JPH0342717Y2 - - Google Patents

Description

[Detailed description of the invention] [Technical field of the invention] This invention is a cooling system for electronic equipment in which electronic components having multiple heat sources are arranged in a closed housing, such as various control equipment for flying objects. Regarding.

[Technical background of the invention]

Generally, electronic devices for flying objects are usually housed in a sealed flying object body, and control devices that include a large number of electronic components each having a heat source may require cooling. Particularly in recent years, the density of parts has increased, and cooling of parts has become an important issue.

When cooling this type of electronic equipment for flying objects,
Inert pressure gas is often used, and FIG. 2 shows the configuration of a conventional cooling device for electronic equipment. This FIG. 2 is shown as a sectional view.

In FIG. 2, cooling pressure gas 1 is injected from the mother aircraft or ground launcher through a plug provided on the flying object, and is released from a nozzle 3 provided on the side of electronic equipment 2 that requires cooling. In this case, each electronic component 4 is cooled.

The electronic device 2 is composed of electronic components 4 mounted on a component placement board 5 made of a printed wiring board, and the component placement board 5 is fixed to a frame 7 via pillars 6. The frame 7 is the flying object body 8
is attached to the inner wall of the

[Problems with background technology]

In such a conventional nozzle discharge cooling device,
It is difficult to send the necessary cooling pressure gas 1 to all the electronic components 4, and the cooling pressure gas 1 of the same temperature is not sent to each electronic component 4. If the heat generation and shape of the component 4 were taken into consideration when arranging the parts, the wiring would become complicated and a contradiction would occur in which high-density arrangement could not be achieved.

[Purpose of invention]

This idea was made to eliminate the above-mentioned drawbacks of the conventional technology, and it is possible to optimally cool a large number of electronic components that have a heat source inside a closed housing, making it extremely effective for cooling electronic equipment that is becoming increasingly dense. The purpose is to provide a cooling device for.

[Summary of the idea]

The cooling device for electronic equipment of this invention has a group of electronic components having a heat source for the electronic equipment placed inside a closed housing on a placement plate, and a group of holes corresponding to the heat generation amount and shape of each electronic component is formed on this placement plate. At the same time, the arrangement plate is formed into a container shape so as to close off the parts other than the hole group to form a space, and cooling pressurized gas is injected into this space to cool the electronic components to the same temperature through the hole group. This system cools the electronic components by injecting pressurized gas.

[Example of idea]

Embodiments of the cooling device for electronic equipment of this invention will be described below with reference to the drawings. Figure 1 is Part 1
FIG. 2 is a cross-sectional view showing the configuration of an example. In FIG. 1, the reference numeral 11 corresponds to a casing, etc., but the explanation here will refer to the main body of the flying object. A plurality of frames 12a and 12b are attached to the inner surface of the flying object body 11. Component placement plates 14 and 15 (both made of, for example, printed wiring boards) are symmetrically arranged and fixed to the frames 12a and 12b via a plurality of support columns 13a and 13b, respectively.

Electronic component groups 14a and 15a constituting an electronic device are mounted on the component placement boards 14 and 15, respectively. Each of these electronic component groups 14a, 15
In order to release cooling pressure gas corresponding to the calorific value and shape of a, hole groups 14b and 15b each consisting of a plurality of holes are provided at predetermined locations on each of the arrangement plates 14 and 15.
is formed.

Further, rings 16a and 16b are provided at the upper end and bottom of the arrangement plates 14 and 15, respectively, so as to close the hole groups 14b and 15b. The arrangement plates 14, 15 and the rings 16a, 16b form a container shape so that a space 17 is formed in a portion surrounded by the rings 16a, 16b and the arrangement plates 14, 15.

On the other hand, the ring 16a on the upper part of the arrangement plates 14 and 15
The tip of a nozzle 18 is inserted into the nozzle 18, and cooling pressure gas 19 is injected from the opposite side of the nozzle 18.

With this configuration, by injecting the cooling pressure gas 19 into the space 17 through the nozzle 18, the hole group 14b,
Cooling pressure gas 19 of the same temperature is released to the electronic component groups 14a, 15a mounted on the arrangement plates 14, 15 through the electronic component groups 14a, 15b.
Optimal cooling can be performed for a. Note that the parts can be arranged arbitrarily, and high-density arrangement is also possible.

Furthermore, even if there is only one arrangement plate 14, 15, this can be easily accommodated by changing the ring 16b of this embodiment to a case having a bottom plate.

[Effect of idea]

As described above, the electronic device cooling device of this invention can optimally cool a large number of electronic components having a heat source inside a closed housing, and is extremely effective for electronic devices that are becoming more densely packed.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing the structure of an embodiment of the cooling device for electronic equipment of this invention, and FIG. 2 is a sectional view showing the structure of a conventional cooling device for electronic equipment. 11... Flying body body, 12a, 12b... Frame, 13a, 13b... Support column, 14, 15...
Arrangement board, 14a, 15a...Electronic component group, 14
b, 15b... Hole group, 16a, 16b... Ring, 17... Space, 18... Nozzle, 19...
Pressure gas for cooling.

Claims (1)

[Scope of utility model registration request] A placement plate in which a large number of electronic components having heat sources constituting an electronic device are mounted in a closed housing, and a hole group consisting of a plurality of holes corresponding to the heat generation amount and shape of each electronic component is provided; A means for forming a container-like space with this arrangement plate so as to close holes other than the above-mentioned hole group, and a means for injecting cooling pressure gas into the space and passing through the hole group to A cooling device for electronic equipment, comprising a nozzle for discharging a cooling pressure gas having the same temperature as the electronic component.