JPH0343738U - - Google Patents
Info
- Publication number
- JPH0343738U JPH0343738U JP1989105179U JP10517989U JPH0343738U JP H0343738 U JPH0343738 U JP H0343738U JP 1989105179 U JP1989105179 U JP 1989105179U JP 10517989 U JP10517989 U JP 10517989U JP H0343738 U JPH0343738 U JP H0343738U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- heat sink
- bonded
- tab tape
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989105179U JPH0343738U (ko) | 1989-09-07 | 1989-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989105179U JPH0343738U (ko) | 1989-09-07 | 1989-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0343738U true JPH0343738U (ko) | 1991-04-24 |
Family
ID=31653949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989105179U Pending JPH0343738U (ko) | 1989-09-07 | 1989-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0343738U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170034249A (ko) * | 2015-09-18 | 2017-03-28 | 현대모비스 주식회사 | 파노라마 루프용 에어백 장치 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010562A (ko) * | 1973-05-25 | 1975-02-03 | ||
| JPS6320859A (ja) * | 1986-07-14 | 1988-01-28 | Matsushita Electric Works Ltd | ピングリツドアレイ |
-
1989
- 1989-09-07 JP JP1989105179U patent/JPH0343738U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010562A (ko) * | 1973-05-25 | 1975-02-03 | ||
| JPS6320859A (ja) * | 1986-07-14 | 1988-01-28 | Matsushita Electric Works Ltd | ピングリツドアレイ |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170034249A (ko) * | 2015-09-18 | 2017-03-28 | 현대모비스 주식회사 | 파노라마 루프용 에어백 장치 |