JPH0341959U - - Google Patents
Info
- Publication number
- JPH0341959U JPH0341959U JP10218389U JP10218389U JPH0341959U JP H0341959 U JPH0341959 U JP H0341959U JP 10218389 U JP10218389 U JP 10218389U JP 10218389 U JP10218389 U JP 10218389U JP H0341959 U JPH0341959 U JP H0341959U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- semiconductor chip
- bead member
- base
- main parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011324 bead Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10218389U JPH0341959U (US06650917-20031118-M00005.png) | 1989-08-31 | 1989-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10218389U JPH0341959U (US06650917-20031118-M00005.png) | 1989-08-31 | 1989-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0341959U true JPH0341959U (US06650917-20031118-M00005.png) | 1991-04-22 |
Family
ID=31651094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10218389U Pending JPH0341959U (US06650917-20031118-M00005.png) | 1989-08-31 | 1989-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341959U (US06650917-20031118-M00005.png) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62189706A (ja) * | 1986-02-14 | 1987-08-19 | Murata Mfg Co Ltd | チツプコイルの実装方法 |
| JPS6376757A (ja) * | 1986-09-05 | 1988-04-07 | フォルシュングスツエントルム・ユーリッヒ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | 熱的高負荷の冷却要素の製造方法 |
| JPS6431126A (en) * | 1987-07-28 | 1989-02-01 | Optrex Kk | Terminal connecting structure |
-
1989
- 1989-08-31 JP JP10218389U patent/JPH0341959U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62189706A (ja) * | 1986-02-14 | 1987-08-19 | Murata Mfg Co Ltd | チツプコイルの実装方法 |
| JPS6376757A (ja) * | 1986-09-05 | 1988-04-07 | フォルシュングスツエントルム・ユーリッヒ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | 熱的高負荷の冷却要素の製造方法 |
| JPS6431126A (en) * | 1987-07-28 | 1989-02-01 | Optrex Kk | Terminal connecting structure |
