of the mold clamping cylinder, the set pressures of the electromagnetic relief valves 21 and 22 are set so that the primary and secondary side pressures become predetermined pressures. Then, the solenoids P of the direction control valves 19 and 20 are energized to supply hydraulic pressure from the pumps 15 and 16 into the mold clamping cylinder 3 through the pipes 17 and 18, respectively. At this time, the required mold clamping force is obtained by setting the set pressures of the electromagnetic relief valves 21 and 22 to a predetermined pressure and making the pressure difference between the primary side and the secondary side a predetermined value. Thereby, the hydraulic pressure from the pump 15 is supplied from the oil port 13 into the mold clamping cylinder 3 according to the set pressure of the electromagnetic relief valve 21, making it possible to maintain a desired low pressure output. Therefore, if the set pressure of the electromagnetic relief valve 22 is made to correspond to the appropriate minimum set pressure of the electromagnetic relief valve 21, the electromagnetic relief valve 21 will be able to adjust from the lowest set pressure to the highest set pressure within the range in which it operates effectively due to the characteristics of the electromagnetic relief valve. The pressure can be changed continuously and sequentially up to the set pressure. A more specific example of the above pressure control will now be described. In FIG. 1, the diameter of the ram 3a at the large diameter part is D A , the diameter at the small diameter part is D B , and the ram 3a is located in the lower chamber A of the mold clamping cylinder 3 which is defined into two chambers by the ram 3 a. The area of the ram 3a in the upper chamber B is S A , the area of the ram 3 a in the upper chamber B is S B , the set pressure of the electromagnetic relief valve 21 is P A , and the set pressure of the electromagnetic relief valve 22 is P B . The outputs F A and F B of the ram 3a and the clamping force F AB of the ram 3a against the hot plate 9 are determined. Here, as an example of specific values, the diameter of the ram 3a is D A = 356 mm, D B = 300 mm, and the electromagnetic relief valve 2.
1 set pressure P A = 10Kg/cm 2 , electromagnetic relief valve 22
Set pressure P B =35Kg/ cm2 . (i) Output of ram in chamber A F A Area of ram 3a in chamber A S A = π×(D A /2) 2 = π/4× (35.6cm) 2 = 995.4cm 2 Output of ram 3a F A =S A・P A =995.4cm 2 ×10Kg/cm 2 =9954Kg ≒10ton (ii) Output of ram in chamber B F A Area of ram 3a in chamber B S B = π×(D A /2) 2 − π (D B /2) 2 = π/4 {(D A /2) 2 − (D B /2) 2 } = π/4 {(35.6 cm) 2 − (30 cm) 2 } = 288.5 cm 2 Ram Output of 3a F B =S B・P B =288.5cm 2 ×35Kg/cm 2 =10097.5Kg≒10ton (iii) Clamping force of ram F AB F AB =F A −F B =10ton−10ton =0ton In the present invention, the clamping force of the ram 3a against the hot plate 9 can be reduced to zero. Moreover, this zero clamping force can be stably maintained. Next, an example will be described in which the clamping force is gradually increased from zero. In this case, the differential pressure between the outputs F A and F B of the ram 3a may be gradually increased from zero. Specifically, the set pressure of the electromagnetic relief valve 22 is set in the same manner as above.
Maintaining P B = 35Kg/cm 2 and under the same conditions as described above, set pressure P A of electromagnetic relief valve 21.
Increase from 10Kg/ cm2 . The table below shows the set pressure P A of the electromagnetic relief valve 21.
from 10Kg/cm 2 to 15Kg/cm 2 , 20Kg/cm 2 , 25Kg/cm 2 ...
The output F A of the ram 3a obtained when changing to...
It shows F B and clamping force F AB . These calculation formulas are the same as above.

【表】【table】

Claims (1)

【特許請求の範囲】 １ 固定盤と、該固定盤に対して移動自在に設け
られた可動盤との間に被プレス成形品を加圧圧締
するための熱板を配設し、さらに 前記可動盤を駆動させる複動型の型締シリンダ
と、 この型締シリンダの一次側および二次側管路に
それぞれ電磁リリーフ弁と方向制御弁を備えて前
記型締シリンダの一次側圧力と二次側圧力を均衡
させ、しかも一次側と二次側の圧力差により所定
の型締力を与える低圧駆動可能な圧力制御回路と
を設けてなるホツトプレス。 ２ 各電磁リリーフ弁の設定圧が型締シリンダの
一次側および二次側の圧力変動を検知する圧力セ
ンサに基づき調整され、型締シリンダの出力を制
御することを特徴とする特許請求の範囲第１項記
載のホツトプレス。[Scope of Claims] 1. A hot plate for pressurizing the pressed product is disposed between a fixed plate and a movable plate movably provided with respect to the fixed plate, and further: A double-acting mold clamping cylinder that drives the board, and an electromagnetic relief valve and a directional control valve in the primary and secondary pipes of this mold clamping cylinder, respectively, are installed to control the primary pressure and the secondary side of the mold clamping cylinder. A hot press equipped with a pressure control circuit that can be driven at low pressure to balance the pressure and apply a predetermined mold clamping force based on the pressure difference between the primary and secondary sides. 2. The set pressure of each electromagnetic relief valve is adjusted based on a pressure sensor that detects pressure fluctuations on the primary side and secondary side of the mold clamping cylinder, and the output of the mold clamping cylinder is controlled. Hot press described in item 1.
JP23169686A 1986-09-29 1986-09-30 Hot press Granted JPS63239000A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP23169686A JPS63239000A (en) 1986-09-30 1986-09-30 Hot press
DE8787114128T DE3778811D1 (en) 1986-09-29 1987-09-28 HEATING PRESS.
US07/101,406 US4963221A (en) 1986-09-29 1987-09-28 Hot press including cam rod penetrating top platen
EP87114128A EP0262635B1 (en) 1986-09-29 1987-09-28 Hot press
AT87114128T ATE75661T1 (en) 1986-09-29 1987-09-28 HEAT PRESS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23169686A JPS63239000A (en) 1986-09-30 1986-09-30 Hot press

Publications (2)

Publication Number Publication Date
JPS63239000A JPS63239000A (en) 1988-10-05
JPH0343960B2 true JPH0343960B2 (en) 1991-07-04

Family

ID=16927565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23169686A Granted JPS63239000A (en) 1986-09-29 1986-09-30 Hot press

Country Status (1)

Country Link
JP (1) JPS63239000A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0822571B2 (en) * 1992-12-04 1996-03-06 株式会社アドテックエンジニアリング Film pressure device in exposure equipment

Also Published As

Publication number Publication date
JPS63239000A (en) 1988-10-05

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