JPH0341808A - Manufacture of piezoelectric resonance part - Google Patents

Abstract

PURPOSE:To prevent leakage of vibration of a piezoelectric ceramics while break of the piezoelectric board is hardly caused by adhering an insulation board to the piezoelectric board of plural energy confinement resonance units so as to form a laminate board and cutting the board with a half thickness from the piezoelectric board side. CONSTITUTION:Three energy confinement type resonance units 12-14 are provided to an upper face of a piezoelectric board 11 made of a piezoelectric ceramics and common resonance electrodes 12c-14c are formed to the rear side of each resonance electrode region. Then the board 11 is adhered to an insulation board 15 (glass) to form an adhered laminate board 17, plural recessed parts are formed to the upper face of the insulation board 15 to provide a space not to disturb the resonance of the resonance units 12-14. Then slits 18, 19 equivalent to the thickness of the piezoelectric board 11 are formed to the piezoelectric board side of the board 17 to form split piezoelectric board units 11a-11c. Then an insulation board of the same structure as the insulation board 15 is adhered to the upper face of the board 17 with upside down. Thus, since the resonance units 12-14 are separated by the slits 18, 19, the vibration leakage among the units is prevented and no break is caused to the piezoelectric board 11.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a piezoelectric resonant component in which a plurality of energy trapping type piezoelectric resonators are connected, and in particular, to This relates to an improved processing process to prevent vibration leakage.

[Conventional technology]

An example of a conventional piezoelectric resonant component will be described with reference to FIG. On the piezoelectric plate 1, resonant electrodes 2a, 2b.

3a and 3b are formed. On the lower surface of the piezoelectric plate 1, common resonance electrodes are formed in areas facing the front and back sides of the resonance electrodes 2a to 3b, respectively.Therefore, the piezoelectric plate 1 is configured with two energy trapping type resonance units 2.3. ing.

The resonant i-poles 2a and 3a connect the terminal voltage i through the conductive pattern.
4 and 5. Further, a capacitor electrode 6 is connected to the resonance electrodes 2b and 3b via a conductive pattern. A capacitor electrode for taking out the capacitance is also formed on the lower surface of the piezoelectric plate 1 at a position opposite to the capacitor electrode 6, and the capacitor electrode on the lower surface side is connected to the piezoelectric plate 1.
It is led out to a terminal electrode formed on the edge of the

A circuit diagram of the piezoelectric resonant component shown in FIG. 2 is shown in FIG.

As is clear from Fig. 3, two resonant units 2.3
are connected to form a filter.

By the way, in the piezoelectric resonant component shown in FIG. 2, a slind door is formed extending from one edge of the piezoelectric plate (2) toward the area between the resonant units 2.3. The slit 7 is provided to prevent vibrations from leaking between the resonance units 2 and 3.

[Technical problem to be solved by the invention] In manufacturing the piezoelectric resonant component described above, there was a problem in that the piezoelectric plate 1 tends to crack when forming the slit 7 in the piezoelectric plate 1 by machining. . Moreover, even if a slind door could be formed, the strength of the piezoelectric plate 1 would be reduced, and damage would tend to occur during assembly. Therefore, both resonant units 2. ．． Although this method has the advantage of being able to prevent vibration leakage between the two, it is difficult to mass-produce it.

Furthermore, although the slit 7 extends from one end of the piezoelectric 4N 1 to between the resonant units 2.3, it does not completely separate the resonant units 2.3. Therefore,
It is inevitable that some vibration leakage occurs between the resonance units 2 and 3, and therefore some deterioration in characteristics has to be accepted.

An object of the present invention is to provide a method for manufacturing a piezoelectric resonant component in which a plurality of energy trapping type resonant units are connected, which prevents damage to the piezoelectric plate and reduces vibration between the connected resonant units. An object of the present invention is to provide a method of manufacturing a piezoelectric resonant component that can reliably prevent leakage.

[Means for solving technical problems]

The present invention provides a plurality of piezoelectric resonant units of energy confinement type.
), which provides a method for manufacturing a piezoelectric resonant component having a structure in which a plurality of energy confinement type resonant units are formed by forming resonant electrodes on both principal surfaces. The present invention is characterized by comprising steps of attaching an insulating plate to a piezoelectric plate to obtain a laminated substrate, and half-cutting the N-laminated substrate from the piezoelectric plate side in a region between a plurality of resonant units.

[Effect]

By half-cutting the piezoelectric plate supported by the insulating plate from the piezoelectric plate side, the plurality of piezoelectric resonance units are separated. In other words, since the piezoelectric plate is processed while being supported by an insulating plate, cracks and chips are less likely to occur during half-cutting, and since the piezoelectric plate is being half-cut while being supported by an insulating plate, It is also possible to reliably separate the resonant units connected at the piezoelectric plate portion, thereby effectively preventing leakage of vibration between the resonant units.

[Explanation of Examples]

Hereinafter, an embodiment of the method for manufacturing a piezoelectric resonant component of the present invention will be described with reference to the drawings.

First, as shown in FIGS. 4(a) and 4(b), a piezoelectric plate 11 having resonance electrodes formed on both principal surfaces is prepared. In addition, in FIG. 4(b), the conductive bag formed on the lower surface is shown as seen from the upper surface side. Pressure'1Jjill
is made of piezoelectric ceramic socks, and has a resonant electrode 1 on the top surface.
2a, 12b, 13a, 13b, 14a, and 14b are formed.

The resonance electrodes 12a and 12b are provided to configure the energy confinement type resonance unit 12,
A common resonant electrode 12c shown in FIG. 4(b) is formed on the back surface of the region where the resonant electrodes 12a, 12b are provided.

Similarly, a common resonance electrode 13c is formed on the back surface of the region where the resonance electrodes 13a and 13b are formed, thereby forming the resonance unit 13. In addition, the resonant electrodes 14a, 1
A common resonant electrode 1 is provided on the back surface of the region where the electrode 4b is formed.
4c is formed, thereby resonating UniSoto 14
is configured.

The three energy-trapped pressure-type resonant units are electrically connected to each other by conductive patterns 21 and 22.

Further, the resonant electrodes 12a and 14b are respectively connected to the piezoelectric plate 1
Input/output terminal electrode 23.2 formed along the edge of 1
4 via a conductive pattern.

Next, the piezoelectric substrate 11 is attached to an insulating plate 15 having the same planar shape as shown in FIG. 5 to obtain a laminated substrate.

The insulating sheath 15 is preferably made of an insulating material such as aluminum, ferrite, or glass, and has relatively high rigidity.

A plurality of recesses 16 are formed on the upper surface of the insulating plate 15 . Each recess 16 is provided to provide a space for not interfering with resonance of the resonance units 12 to 14 when attached to the piezoelectric plate 11.

Next, as shown in FIG. 1, slots 7) 18 and 19 are formed on the piezoelectric plate side of the multilayer N substrate 17 to divide it into a plurality of piezoelectric plate units lla, llb, and lie. This slit 18
．． 19 is formed by attaching the piezoelectric plate 11 to the insulating plate 15, and then attaching the resonant units 12, 13, 14 on the piezoelectric plate 11 side.
It is formed by making a half cut in between. In this embodiment, the depth of the slits 18 and 19 is the same as that of the piezoelectric plate 11.
The depth is said to be equivalent to the thickness of the

By forming slits 18 and 19, the resonant electrode 1
The conductive pattern 21 formed near the edge of the piezoelectric plate 11 electrically connected to the piezoelectric plates 2b and 13b is divided, and the terminal electrodes 21a and 21b are connected to each piezoelectric plate unit 11.
It is featured in a part of the corner of a and 11b. Similarly,
A terminal electrode 22a is electrically connected to the resonant electrodes 13a and 14a.

22b is formed at a portion of the corner of the temporary piezoelectric units 11b and 11c.

Next, an insulating plate having the same structure as the insulating plate 15 is bonded to the upper surface of the laminated substrate 17 shown in FIG. 1 with its back facing up.

Therefore, since the recess 16 formed in the insulating plate 15 is positioned so as to cover the upper part of each resonance unit 12 to 14,
A space is formed above the resonance units 12 to 14 so as not to interfere with resonance.

In this way, a laminate 25 shown in FIG. 6 is obtained.

In the laminate 25, the terminal is connected to the pole 21a on the negative side 25a,
21b is exposed. In addition, terminal electrodes 23, 24 (
(see FIG. 1) are mainly exposed on the side surfaces 25b and 25C of the laminate 25. Similarly, although it is not clear in FIG. 6, the terminal electrodes 22a and 22b in FIG.
is exposed on the side surface 25d.

Therefore, as shown in FIG.
．． 29 etc., each piezoelectric resonant unit 1
2 to 14 can be electrically connected. That is, the external electrode 26 electrically connects the terminal electrodes 21a and 21b.

Further, the external electrode 27 is connected to the bottom surface of the laminate 25 through the
The shape extends to the terminal electrode 27a (see FIG. 4(b)) exposed on the opposite side surface 25d (see FIG. 6). This external electrode 27 electrically connects the electrodes connected to the ground potential. Further, the external electrodes 28 and 29 are connected to the terminal electrodes 23. 24 (Fig. 1), and serve as input and output electrodes, respectively. Although not particularly shown, the terminal electrodes 22a and 22b in FIG. 1 are also electrically connected to each other by external electrodes provided on the exposed side surfaces of the stack.

Therefore, in the piezoelectric resonant component described above, the circuit configuration shown in FIG. 8 is realized. That is, a circuit is constructed in which three energy trapping type piezoelectric resonators are electrically connected together with capacitors C, ,C.

In the above embodiment, the energy confinement type resonance unit) 12 to
14 are separated by slits 18 and 19, leakage of vibration between each resonance unit 12 to 14 is effectively prevented. Furthermore, as is clear from the above description of the manufacturing process, since the slits 18 and 19 are formed in the laminated substrate 17 made by pasting the piezoelectric plate 11 on the insulating plate 15, there is very little risk of cracking in the piezoelectric. . Similarly,
The subsequent assembly process is also perfect! Since the piezoelectric plate is bonded and fixed to the i temporary 15, cracking of the piezoelectric plate is extremely difficult to occur.

In the embodiment described above, the slits were formed after the piezoelectric plate 11 of 1 was bonded to the insulating plate 15, but the manufacturing method of this embodiment may also be carried out in the state of the motherboard.For example, as shown in FIG. As shown, a mother piezoelectric plate 32 on which a large number of piezoelectric resonance units 12 to 14 are formed is pasted on a relatively large insulating plate 31, and in this state, a half cut is made from the piezoelectric plate side to form a slit. After that, it may be cut to obtain the individual laminated substrates 17 shown in FIG. Furthermore, after forming the slits in the mother state, a relatively large insulating plate of the mother may be adhered to the upper surface, and then the piezoelectric resonant components may be cut into individual piezoelectric resonant components.

Further, in the above embodiment, the thickness of the slits 7) 18 and 19 was set to be equal to the thickness of the piezoelectric plate 11, but as schematically shown in the cross-sectional view in FIG.
The slit 33 may be formed with a depth that does not reach the thickness of l. Similarly, the slit extends beyond the thickness of the piezoelectric plate ′ij
It may be set to a depth that reaches the A edge.

Furthermore, as shown in a schematic partial cutaway plan view in FIG. 11, a slit 34 that does not reach the edge of the piezoelectric plate 11 may be formed in the region between adjacent resonant units 12, 13. That is, the planar shape of the slit is arbitrary as long as it is possible to separate adjacent resonance units. Regarding the number of pickpockets 7), there may be a plurality of pickpockets between the resonators.

Furthermore, when electrically connecting the terminal electrodes between adjacent resonant units after forming the slits, external electrodes were used in the above embodiments. For example, the terminal electrodes 21a and 21b were electrically connected by the external electrode 26. Instead, as shown in the partially cutaway cross-sectional view of FIG.
By forming the connection electrode 35 within a day, the terminal electrode 21
a and 21b may be electrically connected.

The connection electrode 35 only needs to be formed in a part of the slit 16 so as to electrically connect between the terminal electrodes 21a and 21b, and the method of forming the connection electrode 35 is not particularly limited. For example, it can be easily formed by printing a conductive paste or by using a thin film forming method such as spatter or weeding.

In addition, as shown in FIG. 12, if the connection electrode 35 is formed using a part of the slit,
The terminal electrodes divided by the slits can be electrically connected.

Further, regarding the shape of the slit, although the above embodiment shows a groove with a rectangular cross-sectional shape, it may be formed in any shape and width, such as a square-shaped groove or a U-shaped groove.

Furthermore, the slits may be formed mechanically, or may be formed by cutting using an optical method such as a laser, or may be formed chemically using an etchant.

In order to more reliably prevent vibration leakage between adjacent resonance units, in addition to forming slits, as shown in a partially enlarged plan view in FIG. The altered region 36 may be provided on the piezoelectric plate 11 as shown in FIG. The altered region 36 is formed by chemically or optically altering a part of the piezoelectric material 111. The planar shape of the altered region 36 is not limited to the annular shape shown in the drawings, but may be configured in any shape such as a rectangular annular shape.

〔Effect of the invention〕

As described above, according to the present invention, the number of piezoelectric plates each including a plurality of energy trapping resonance units is one! ! A plurality of resonant units are separated by being attached to an edge plate and half-cut in the form of a laminated board. Therefore,
Since it is supported by an insulating plate and has increased strength, cracks are extremely unlikely to occur when forming slits for separation as in the conventional example. Furthermore, since cracks are less likely to occur during handling after half-cutting, it is possible to improve the yield of piezoelectric resonant components.

Further, since the half-cut is performed while being supported by an insulating plate, it is possible to form a slit that reliably separates adjacent resonance units. Therefore, it is possible to reliably prevent vibration leakage between adjacent resonant units, and it is possible to more reliably obtain a piezoelectric resonant component with stable characteristics.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing a state in which slits are formed in a laminated substrate in a manufacturing method according to an embodiment of the present invention, Fig. 2 is a plan view of a conventional piezoelectric resonant component, and Fig. 3 is a piezoelectric resonator of Fig. 2. The circuit diagram of the parts, Fig. 4(a) is a perspective view for explaining the piezoelectric plate, Fig. 4(b) is a back view of the piezoelectric plate, Fig. 5 is a perspective view showing the insulating plate, and Fig. 6 is a perspective view for explaining the piezoelectric plate. FIG. 7 is a perspective view of a piezoelectric resonant component obtained according to an embodiment of the present invention, and FIG. 8 is a perspective view of a piezoelectric resonant component obtained by an embodiment of the present invention. A circuit diagram, FIG. 9 is a perspective view showing a mother piezoelectric plate bonded to a mother insulating plate, and FIG. 10 is a partially cutaway sectional view for explaining another example of the slit.
FIG. 11 is a partially cutaway sectional view for explaining still another example of the slit, FIG. 12 is a partially cutaway sectional view for explaining an example in which a connection electrode is formed in the slit, and FIG. 13 is a slit 7. FIG. 4 is a partially cutaway plan view for explaining an example in which an altered region is formed around the resonant unit in addition to the resonant unit. In the figure, 11 is a piezoelectric plate, 12 to 14 are energy trapping type piezoelectric resonance units, 12a 12b to 14a, 1
4b is a resonant electrode, 15 is an insulating plate, 17 is a laminated substrate, 18
．． 19 shows a slit formed by half-cutting. Figure 3 3C Bay Figure 8

Claims (1)

[Claims] A step of preparing a piezoelectric plate in which a plurality of energy trapping type resonant units are configured by forming resonant electrodes on both principal surfaces, and attaching an insulating plate to the piezoelectric plate to form a laminated substrate. and a step of half-cutting the laminated substrate from the piezoelectric plate side in a region between the plurality of resonance units.