JPH0342634A - Electrochromic element - Google Patents
Electrochromic elementInfo
- Publication number
- JPH0342634A JPH0342634A JP1175693A JP17569389A JPH0342634A JP H0342634 A JPH0342634 A JP H0342634A JP 1175693 A JP1175693 A JP 1175693A JP 17569389 A JP17569389 A JP 17569389A JP H0342634 A JPH0342634 A JP H0342634A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- layer
- plastic
- moisture
- electrochromic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 89
- 239000004033 plastic Substances 0.000 claims abstract description 31
- 229920003023 plastic Polymers 0.000 claims abstract description 31
- 230000001681 protective effect Effects 0.000 claims abstract description 31
- 239000011521 glass Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 99
- 239000012790 adhesive layer Substances 0.000 claims description 16
- 239000010409 thin film Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000002834 transmittance Methods 0.000 abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 11
- 230000007423 decrease Effects 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 150000002500 ions Chemical class 0.000 description 12
- 230000000903 blocking effect Effects 0.000 description 9
- 238000004040 coloring Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- -1 Hf02Ta20B Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- 229910020187 CeF3 Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910017557 NdF3 Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 102100033491 THO complex subunit 2 Human genes 0.000 description 1
- 101710139407 THO complex subunit 2 Proteins 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 241001105097 Trox Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910001423 beryllium ion Inorganic materials 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はプラスチック基板あるいはプラスチック素子基
板を用いたエレクトロクロミック素子（以下ＥＣ素子と
略称する）に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an electrochromic device (hereinafter abbreviated as EC device) using a plastic substrate or a plastic element substrate.
［従来の技術］
従来のＥＣ素子は第５図に示すような構造であった。図
においで、ガラスからなる素子基板１０１の上には、少
なくとも一方が透明の一対の電極層１０２，１０４とそ
の間に挟まれたＥＣ層３が蒸着によって積層されている
。これらの電極層１０２，１０４及びＥＣ層１０３は非
常に薄く破損変形しやすいため、電極層１０４の外側に
はエポキシ樹脂等からなる接着層１０５を介してガラス
からなる保護基板１０８か貼設されている。[Prior Art] A conventional EC element had a structure as shown in FIG. In the figure, on an element substrate 101 made of glass, a pair of electrode layers 102 and 104, at least one of which is transparent, and an EC layer 3 sandwiched between them are laminated by vapor deposition. Since these electrode layers 102, 104 and EC layer 103 are very thin and easily damaged and deformed, a protective substrate 108 made of glass is attached to the outside of the electrode layer 104 via an adhesive layer 105 made of epoxy resin or the like. There is.
［発明か解決しようとする課題］
しかし、上記のような従来の技術に於いては、ＥＣ素子
のり・半量化を図るためにプラスデック保護基板を用い
ると、ＥＣ素子中の水分が接着層を介して保護基板によ
って吸収・放出され、透過率の変化幅か縮小してしまう
（ＥＣ素子の着消色の濃度差か小さくなる）という問題
点かあった。[Problem to be solved by the invention] However, in the above-mentioned conventional technology, when a plus deck protective substrate is used to reduce the amount of adhesive on the EC element by half, moisture in the EC element can damage the adhesive layer. There was a problem in that the transmittance was absorbed and emitted by the protective substrate, reducing the range of change in transmittance (the difference in density between coloring and decoloring of the EC element became smaller).
水分の放出は、ＥＣ素子を高温環境下に保持した場合に
著しく（６０℃以上の耐熱テストにおいて透過率の変化
幅の減少が顕著）、８０℃、５０時間の耐熱テストでは
ＥＣ素子は殆ど着消色しなくなってしまう。The release of moisture is noticeable when the EC element is kept in a high-temperature environment (the width of change in transmittance decreases markedly in a heat resistance test of 60°C or higher); in a heat resistance test of 80°C for 50 hours, the EC element hardly wears out. The color will no longer fade.
この発明は、かかる点に鑑みてなされたものであり、軽
量でかつ水分量の変化による透過率変化幅の減少を防止
することのてきるＥＣ素子を提供することを目的とする
ものである。The present invention has been made in view of these points, and it is an object of the present invention to provide an EC element that is lightweight and capable of preventing a reduction in the width of change in transmittance due to changes in moisture content.
［課題を解決するための手段］
本発明のＥＣ素子は、素子基板上に、少なくとも一方か
透明な１対の電極層、この１対の電極層の間に形成され
たＥＣ層、接着層及び保護基板か積層されてなるＥＣ素
子であっで、上記目的の達成のために、下記１）又ｉ１
：２）又は３）の構成をなすＥＣ素子である。[Means for Solving the Problems] The EC device of the present invention includes, on the device substrate, a pair of electrode layers, at least one of which is transparent, an EC layer formed between the pair of electrode layers, an adhesive layer, and It is an EC element formed by laminating a protective substrate, and in order to achieve the above purpose, the following 1) or i1
: This is an EC element having the configuration of 2) or 3).
１）素子基板がガラス、保護基板がプラスチックからな
り、接着層と保護基板の間に水分の透過を阻止するブロ
ック層を有する。1) The element substrate is made of glass, the protective substrate is made of plastic, and a block layer is provided between the adhesive layer and the protective substrate to prevent moisture from permeating.
２）素子基板及び保護基板の両方がプラスデックからな
り、電極層と素子基板の間及び接着層と保護基板の間の
少なくとも一方に水分の透過を阻止するブロック層を有
する。2) Both the element substrate and the protective substrate are made of plus deck, and have a block layer for preventing moisture permeation between at least one of the electrode layer and the element substrate and between the adhesive layer and the protective substrate.
３）素子基板がプラスチック、保護基板がガラスからな
り、電極層と素子基板の間に水分の透過を阻止するブロ
ック層を有する。3) The element substrate is made of plastic, the protection substrate is made of glass, and a block layer is provided between the electrode layer and the element substrate to prevent moisture from passing through.
本発明における水分のブロック層を構成するに好ましい
物質の具体例としては、５ｊ０２． へ１２０３Ｓｉ−
八ｌ−０−Ｎ等がある。Specific examples of materials preferable for constituting the moisture blocking layer in the present invention include 5j02. to1203Si-
There are 8l-0-N, etc.
［作 用コ
本発明のＥＣ素子は、素子基板及び保護基板の少なくと
も何れか一方がプラスチックで構成されている。プラス
チック基板はガラス基板に比較して吸水率が大きいとい
う欠点があるが、本発明ではプラスチック基板の内側に
水分の透過を阻止するブロック層を設けているので、Ｅ
Ｃ素子内の水分かプラスチック基板に吸収されて減少す
るのを防止できる。ＥＣ層の着消色反応に関与する水分
量が一定に保たれることにより、はぼ一定の透過率の変
化幅が維持される。[Function] In the EC element of the present invention, at least one of the element substrate and the protective substrate is made of plastic. Plastic substrates have the disadvantage of having a higher water absorption rate than glass substrates, but in the present invention, a block layer is provided inside the plastic substrate to prevent moisture from permeating, so E
It is possible to prevent moisture in the C element from being absorbed by the plastic substrate and being reduced. By keeping the amount of water involved in the coloring/decoloring reaction of the EC layer constant, an approximately constant range of change in transmittance is maintained.
本発明におけるブロック層は、基板を構成するプラスチ
ックより吸水率が小さい物質であれば特に限定されるも
のではないが、薄膜化した場合にもほとんど水分を吸収
・透過しない５ｔ（ｈ、 Ａｌ２Ｏ３，５ｔ−ＡＩ−０
−Ｎ 、 ＧｅＯ２，Ｔｈｏ２． Ｙ２Ｏ３，ＺｒＯ２
，Ｈｆ０２Ｔａ２０Ｂ 、 ＭｇＦ２． ＹＦ３ 、
ＮｄＦ３． Ｌ、ａＦ３． ＣｅＦ３等で構成すること
が望ましい。The block layer in the present invention is not particularly limited as long as it is a material that has a lower water absorption rate than the plastic that constitutes the substrate, but it can be made of 5t (h, Al2O3, 5t), which hardly absorbs or permeates water even when it is made into a thin film. -AI-0
-N, GeO2, Tho2. Y2O3, ZrO2
, Hf02Ta20B, MgF2. YF3,
NdF3. L, aF3. It is preferable to use CeF3 or the like.
ここで、本発明にかかるＥＣ素子の電極及びＥＣ層の構
造について説明する。ＥＣ素子は、面状であり、好まし
い薄膜タイプの構造の一例を示すと、■電極層／ＥＣ層
／イオン導電層／電極層のような４層構造、■電極層／
還元着色型ＥＣ層／イオン導電層／可逆的電解酸化層な
いし酸化着色型ＥＣＣ層重電極層ような５層構造があげ
られる。この場合、電極層は、少なくともいずれか方が
透明でなければならない。Here, the structure of the electrode and EC layer of the EC element according to the present invention will be explained. The EC element has a planar shape, and examples of preferable thin film type structures include: ■4-layer structure such as electrode layer/EC layer/ion conductive layer/electrode layer; ■electrode layer/
Examples include a five-layer structure such as a reduction colored EC layer/ion conductive layer/reversible electrolytic oxidation layer or oxidation colored ECC layer and a heavy electrode layer. In this case, at least one of the electrode layers must be transparent.
透明電極の材料としては、例えば５ｎ０２ 、 Ｉｎ２
０３ＩＴＯなどが使用される。不透明な電極材料として
は、へ１．へｇ、八ｕ、ステンレス等である。不透明な
電極は成用層を兼用していてもよい。このような電極層
は、一般には真空蒸着、イオンブレーティング、スパッ
タリングなどの真空薄膜形成技術で形成される。Examples of materials for the transparent electrode include 5n02 and In2.
03ITO etc. are used. Examples of opaque electrode materials include 1. Heg, 8u, stainless steel, etc. The opaque electrode may also serve as a layer. Such an electrode layer is generally formed by vacuum thin film forming techniques such as vacuum evaporation, ion blasting, and sputtering.
（還元着色性）ＥＣ層としては一般にＷＯ３，ＭＯ０３
などがイ吏用される。(Reduction coloring property) EC layer is generally WO3, MO03
etc. are used.
イオン導電層としては、例えは酸化ケイ素、酸化タンタ
ル、酸化チタン、酸化アルミニウム、酸化ニオブ、酸化
ジルコニウム、酸化ハフニウム、酸化ランタン、フッ化
マグネシウムなとか使用される。As the ion conductive layer, for example, silicon oxide, tantalum oxide, titanium oxide, aluminum oxide, niobium oxide, zirconium oxide, hafnium oxide, lanthanum oxide, and magnesium fluoride are used.
これらの物質薄膜は製造方法により電子に対して絶縁体
であるが、プロトン（Ｈ”）およびヒドロキシイオン（
ＯＨ−）に対しては良導体となる。ＥＣ層の着色消色反
応にはカヂオンが必要とされ、Ｈ′″イオンやＬ１′″
イオンをＥＣ層その他に含有させる必要がある。Ｈ“イ
オンは初めからイオンである必要はなく、電圧か印加さ
れたときにＨ′″イオンか生しれはよく、従ってＨ１イ
オンの代わりに水を含有させてもよい。この水は非常に
少なくて十分てあり、しはしは、大気中から自然に侵入
をする水分ても着消色する。Although thin films of these materials are insulators with respect to electrons due to the manufacturing method, they also contain protons (H”) and hydroxy ions (
It is a good conductor for OH-). Cation is required for the coloring and decoloring reaction of the EC layer, and H''' ions and L1'''
It is necessary to incorporate ions into the EC layer and other parts. The H" ions do not need to be ions from the beginning; H'" ions may be formed when a voltage is applied, and therefore water may be contained in place of the H1 ions. This water is very small, but it is enough, and the water that naturally enters from the atmosphere will also change and fade the color.
ＥＣ層とイオン導電層とは、どちらを上にしても下にし
てもよい。さらにＥＣ層に対して間にイオン導電層を挟
んで可逆的電解酸化層ないし酸化着色型ＥＣ層又は触媒
層を配設してもよい。このような層としては、例えは酸
化ないし水酸化イリジウム、同しくニッケル、同しくク
ロム、同じくバナジウム、同じくルテニウム、同じくロ
ジウムなどかあげられる。The EC layer and the ion conductive layer may be placed either side up or down. Furthermore, a reversible electrolytic oxidation layer, an oxidation-colored EC layer, or a catalyst layer may be provided to the EC layer with an ion conductive layer interposed therebetween. Examples of such layers include iridium oxide or hydroxide, nickel, chromium, vanadium, ruthenium, rhodium, and the like.
これらの物質は、イオン導電層又は透明電極中に分散さ
れていても良いし、それらの構成物質を分散して含有し
ていてもよい。These substances may be dispersed in the ion conductive layer or the transparent electrode, or their constituent substances may be dispersed and contained.
このようなＥＣ素子に１〜３ホルト程度の直流電圧を印
加すると徐々に着色され、同程度の逆電圧を印加すると
消色され、その結果、ＥＣ素子の透過率又は反射率を変
化させることができる。When a DC voltage of about 1 to 3 volts is applied to such an EC element, it gradually becomes colored, and when a reverse voltage of the same level is applied, the color disappears, and as a result, the transmittance or reflectance of the EC element cannot be changed. can.
［実施例〕
第１図は本発明の第１の実施例を示す断面図である。本
実施例では、まず所定の曲率を有するガラス素子基材１
（平板であっても良い）の凹面上に透明電極層２．Ｅ
Ｃ層３．透明電極層４を順次蒸着して積層した。本実施
例においては透明電極層２．４はＩＴＯ（ＳｎＯ２等て
も良い）で構成し、ＥＣ層３は酸化発色型ＥＣ層／誘電
体層／還元発色型ＥＣ層の３層構造（図ではＥＣＣｓ２
Ｏ積層構造は省略している）、具体的にはＴｒＯｘ／Ｔ
ａ２０５／ＷＯ３の３層構造とした。電極層２．４は必
ずしも両方とも透明電極とする必要はなく、上部電極層
４を金属層として反射型ＥＣ素子としても良い。また、
ＥＣ層の構造も上記の３層構造以外てあっても良い。[Embodiment] FIG. 1 is a sectional view showing a first embodiment of the present invention. In this example, first, a glass element base material 1 having a predetermined curvature is used.
Transparent electrode layer 2 on the concave surface (which may be a flat plate). E
C layer 3. Transparent electrode layers 4 were sequentially deposited and laminated. In this embodiment, the transparent electrode layer 2.4 is made of ITO (SnO2, etc. may also be used), and the EC layer 3 has a three-layer structure of an oxidation coloring type EC layer/dielectric layer/reduction coloring type EC layer (in the figure). ECCs2
O stacked structure is omitted), specifically TrOx/T
It had a three-layer structure of a205/WO3. Both of the electrode layers 2.4 do not necessarily have to be transparent electrodes, and the upper electrode layer 4 may be a metal layer to form a reflective EC element. Also,
The structure of the EC layer may also be other than the above three-layer structure.
方、ポリカーボネート（ＰＣ）からなるプラスデック保
護基板７の内側の面（凸面）には、ＳｉＯ２を蒸着する
ことによって予め水分のブロック層６ｂを形成しておき
、ブロック層６ｂ形成面を内側にしてエポキシ接着層５
を介して保護基板７を透明電極層４の凹面に貼設した。On the other hand, on the inner surface (convex surface) of the plus deck protective substrate 7 made of polycarbonate (PC), a moisture blocking layer 6b is formed in advance by vapor depositing SiO2, and the surface on which the block layer 6b is formed is placed inside. Epoxy adhesive layer 5
A protective substrate 7 was attached to the concave surface of the transparent electrode layer 4 via a .
保護基板７を構成するプラスチックとしては、ＰＣの他
にも、ポリメチルメタクリレ−１−（ＰＭＭＡ）、ジエ
チレングリコールビスアリルポリカーボネート（商品名
ＣＲ３Ｂ、 ビービージー社製）を重合して得られる
もの等か好ましく使用される。また、ブロック層６ｂも
５ｉ０２（７）他ニＡｌ２Ｏ３，５ｉＡＩ−０−Ｎ等で
構成しても良く、真空蒸着、スパッタリング等によって
形成する以外に、プラスチック保護基板７表面にセラく
ツク等の粉末を塗布することによって形成しても良い。In addition to PC, plastics constituting the protective substrate 7 include those obtained by polymerizing polymethylmethacrylate-1-(PMMA), diethylene glycol bisallyl polycarbonate (trade name: CR3B, manufactured by BBG), etc. Preferably used. Further, the block layer 6b may also be composed of 5i02(7), Al2O3, 5iAI-0-N, etc., and instead of being formed by vacuum evaporation, sputtering, etc., powder such as ceramics is applied to the surface of the plastic protection substrate 7. It may also be formed by coating.
以上のようにして作製した透過型ＥＣ素子を温度８０℃
の条件て５ｏ時間の耐熱テストを行なったところ、試験
前後において透過率変化幅に差はなく、加熱によるＥＣ
素子の劣化は認められなかった。The transmission type EC element manufactured as described above was heated to 80°C.
When we conducted a heat resistance test for 5 hours under the following conditions, there was no difference in the transmittance change width before and after the test, and the EC
No deterioration of the element was observed.
また、本実施例のＥＣ素子は、ＥＣ素子の構成部材の中
で大きな重量比を占める素子基板と保護基板のうち保護
基板がプラスデックで構成されているので、素子基板、
保護基板ともガラス基板て構成する場合に比べて素子全
体の重量を約２５９６程度削減することができた。Furthermore, in the EC element of this embodiment, the element substrate and the protective substrate account for a large weight ratio among the constituent members of the EC element, and the protective substrate is made of a plus deck.
Compared to the case where both the protective substrate and the protective substrate are glass substrates, the weight of the entire device can be reduced by about 2596 kg.
第２図は本発明の第２の実施例を示す断面図てある。本
実施例ては素子基板９．保護基板７の両方ともＰＣ等の
プラスチンつて構成した。所定の曲率のプラスチック素
子基板９の凹面上に、ＳｉＬ等からなる水分のブロック
層６ａを蒸着あるＵ）は塗布等によって薄膜状に形成し
、このプロ・ンク層６ａ上に透明電極層２．ＥＣ層３．
透明電極層４を積層した。電極層２．４及びＥＣ層の構
造は第１実施例と同様である。そしで、電極層４の外側
には水分のブロック層６ｂを蒸着又は塗布したフラスチ
ック保護基板７をエポキシ接着層５を介して貼設した。FIG. 2 is a sectional view showing a second embodiment of the invention. In this embodiment, the element substrate 9. Both of the protective substrates 7 were made of plastic such as PC. On the concave surface of the plastic element substrate 9 having a predetermined curvature, a moisture blocking layer 6a made of SiL or the like is formed by vapor deposition.U) is formed into a thin film by coating or the like, and a transparent electrode layer 2. EC layer 3.
A transparent electrode layer 4 was laminated. The structures of the electrode layer 2.4 and the EC layer are the same as in the first embodiment. Then, on the outside of the electrode layer 4, a plastic protection substrate 7 on which a moisture blocking layer 6b was vapor-deposited or coated was attached via an epoxy adhesive layer 5.
このようにして構成した透過型ＥＣ素子についで、第１
の実施例と同様に耐熱テストを行なったところ、試験前
後において透過率変化幅に差はなく、加熱によるＥＣ素
子の劣化は誌められなかった。Next to the transmission type EC element constructed in this way, the first
When a heat resistance test was conducted in the same manner as in Example 1, there was no difference in the width of change in transmittance before and after the test, and no deterioration of the EC element due to heating was observed.
また、木実施例においては素子基板、保護基板が両方と
もプラスチンつて構成されているので、素子基板、保護
基板をガラス基板て構成する場合に比へて素子全体の重
量を約５０零程度削減することかできた。In addition, in the wooden embodiment, since both the element substrate and the protection substrate are made of plastic, the weight of the entire element is reduced by approximately 50% compared to the case where the element substrate and the protection substrate are made of glass substrates. I was able to do something.
第３図は本発明の第３の実施例を示す断面図である。本
実施例では、素子基板９．保護基板７ともプラスチック
基板を用い、保護基板７とエポキシ樹脂からなる接着層
５との間に水分のブロック層６ｂを設ｉ−１ない以外は
、第２実施例と同様な構成とした。FIG. 3 is a sectional view showing a third embodiment of the present invention. In this embodiment, the element substrate 9. The structure was the same as that of the second embodiment except that a plastic substrate was used for both the protective substrate 7 and a moisture blocking layer 6b was not provided between the protective substrate 7 and the adhesive layer 5 made of epoxy resin.
木実施例のＥＣ素子は、素子基板９．保護基板７の両方
をプラスチンつて構成しているのに対しで、素子基板９
にしか水分のブロック層６ａを設けていないが、第１及
び第２実施例と同様に耐熱テストを行なったところ、水
分のブロック層を全く設４−］ない従来の場合に比へて
ＥＣ素子の透過率変化幅の縮小の程度は僅かであった。The EC device of the wooden embodiment has an element substrate 9. While both of the protective substrate 7 are made of plastic, the element substrate 9
Although the moisture blocking layer 6a is only provided in the EC element, when a heat resistance test was conducted in the same manner as in the first and second embodiments, the EC element was The degree of reduction in the width of transmittance change was slight.
また、本実施例の場合も第２実施例と同様に、素子全体
の重量はガラス基板を用いる場合に比較して約５０＊程
度削減することがてきた。Also, in the case of this embodiment, as in the second embodiment, the weight of the entire device was reduced by about 50* compared to the case of using a glass substrate.
第４図は本発明の第４実施例を示す断面図である。本実
施例においては、第１図に示された実施例とは逆に素子
基板９をプラスチンつで、保護基１
板８をガラスて構成した。プラスチ・ンク素子基板９の
内側には第３図の場合と同様に水のブロック層６ａを形
成し、その上に上述した実施例と同様に電極層２．ＥＣ
層、電極層４を積層した。そして電極層４の外側に、接
着層５を介してガラス保護基板８を貼設した。ガラスは
水分を吸収・透過しないので、接着層５と保護基板との
間にはブロック層は設けなかった。FIG. 4 is a sectional view showing a fourth embodiment of the present invention. In this embodiment, contrary to the embodiment shown in FIG. 1, the element substrate 9 was made of plastic, and the protective substrate 1 and plate 8 were made of glass. A water blocking layer 6a is formed on the inside of the plastic element substrate 9 as in the case of FIG. 3, and an electrode layer 2. EC
The electrode layer 4 was laminated. Then, a glass protection substrate 8 was attached to the outside of the electrode layer 4 with an adhesive layer 5 interposed therebetween. Since glass does not absorb or transmit moisture, no blocking layer was provided between the adhesive layer 5 and the protective substrate.
このように構成したＥＣ素子についで、上記の実施例と
同様に耐熱テストを行なったところ、ＥＣ素子の透過率
変化幅は変化せず、耐熱テストによる劣化は認められな
かった。When the EC element constructed in this way was subjected to a heat resistance test in the same manner as in the above embodiment, the transmittance change width of the EC element did not change, and no deterioration was observed due to the heat resistance test.
また、ＥＣ素子全体の重量は第１の実施例と同様に素子
基板、保護基板ともガラスで構成した場合に比べて約２
５＊程度削減できた。Furthermore, the weight of the entire EC element is approximately 2 times larger than that in the case where both the element substrate and the protective substrate are made of glass, as in the first embodiment.
We were able to reduce the amount by about 5*.
［発明の効果コ
以上のように、本発明によるＥＣ素子は素子基板または
保護基板の少なくとも一方かプラスチックで構成され、
かつプラスチック基板の内側に水分の透過を阻止するブ
ロック層が設りられている２
ので、ＥＣ素子の着消色に関与する水分がプラスチック
基板によって吸収放出されることがなく、加熱時におい
てもほぼ一定の水分量が保たれる。[Effects of the Invention] As described above, the EC element according to the present invention includes at least one of the element substrate and the protective substrate made of plastic,
In addition, a block layer is provided on the inside of the plastic substrate to prevent moisture from permeating2. Therefore, the moisture involved in coloring and decoloring the EC element is not absorbed or released by the plastic substrate, and almost no moisture is absorbed during heating. A constant amount of moisture is maintained.
即ち、本発明のＥＣ素子は、軽量であるとともに、水分
量の減少によって透過率の変化幅が小さくなってしまう
ことがなく、高温環境下にあっても良好な着消色特性を
確保することかてきるという優れた効果を有するもので
ある。In other words, the EC element of the present invention is lightweight, does not reduce the range of change in transmittance due to a decrease in water content, and maintains good coloring and fading characteristics even in a high-temperature environment. It has an excellent effect of being effective.
第１図は本発明の第１実施例を示す断面図、第２図は本
発明の第２実施例を示す断面図、第３図は本発明の第３
実施例を示す断面図、第４図木発明の第４実施例を示す
断面図、第５図は従来例を示す断面図である。
［主要部分の符号の説明］
１・・・・・・・・・・・・・・・ガラス素子基板２．
４・・・・・・・・・電極層
３・・・・・・・・・・・・・・・ＥＣ層５・・・・・
・・・・・・・・・・接着層６ａ、６ｂ・・・水分のブ
ロック層FIG. 1 is a sectional view showing a first embodiment of the invention, FIG. 2 is a sectional view showing a second embodiment of the invention, and FIG. 3 is a sectional view showing a third embodiment of the invention.
FIG. 4 is a sectional view showing the fourth embodiment of the invention, and FIG. 5 is a sectional view showing the conventional example. [Explanation of symbols of main parts] 1...Glass element substrate 2.
4... Electrode layer 3... EC layer 5...
......Adhesive layers 6a, 6b...moisture blocking layer
Claims (4)
極層、該１対の電極層の間に形成されたエレクトロクロ
ミック層、接着層及び保護基板が積層されてなるエレク
トロクロミック素子において、 前記素子基板がガラスで、前記保護基板がプラスチック
で構成されるとともに、前記接着層と保護基板の間に水
分の透過を阻止するブロック層が設けられたことを特徴
とするエレクトロクロミック素子。(1) In an electrochromic element in which a pair of electrode layers, at least one of which is transparent, an electrochromic layer formed between the pair of electrode layers, an adhesive layer, and a protective substrate are laminated on an element substrate, An electrochromic device, characterized in that the device substrate is made of glass, the protection substrate is made of plastic, and a block layer for preventing moisture from permeating is provided between the adhesive layer and the protection substrate.
極層、該１対の電極層の間に形成されたエレクトロクロ
ミック層、接着層及び保護基板が積層されてなるエレク
トロクロミック素子において、 前記素子基板及び前記保護基板がプラスチックで構成さ
れるとともに、前記電極層と素子基板の間及び前記接着
層と保護基板の間の少なくとも一方に水分の透過を阻止
するブロック層が設けられたことを特徴とするエレクト
ロクロミック素子。(2) In an electrochromic device in which a pair of electrode layers, at least one of which is transparent, an electrochromic layer formed between the pair of electrode layers, an adhesive layer, and a protective substrate are laminated on the device substrate, The element substrate and the protective substrate are made of plastic, and a block layer is provided between the electrode layer and the element substrate and at least one of the adhesive layer and the protective substrate to prevent moisture from permeating. Characteristic electrochromic element.
極層、該１対の電極層の間に形成されたエレクトロクロ
ミック層、接着層及び保護基板が積層されてなるエレク
トロクロミック素子において、 前記素子基板がプラスチックで、前記保護基板がガラス
で構成されるとともに、前記電極層と素子基板の間に水
分の透過を阻止するブロック層が設けられたことを特徴
とするエレクトロクロミック素子。(3) In an electrochromic device in which a pair of electrode layers, at least one of which is transparent, an electrochromic layer formed between the pair of electrode layers, an adhesive layer, and a protective substrate are laminated on the device substrate, An electrochromic device characterized in that the device substrate is made of plastic, the protection substrate is made of glass, and a block layer for preventing moisture from permeating is provided between the electrode layer and the device substrate.
特徴とする請求項１又は２又は３のエレクトロクロミッ
ク素子。(4) The electrochromic device according to claim 1, wherein the block layer is made of a ceramic thin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1175693A JP2787086B2 (en) | 1989-07-10 | 1989-07-10 | Electrochromic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1175693A JP2787086B2 (en) | 1989-07-10 | 1989-07-10 | Electrochromic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0342634A true JPH0342634A (en) | 1991-02-22 |
| JP2787086B2 JP2787086B2 (en) | 1998-08-13 |
Family
ID=16000593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1175693A Expired - Fee Related JP2787086B2 (en) | 1989-07-10 | 1989-07-10 | Electrochromic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2787086B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5471554A (en) * | 1993-11-12 | 1995-11-28 | Ppg Industries, Inc. | Primer for electrochromic device with plastic substrate |
| US5471338A (en) * | 1993-11-12 | 1995-11-28 | Ppg Industries, Inc. | Electrochromic device with plastic substrate |
| US5520851A (en) * | 1993-11-12 | 1996-05-28 | Ppg Industries, Inc. | Iridium oxide film for electrochromic device |
| US5798860A (en) * | 1996-01-16 | 1998-08-25 | Ppg Industries, Inc. | Iridium oxide film for electrochromic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6118925A (en) * | 1984-07-06 | 1986-01-27 | Seiko Epson Corp | Display device |
-
1989
- 1989-07-10 JP JP1175693A patent/JP2787086B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6118925A (en) * | 1984-07-06 | 1986-01-27 | Seiko Epson Corp | Display device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5471554A (en) * | 1993-11-12 | 1995-11-28 | Ppg Industries, Inc. | Primer for electrochromic device with plastic substrate |
| US5471338A (en) * | 1993-11-12 | 1995-11-28 | Ppg Industries, Inc. | Electrochromic device with plastic substrate |
| US5520851A (en) * | 1993-11-12 | 1996-05-28 | Ppg Industries, Inc. | Iridium oxide film for electrochromic device |
| US5618390A (en) * | 1993-11-12 | 1997-04-08 | Ppg Industries, Inc. | Iridium oxide film for electrochromic device |
| US5798860A (en) * | 1996-01-16 | 1998-08-25 | Ppg Industries, Inc. | Iridium oxide film for electrochromic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2787086B2 (en) | 1998-08-13 |
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