JPH0341937U - - Google Patents
Info
- Publication number
- JPH0341937U JPH0341937U JP10231689U JP10231689U JPH0341937U JP H0341937 U JPH0341937 U JP H0341937U JP 10231689 U JP10231689 U JP 10231689U JP 10231689 U JP10231689 U JP 10231689U JP H0341937 U JPH0341937 U JP H0341937U
- Authority
- JP
- Japan
- Prior art keywords
- main board
- bonding section
- semiconductor circuit
- pattern
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10231689U JPH0341937U (da) | 1989-08-31 | 1989-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10231689U JPH0341937U (da) | 1989-08-31 | 1989-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0341937U true JPH0341937U (da) | 1991-04-22 |
Family
ID=31651219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10231689U Pending JPH0341937U (da) | 1989-08-31 | 1989-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341937U (da) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001357375A (ja) * | 2000-06-14 | 2001-12-26 | Dainippon Printing Co Ltd | 板状枠体付きｉｃキャリア |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057152B2 (ja) * | 1978-03-15 | 1985-12-13 | 株式会社日立製作所 | 磁気テ−プ再生装置 |
| JPS6175986A (ja) * | 1984-09-21 | 1986-04-18 | Tokyo Jiki Insatsu Kk | 集積回路素子装着媒体 |
| JPS6255196A (ja) * | 1985-09-05 | 1987-03-10 | シャープ株式会社 | Ｉｃカ−ド |
| JPH02233298A (ja) * | 1989-03-07 | 1990-09-14 | Fujitsu Ltd | Ｉｃカード |
-
1989
- 1989-08-31 JP JP10231689U patent/JPH0341937U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057152B2 (ja) * | 1978-03-15 | 1985-12-13 | 株式会社日立製作所 | 磁気テ−プ再生装置 |
| JPS6175986A (ja) * | 1984-09-21 | 1986-04-18 | Tokyo Jiki Insatsu Kk | 集積回路素子装着媒体 |
| JPS6255196A (ja) * | 1985-09-05 | 1987-03-10 | シャープ株式会社 | Ｉｃカ−ド |
| JPH02233298A (ja) * | 1989-03-07 | 1990-09-14 | Fujitsu Ltd | Ｉｃカード |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001357375A (ja) * | 2000-06-14 | 2001-12-26 | Dainippon Printing Co Ltd | 板状枠体付きｉｃキャリア |
| JP4580509B2 (ja) * | 2000-06-14 | 2010-11-17 | 大日本印刷株式会社 | カード固定台紙に固定された板状枠体付きｉｃキャリア |