JPH0343449A - One-component type moisture-curing resin composition - Google Patents
One-component type moisture-curing resin compositionInfo
- Publication number
- JPH0343449A JPH0343449A JP17708289A JP17708289A JPH0343449A JP H0343449 A JPH0343449 A JP H0343449A JP 17708289 A JP17708289 A JP 17708289A JP 17708289 A JP17708289 A JP 17708289A JP H0343449 A JPH0343449 A JP H0343449A
- Authority
- JP
- Japan
- Prior art keywords
- group
- groups
- hydrolyzable
- terminal
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 9
- 238000013008 moisture curing Methods 0.000 title abstract description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 12
- 229920000570 polyether Polymers 0.000 claims abstract description 12
- 125000006353 oxyethylene group Chemical group 0.000 claims abstract description 10
- 125000005371 silicon functional group Chemical group 0.000 claims abstract description 6
- 125000000524 functional group Chemical group 0.000 claims abstract description 5
- 125000000962 organic group Chemical group 0.000 claims abstract description 3
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 150000008282 halocarbons Chemical group 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000001723 curing Methods 0.000 abstract description 14
- 239000003054 catalyst Substances 0.000 abstract description 11
- 239000000203 mixture Substances 0.000 abstract description 9
- 150000002430 hydrocarbons Chemical class 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003566 sealing material Substances 0.000 abstract description 2
- 239000004215 Carbon black (E152) Substances 0.000 abstract 1
- 230000001588 bifunctional effect Effects 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 229930195733 hydrocarbon Natural products 0.000 abstract 1
- 229920000728 polyester Polymers 0.000 abstract 1
- 150000003377 silicon compounds Chemical class 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 description 19
- 238000000034 method Methods 0.000 description 14
- -1 silicon hydride compound Chemical class 0.000 description 12
- 229920005862 polyol Polymers 0.000 description 10
- 150000003077 polyols Chemical class 0.000 description 10
- 150000002009 diols Chemical class 0.000 description 8
- 239000003999 initiator Substances 0.000 description 8
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 6
- 239000012975 dibutyltin dilaurate Substances 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 125000002947 alkylene group Chemical group 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 4
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 239000012312 sodium hydride Substances 0.000 description 2
- 229910000104 sodium hydride Inorganic materials 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 1
- LULCPJWUGUVEFU-UHFFFAOYSA-N Phthiocol Natural products C1=CC=C2C(=O)C(C)=C(O)C(=O)C2=C1 LULCPJWUGUVEFU-UHFFFAOYSA-N 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 150000001339 alkali metal compounds Chemical class 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910052990 silicon hydride Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- NWRRDLFEJIOVKE-UHFFFAOYSA-N zinc;cobalt(2+);tetracyanide Chemical compound [Co+2].[Zn+2].N#[C-].N#[C-].N#[C-].N#[C-] NWRRDLFEJIOVKE-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、大気中水分に曝露するとゴム様物質へと室温
硬化しつる加水分解性珪素末端を有する一成分型湿気硬
化性樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a one-component moisture-curable resin composition having hydrolyzable silicon terminations that cures at room temperature to a rubber-like material upon exposure to atmospheric moisture. .
[従来の技術]
一成分型室温硬化性重合体としては、チオコール系、ウ
レタン系、変性シリコン系、シリコーン系などが一般に
知られている。中でも変性シリコン系は比較的優れた耐
久性を有し、シーリング材等の原料として有用である。[Prior Art] Thiocol-based, urethane-based, modified silicone-based, and silicone-based polymers are generally known as one-component room temperature curable polymers. Among them, modified silicone-based materials have relatively excellent durability and are useful as raw materials for sealing materials and the like.
従来変性シリコン系1成分型を安価に得る方法として、
特公昭45−36319及び特公昭46−12154で
で提案された方法と、特公昭46−30711において
提案された方法が知られているが、低分子量のヒドロキ
シル末端ポリエーテルを原料とするため得られた珪素末
端重合体の硬化物の伸びが、小さなものとなりゴム弾性
体としては、満足できるものではなかった。Conventionally, as a method of obtaining modified silicone one-component type at low cost,
The method proposed in Japanese Patent Publication No. 45-36319 and Japanese Patent Publication No. 46-12154, and the method proposed in Japanese Patent Publication No. 46-30711 are known, but because they use low molecular weight hydroxyl-terminated polyether as raw material, The elongation of the cured product of the silicon-terminated polymer was so small that it was not satisfactory as a rubber elastic body.
この欠点の解消を目的として特開昭50−149797
及び特開昭50−156599において提案された方法
があるが、分子量分布のせまい高分子量体を得ることは
著しく困難であり、また、粘度が大きくなってしまうと
いう欠点を有していた。他方、分子量分布の狭い高分子
量ポリオキシアルキレン重合体を製造する方法としては
、特開昭61−197631号公報、特公昭59−15
336号公報、米国特許第3929505号等がある。In order to eliminate this drawback, Japanese Patent Application Laid-Open No. 50-149797
There is a method proposed in JP-A-50-156599, but it is extremely difficult to obtain a polymer having a narrow molecular weight distribution, and it also has the disadvantage that the viscosity increases. On the other hand, methods for producing high molecular weight polyoxyalkylene polymers with narrow molecular weight distribution are disclosed in JP-A-61-197631 and JP-B-59-15.
No. 336, US Pat. No. 3,929,505, etc.
しかし、一般には、高分子量のポリオキシアルキレン重
合体を用いた。末端加水分解性珪素基を有する温気硬化
性樹脂組成物は、分子量が大きくなる程、硬化物の伸び
が大きくなる代わりに硬化速度が著しく遅くなるという
欠点を有していた。However, generally high molecular weight polyoxyalkylene polymers were used. Warm-curable resin compositions having terminal hydrolyzable silicon groups have had the disadvantage that as the molecular weight increases, the elongation of the cured product increases, but the curing speed becomes significantly slower.
[発明の解決しようとする課題]
本発明は前述の問題点を解決すべくなされ、伸びが大き
く、しかも硬化速度が著しく遅くなり、かつ耐久性も低
下しない一成分型温気硬化性樹脂組成物に関する。[Problems to be Solved by the Invention] The present invention has been made to solve the above-mentioned problems, and provides a one-component temperature-curable resin composition that has high elongation, significantly slows curing speed, and does not reduce durability. Regarding.
[課題を解決するための手段]
本発明は前述の問題点を解決すべくなされ、従来のらの
に比べ、伸びが大きく、しかも硬化速度が著しく遅くな
り、かつ耐久性の低下も殆どない一成分型湿気硬化性樹
脂組成物を提供するものである。[Means for Solving the Problems] The present invention was made in order to solve the above-mentioned problems, and has a material that has greater elongation, a significantly slower curing speed, and almost no decrease in durability compared to conventional lano. A component-type moisture-curable resin composition is provided.
一末端官能基数当りの分子量2.000〜20.000
で末端部に一般式:
%式%
ただし、Rは1価の炭化水素基あるいはハロゲン化炭化
水素基
Xは加水分解性基
R゛は2価の有機基
aはo、i、あるいは2の整数
で示される加水分解性珪素官能基を有する室温硬化性樹
脂において、主鎖が本質的にポリエーテル鎖であり、そ
のうち2〜40重量%のオキシエチレン基(OCI(i
CHz−)を含むことを特徴とする一成分型温気硬化性
樹脂組成物に関する。本発明の末端加水分解性珪素官能
基を有する樹脂は、基本的には特開昭50−14979
7及び特開昭50−156599により知られた方法で
製造することができる。即ち、末端不飽和基を有するポ
リエーテル化合物に加水分解性基又は加水分解性基に変
換できる官能基を有する水素化珪素化合物を例えば、白
金族触媒により付加させ、末端加水分解性基を導入する
方法である。末端不飽和基を有するポリエーテル化合物
はポリエーテルポリオールの末端水酸基と不飽和基含有
ハロゲン化合物とを反応させる方法が一般的である。本
発明において使用できるポリエーテルポリオールは、ポ
リオキシアルキレンポリオール、ポリテトラメチレング
リコールの末端ポリオキシアルキレン変性ポリオールな
どがあげられるが、硬化物の伸びを大きくするという点
から最終生成物の一官能基当りの分子量が3000〜2
0000となるポリオールが好ましい。これらの範囲以
外では例えば分子量が少ない方では硬化物の伸びが少な
く、又分子量が多い方では硬化が著しく遅く、実用的で
はなくなる。Molecular weight per number of terminal functional groups: 2.000 to 20.000
At the terminal end, the general formula: %Formula% Where, R is a monovalent hydrocarbon group or a halogenated hydrocarbon group X is a hydrolyzable group R' is a divalent organic group In the room temperature curable resin having a hydrolyzable silicon functional group, the main chain is essentially a polyether chain, of which 2 to 40% by weight of oxyethylene groups (OCI
Hz-). The resin having a terminal hydrolyzable silicon functional group of the present invention is basically disclosed in Japanese Patent Application Laid-open No. 50-14979.
7 and JP-A-50-156599. That is, a silicon hydride compound having a hydrolyzable group or a functional group that can be converted into a hydrolyzable group is added to a polyether compound having a terminal unsaturated group using, for example, a platinum group catalyst to introduce a terminal hydrolyzable group. It's a method. The polyether compound having a terminal unsaturated group is generally prepared by reacting the terminal hydroxyl group of a polyether polyol with an unsaturated group-containing halogen compound. Examples of polyether polyols that can be used in the present invention include polyoxyalkylene polyols and polytetramethylene glycol-terminated polyoxyalkylene-modified polyols. The molecular weight of is 3000~2
0000 is preferred. Outside these ranges, for example, if the molecular weight is low, the elongation of the cured product will be low, and if the molecular weight is high, curing will be extremely slow, making it impractical.
本発明においては、ポリエーテル鎖の40重量%以下の
オキシエチレンジオキシ基(−QC:H2CH2)を含
むことを特徴とするが、これは原料のポリオキシアルキ
レンポリオールエチレンジオキシ基を含むものを使用す
ることで達成される。そのようなポリオキシアルキレン
ポリオールは開始剤の存在下アルキレンオキシドの開環
重合の際、エチレンオキシドを一部又は全部使用するこ
とで容易に製造できる。エチレンジオキシ基はポリオキ
シアルキレン鎖の2〜40重量%が良く、更に好ましく
は2〜30重量%、最も好ましくは2〜20重量%が良
い。エチレンジオキシ基を含むことにより室温での湿気
硬化速度が著しく改善されて速くなり、しかも耐久性の
低下も小さなものにとどまる。本発明において使用され
るアルキレンオキシドの開環重合で合成されるポリオキ
シアルキレンポリオールは特公昭59−15336、米
国特許435518号、米国特許4721818号に記
載されている方法で合成することができる。これらの方
法で製造されるポリオキシアルキレンポリオールは高分
子量であり、かつ分子遣分布が狭い特徴を有しており、
本発明の湿気硬化性の樹脂組成物の伸びを大きなものと
することができ、好ましい。使用できるアルキレンオキ
シドとしてはエチレンオキシドの他に、好ましくはプロ
ピレンオキシドとブチレンオキシドの少なくとも一種が
用いられる。ポリオキシアルキレンポリオールを製造す
る場合に使用される多価のイニシェークーとしては、多
価アルコール、多価フェノール、ポリアミン、アルカノ
ールアミンなどがある。具体的には、エチレングリコー
ル、ジエチレングリコール、プロピレングリコール、ジ
プロピレングリコール、ネオペンチルグリコール、1.
4−ブタンジオール、1.6−ヘキサンジオール、グリ
セリン、トリメチロールプロパン、ペンタエリスリトー
ル、ジグリセリン、テキストロース、シュークロース、
ビスフェノールA、エチレンジアミンなどがある。これ
らは1種は勿論、2種以上を併用してもよい。特に好ま
しいのは多価アルコール、特に2価および3価アルコー
ルである。ボブオキシアルキレンポリオールは重合触媒
としてアルカリ金属化合物(水酸化アルカリ)などのア
ルカリ触媒を使用してアルキレンオキシドを開始剤存在
下に開環重合させる方法でも一般的に合成されるが、−
水酸基当りの平均分子量が3000を越える場合、副反
応が多くなり、実際的ではなくなるため、本発明の原料
としては適当ではない。The present invention is characterized by containing oxyethylene dioxy groups (-QC:H2CH2) in an amount of 40% by weight or less of the polyether chain; This is achieved by using Such a polyoxyalkylene polyol can be easily produced by using part or all of ethylene oxide during ring-opening polymerization of alkylene oxide in the presence of an initiator. The content of the ethylenedioxy group is preferably 2 to 40% by weight of the polyoxyalkylene chain, more preferably 2 to 30% by weight, and most preferably 2 to 20% by weight. By containing an ethylenedioxy group, the moisture curing rate at room temperature is significantly improved and becomes faster, and the decrease in durability remains small. The polyoxyalkylene polyol synthesized by ring-opening polymerization of alkylene oxide used in the present invention can be synthesized by the method described in Japanese Patent Publication No. 59-15336, US Pat. No. 4,355,18, and US Pat. No. 4,721,818. The polyoxyalkylene polyols produced by these methods have a high molecular weight and a narrow molecular distribution,
This is preferable because the moisture-curable resin composition of the present invention can have a large elongation. In addition to ethylene oxide, at least one of propylene oxide and butylene oxide is preferably used as the alkylene oxide. Polyvalent initiators used in the production of polyoxyalkylene polyols include polyhydric alcohols, polyhydric phenols, polyamines, alkanolamines, and the like. Specifically, ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, neopentyl glycol, 1.
4-butanediol, 1,6-hexanediol, glycerin, trimethylolpropane, pentaerythritol, diglycerin, textulose, sucrose,
These include bisphenol A and ethylenediamine. These may be used alone or in combination of two or more. Particularly preferred are polyhydric alcohols, especially dihydric and trihydric alcohols. Boboxyalkylene polyol is also generally synthesized by ring-opening polymerization of alkylene oxide in the presence of an initiator using an alkali catalyst such as an alkali metal compound (alkali hydroxide) as a polymerization catalyst.
If the average molecular weight per hydroxyl group exceeds 3,000, side reactions will increase, making it impractical and therefore not suitable as a raw material for the present invention.
本発明における加水分解性珪素末端重合体は一般式:
%式%
で示される加水分解性珪素末端基を末端基の50%以上
100%以下有する。式中Rは1価の炭化水素基あるい
はハロゲン化炭化水素基であり、炭素数8以下、好まし
くは6以下のアルキル基やフルオロアルキル基である。The hydrolyzable silicon-terminated polymer in the present invention has 50% or more and 100% or less of the terminal groups represented by the general formula: % Formula %. In the formula, R is a monovalent hydrocarbon group or a halogenated hydrocarbon group, and is an alkyl group or fluoroalkyl group having 8 or less carbon atoms, preferably 6 or less carbon atoms.
特に好ましくはメチル基やエチルである。Xは加水分解
性基であり、たとえばハロゲン原子、アルコキシ基、ア
シルオキシ基、アミド基、酸アミド基、アミノオキシ基
、ケトキシメート基などがある。好ましい加水分解性基
はアルコキシ基、特にメトキシ基やエトキシ基である。Particularly preferred are methyl group and ethyl group. X is a hydrolyzable group, such as a halogen atom, an alkoxy group, an acyloxy group, an amide group, an acid amide group, an aminooxy group, a ketoximate group, and the like. Preferred hydrolyzable groups are alkoxy groups, especially methoxy and ethoxy groups.
Roとしては、炭化水素基特にトリメチレン基が製造上
の容易さから好ましい。aは0,1、あるいは2の整数
を示すものであり、特にOであるか1であるものが好ま
しい。As Ro, a hydrocarbon group, particularly a trimethylene group, is preferable from the viewpoint of ease of production. a represents an integer of 0, 1, or 2, and is particularly preferably O or 1.
[作用]
本発明における加水分解性珪素末端重合体は水分と接触
すると架橋反応により3次元化して硬化する。硬化機構
はまず加水分解性基Xが水酸基で置換され次いでこの5
iOH基同士が縮合して架橋を生じ、シロキサン結合(
SL−0−3L)が形成されるか又は5iOH基とSi
X基との反応でシロキサン結合とHXが形成されて硬化
するかのどちらかである。[Function] When the hydrolyzable silicon-terminated polymer in the present invention comes into contact with moisture, it becomes three-dimensional and hardens through a crosslinking reaction. The curing mechanism is that the hydrolyzable group X is first replaced with a hydroxyl group, and then this 5
iOH groups condense with each other to form crosslinks, forming siloxane bonds (
SL-0-3L) is formed or 5iOH group and Si
Either a siloxane bond and HX are formed by reaction with the X group, and curing occurs.
この時、加水分解速度は大気温度、相対湿度、加水分解
性基の種類等にもよるが、主鎖にオキシエチレン基(−
0−CH,−CH2−)が存在する場合親水性が高くな
ることにより、−層速くなっていると推定される。At this time, the rate of hydrolysis depends on the atmospheric temperature, relative humidity, type of hydrolyzable group, etc., but the oxyethylene group (-
It is presumed that when 0-CH, -CH2-) is present, the hydrophilicity increases, resulting in a -layer speed.
硬化反応にあたっては、硬化促進触媒を使用してらしな
くてもよい。硬化促進触媒としてはアルキルチタン酸塩
、有機珪素チタン酸塩、オクチル酸錫およびジブチル錫
ジラウレート等のごときカルボン酸の金属塩ニジブチル
アミン−2−エチルヘキソエート等の如きアミン塩:な
らびに他の酸性触媒および塩基性触媒を使用しつる。触
媒は重合体の製造の任意の段階で1加しつる。In the curing reaction, it is not necessary to use a curing accelerating catalyst. Curing accelerating catalysts include alkyl titanates, organosilicon titanates, metal salts of carboxylic acids such as tin octylate and dibutyltin dilaurate, amine salts such as nidibutylamine-2-ethylhexoate, and other acids. Using catalysts and basic catalysts. The catalyst can be added at any stage of polymer production.
本発明の重合体には更に必要であれば補強剤、充填剤、
可塑剤、タレ止め剤などを含ませてもよい。補強剤とし
てはカーボンブラック、微粉末シリカなどが、充填剤と
して炭酸カルシウム、タルク、クレイ、シリカなどが、
可塑剤としてはジオクチルフタレート、ジブチルフタレ
ート、ジオクチルアジペート、塩素化パラフィン及び石
油系可塑剤などが、顔料には酸化鉄、酸化クロム、酸化
チタンなどの無機顔料及びフタロシアニンブルー、フタ
ロシアニングリーンなどの有機顔料が、タレ止め剤とし
て有機酸処理炭酸カルシウム、水添ひまし油ステアリン
酸アルミニウム、ステアリン酸カルシウム、ステアリン
酸亜鉛、微粉末シリカなどがあげられる。The polymer of the present invention may further contain reinforcing agents, fillers, if necessary.
A plasticizer, anti-sagging agent, etc. may be included. Carbon black, finely powdered silica, etc. are used as reinforcing agents, and calcium carbonate, talc, clay, silica, etc. are used as fillers.
Plasticizers include dioctyl phthalate, dibutyl phthalate, dioctyl adipate, chlorinated paraffin, and petroleum plasticizers, and pigments include inorganic pigments such as iron oxide, chromium oxide, and titanium oxide, and organic pigments such as phthalocyanine blue and phthalocyanine green. Examples of anti-sagging agents include organic acid-treated calcium carbonate, hydrogenated castor oil aluminum stearate, calcium stearate, zinc stearate, and finely powdered silica.
本発明の珪素末端重合体は、建造物、航空機、自動車等
の被覆組成物および密封組成物またはこれ等の類似物と
して好適に使用する事ができる。The silicon-terminated polymers of the present invention can be suitably used as coating compositions and sealing compositions for buildings, aircraft, automobiles, etc., or the like.
[実施例]
本実施例中、及び比較例中のポリオキシアルキレンポリ
オールはプロピレンオキシド付加触媒としてシアン化コ
バルト亜鉛・グライム錯体及びエチレンオキシド付加触
媒としてナトリウムメトキシドを使用して合成した。[Example] The polyoxyalkylene polyols in Examples and Comparative Examples were synthesized using a cobalt zinc cyanide/glyme complex as a propylene oxide addition catalyst and sodium methoxide as an ethylene oxide addition catalyst.
実施例1
分子量10000、総不飽和度0.020meq/gで
末端にオキシエチレン基を20重量%含むジプロピレン
グリコールを開始剤としたポリオキシプロピレンジオー
ルA100部に水素化ナトリウム0.49部を加え、窒
素気流下100℃で1時間加熱した。これを50℃に冷
却し、アリルクロリド1.68部を加え、6時間加熱・
撹拌した。室温に冷却してからヘキサン300部とケイ
酸マグネシウム1部を加え、室温で30分撹拌し、ろ通
接、ヘキサンを減圧下で留去して、末端不飽和基含有ポ
リオキシアルキレン重合体A′を得た。これの総不飽和
度は0.194meq/gであった。得られた不飽和末
端ポリオキシアルキレン重合体100部にメチルジメト
キシシラン2,1部、塩化白金酸溶1(50,05部(
82PtC1,,6Hz01g/100m1イソプロピ
ルアルコール)を加え、60℃に8時間加熱してから未
反応メチルジメトキシシランを減圧下留去し、末端珪素
変性体を得た。末端珪素変性体100部に硬化触媒とし
てジブチル錫ジラウレート1部を加え、−成分型室温硬
化性組成物A″を得た。Example 1 0.49 parts of sodium hydride was added to 100 parts of polyoxypropylene diol A, which had a molecular weight of 10,000, a total degree of unsaturation of 0.020 meq/g, and had a dipropylene glycol initiator containing 20% by weight of oxyethylene groups at the terminals. , and heated at 100° C. for 1 hour under a nitrogen stream. Cool this to 50°C, add 1.68 parts of allyl chloride, and heat for 6 hours.
Stirred. After cooling to room temperature, 300 parts of hexane and 1 part of magnesium silicate were added, stirred at room temperature for 30 minutes, filtered, and hexane was distilled off under reduced pressure to obtain terminal unsaturated group-containing polyoxyalkylene polymer A. ′ was obtained. The total unsaturation degree of this was 0.194 meq/g. To 100 parts of the obtained unsaturated terminal polyoxyalkylene polymer, 2.1 parts of methyldimethoxysilane and 1 part of chloroplatinic acid solution (50.05 parts) were added.
82PtC1,,6Hz01g/100ml isopropyl alcohol) was added and heated to 60°C for 8 hours, and unreacted methyldimethoxysilane was distilled off under reduced pressure to obtain a silicon-terminated modified product. 1 part of dibutyltin dilaurate as a curing catalyst was added to 100 parts of the silicon-terminated modified product to obtain a -component type room temperature curable composition A''.
実施例2
ジプロピレングリコールを開始剤として、プロピレンオ
キシド、エチレンオキシドを共重合したオキシエチレン
基を50重量%含む分子量2000のポリオキシアルキ
レンジオールを原料として、プロピレンオキシドを付加
重合させ、分子量10000、総不飽和度0.020m
eq/gのポリオキシアルキレンジオールBを得た。ポ
リオキシアルキレンジオールB 100部と水素化ナ
トリウム0.49部を加え、アリルクロリド1,68部
より、実施例1に記載の方法で末端不飽和基含有ポリオ
キシアルキレン重合体B″ 101部を得た。これの総
不飽和度は0.192meq/gであった。このB′1
00部とメチルジメトキシシラン2.1部、塩化白金酸
溶l夜0.05部とから実施例1に記載の方法で末端珪
素・変性体を得、これの100部にジブチル錫ジラウレ
ート1部を加え、−成分型室温硬化性組成物B″を得た
。Example 2 Using dipropylene glycol as an initiator, a polyoxyalkylene diol with a molecular weight of 2,000 containing 50% by weight of oxyethylene groups copolymerized with propylene oxide and ethylene oxide was used as a raw material, and propylene oxide was addition-polymerized to obtain a polyoxyalkylene diol with a molecular weight of 10,000 and total polymerization. Saturation degree 0.020m
eq/g of polyoxyalkylene diol B was obtained. 100 parts of polyoxyalkylene diol B and 0.49 parts of sodium hydride were added, and from 1.68 parts of allyl chloride, 101 parts of terminal unsaturated group-containing polyoxyalkylene polymer B'' was obtained by the method described in Example 1. The total unsaturation degree of this was 0.192 meq/g.
A silicon-terminated modified product was obtained by the method described in Example 1 from 00 parts of methyldimethoxysilane, 2.1 parts of methyldimethoxysilane, and 0.05 parts of chloroplatinic acid solution, and 1 part of dibutyltin dilaurate was added to 100 parts of this. In addition, a -component type room temperature curable composition B'' was obtained.
実施例3
ジプロピレンゲルコールを開始剤とした分子量1000
0、総不飽和度0.020meq/gで末端にオキシエ
チレン基を10重量%含むプロピレンオキシドの重合体
であるポリオキシアルキレンジオールCから実施例1に
記載の方法で末端不飽和基含有ポリオキシアルキレン重
合体C′を得た。Example 3 Molecular weight 1000 using dipropylene gelcol as an initiator
From polyoxyalkylene diol C, which is a polymer of propylene oxide with a total unsaturation degree of 0.020 meq/g and 10% by weight of oxyethylene groups at the terminals, polyoxyalkylene diol C containing terminal unsaturated groups was prepared by the method described in Example 1. An alkylene polymer C' was obtained.
C′からさらに実施例1に従い末端メチルジメトキシシ
リル基を有する末端珪素変性体を得た。末端珪素変性体
100部にジブチル錫ジラウレート1部を加え、−成分
型室温硬化性組成物C″を得た。Further, according to Example 1, a silicon-terminated modified product having a terminal methyldimethoxysilyl group was obtained from C'. 1 part of dibutyltin dilaurate was added to 100 parts of the silicon-terminated modified product to obtain a -component type room temperature curable composition C''.
実施例4
グリセリンを開始剤とした分子量30000 、総不飽
和度0.020meq/gで末端にオキシエチレン基を
l0重量%含む基本的にポリプレピレンオキシドの開環
重合体であるポリオキシアルキレントリオールDから実
施例1に記載の方法で総不飽和度0.095meq/g
の末端不飽和基含有ポリオキシアルキレン重合体D′を
得た。さらに実施例1に記載の方法で末端ジメトキシシ
リル基を有する末端珪素変性体を得た。末端珪素変性体
100部にジブチル錫ジラウレート1部を加え、−成分
型室温硬化性組成物D″を得た。Example 4 Polyoxyalkylene triol, which is basically a ring-opening polymer of polypropylene oxide, has a molecular weight of 30,000, a total unsaturation degree of 0.020 meq/g, and contains 10% by weight of oxyethylene groups at the terminals using glycerin as an initiator. D to total unsaturation 0.095 meq/g by the method described in Example 1
A terminal unsaturated group-containing polyoxyalkylene polymer D' was obtained. Furthermore, by the method described in Example 1, a silicon-terminated modified product having a terminal dimethoxysilyl group was obtained. 1 part of dibutyltin dilaurate was added to 100 parts of the silicon-terminated modified product to obtain a -component type room temperature curable composition D''.
比較例】
ジプロピレングリコールを開始剤として、プロピレンオ
キシドを開環重合させて合成した分子量10000、総
不飽和度0.020meq/gのポリオキシプロピレン
ジオールEから、実施例1に記載の方ン去で総不飽和度
0.093meQ/gの末端不飽和基含有ポリオキシア
ルキレン重合体E′を得、E′から更に実施例1に従い
、末端メチルジメトキシシリル基を有する末端珪素変性
体を得た末端珪素変性体100部にジブチル錫ジラウレ
ート1部を加え、−成分型室温硬化性組成物E″を得た
。Comparative Example: Polyoxypropylene diol E having a molecular weight of 10,000 and a total unsaturation degree of 0.020 meq/g synthesized by ring-opening polymerization of propylene oxide using dipropylene glycol as an initiator was subjected to the method described in Example 1. A terminal unsaturated group-containing polyoxyalkylene polymer E' with a total unsaturation degree of 0.093 meQ/g was obtained, and a terminal silicon modified product having terminal methyldimethoxysilyl groups was obtained from E' according to Example 1. 1 part of dibutyltin dilaurate was added to 100 parts of the silicon modified product to obtain a -component type room temperature curable composition E''.
以上の一成分型室温硬化性組成物の硬化時間、物性、耐
温熱試験の結果を表1に示す。Table 1 shows the curing time, physical properties, and temperature resistance test results of the one-component room-temperature curable composition described above.
表
:室温24時間後のタック
×・・ベトッキ著しく大
0・・ベトッキ著しく小
・破断時伸び(%)
:引張強度(kg/cm2)
:50%モジュラス(kg/am2)
:保持率(初期物性に対する%)
280℃、95%RH2週間後
:50℃、70%RH1週間後
○・・ベトッキ小
[発明の効果]
以上の様に本質的にポリエーテル鎖で末端加水分解性珪
素官能基を有する一成分型室温硬化性組成物でポリエー
テル鎖にオキシエチレン基を含むことにより、硬化が著
しく速くなり、かつ、物性、耐久性も劣らないことが明
らかとなった。このような樹脂は、シーリング材等に有
用である。Table: Tack after 24 hours at room temperature ×...Tackiness is noticeably large 0...Tackiness is noticeably small Elongation at break (%): Tensile strength (kg/cm2): 50% modulus (kg/am2): Retention rate (initial physical properties %) After 2 weeks at 280°C and 95% RH: After 1 week at 50°C and 70% RH... Small [Effect of the invention] As described above, it is essentially a polyether chain with a terminal hydrolyzable silicon functional group. It has been revealed that by including an oxyethylene group in the polyether chain of a one-component room-temperature curable composition, curing is significantly faster, and the physical properties and durability are not inferior. Such resins are useful as sealants and the like.
Claims (1)
で末端部に一般式: ▲数式、化学式、表等があります▼ ただし、Rは1価の炭化水素基あるいは ハロゲン化炭化水素基 Xは加水分解性基 R′は2価の有機基 aは0.1、あるいは2の整数で示される加水分解性珪
素官能基を有する室温硬化性樹脂において、主鎖が本質
的にポリエーテル鎖であり、そのうち2〜40重量%の
オキシエチレン基(−OCH_2CH_2−)を含むこ
とを特徴とする一成分型湿気硬化性樹脂組成物。[Claims] Molecular weight per number of terminal functional groups: 2,000 to 20,000
General formula at the end: ▲There are mathematical formulas, chemical formulas, tables, etc.▼ However, R is a monovalent hydrocarbon group or a halogenated hydrocarbon group X is a hydrolyzable group R' is a divalent organic group a is 0 In a room temperature curable resin having a hydrolyzable silicon functional group represented by an integer of .1 or 2, the main chain is essentially a polyether chain, of which 2 to 40% by weight of oxyethylene groups (-OCH_2CH_2- ) A one-component moisture-curable resin composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17708289A JPH0343449A (en) | 1989-07-11 | 1989-07-11 | One-component type moisture-curing resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17708289A JPH0343449A (en) | 1989-07-11 | 1989-07-11 | One-component type moisture-curing resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0343449A true JPH0343449A (en) | 1991-02-25 |
Family
ID=16024812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17708289A Pending JPH0343449A (en) | 1989-07-11 | 1989-07-11 | One-component type moisture-curing resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0343449A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04145177A (en) * | 1990-10-05 | 1992-05-19 | Dai Ichi Kogyo Seiyaku Co Ltd | Curable coating agent |
US6271333B1 (en) | 1999-04-22 | 2001-08-07 | The Yokohama Rubber Co., Ltd. | One-part moisture curable composition |
WO2012070666A1 (en) * | 2010-11-24 | 2012-05-31 | Kaneka Corporation | Curable composition |
-
1989
- 1989-07-11 JP JP17708289A patent/JPH0343449A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04145177A (en) * | 1990-10-05 | 1992-05-19 | Dai Ichi Kogyo Seiyaku Co Ltd | Curable coating agent |
US6271333B1 (en) | 1999-04-22 | 2001-08-07 | The Yokohama Rubber Co., Ltd. | One-part moisture curable composition |
WO2012070666A1 (en) * | 2010-11-24 | 2012-05-31 | Kaneka Corporation | Curable composition |
US8883936B2 (en) | 2010-11-24 | 2014-11-11 | Kaneka Corporation | Curable composition |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2995568B2 (en) | Manufacture of polyalkylene oxide derivative | |
EP0370463B1 (en) | Two pack type curable composition comprising epoxy resin and silicon-containing elastomeric polymer | |
JP2993778B2 (en) | Room temperature curable composition | |
EP0671437A1 (en) | Curable resin composition | |
US4952643A (en) | Curable polymer composition | |
US5296582A (en) | Curable resin composition | |
JP2000109676A (en) | Curable composition | |
CA1258726A (en) | Curable composition | |
JPH0912861A (en) | Curable composition | |
EP0496109A2 (en) | A process for producing alkoxysilane-terminated polyethers | |
JPH06322251A (en) | Cold-curing composition | |
JP3145022B2 (en) | Curable composition | |
JPH06211981A (en) | New polymer having reactive silicon group and its production | |
JPH0343449A (en) | One-component type moisture-curing resin composition | |
JP3105212B2 (en) | Moisture curable resin composition | |
JP3921739B2 (en) | Room temperature curable composition | |
JP3148105B2 (en) | Room temperature curable composition | |
JPH08134203A (en) | Production of polyalkylene oxide derivative and composition thereof | |
JP3325758B2 (en) | Curable composition | |
JP3151143B2 (en) | Curable composition | |
JPH08283389A (en) | Curable composition | |
JPS6118570B2 (en) | ||
JP3475519B2 (en) | Curable composition | |
JPH10324793A (en) | Room-temperature curable composition | |
JPH0762218A (en) | Room temperature curing composition |