JPH0341513B2 - - Google Patents
Info
- Publication number
- JPH0341513B2 JPH0341513B2 JP57070107A JP7010782A JPH0341513B2 JP H0341513 B2 JPH0341513 B2 JP H0341513B2 JP 57070107 A JP57070107 A JP 57070107A JP 7010782 A JP7010782 A JP 7010782A JP H0341513 B2 JPH0341513 B2 JP H0341513B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- resin
- fluororubber
- phenolic resin
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 239000004962 Polyamide-imide Substances 0.000 claims description 11
- 229920001973 fluoroelastomer Polymers 0.000 claims description 11
- 229920002312 polyamide-imide Polymers 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 238000009472 formulation Methods 0.000 claims description 9
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 8
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 8
- 239000005011 phenolic resin Substances 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 229920003986 novolac Polymers 0.000 claims description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 10
- 229920001971 elastomer Polymers 0.000 description 8
- 239000010680 novolac-type phenolic resin Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 3
- 238000004073 vulcanization Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920002449 FKM Polymers 0.000 description 1
- 102220560985 Flotillin-2_E60C_mutation Human genes 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
Description
【発明の詳細な説明】
本発明は、加硫接着剤配合物に関する。更に詳
しくは、フツ素ゴムと金属との間の接着に有効に
用いられる加硫接着剤配合物に関する。
従来、フツ素ゴムと金属との間の接着には、有
機シラン系の接着剤が使用されていたが、この接
着剤を使用した場合には、接着後の耐熱性に問題
があり、特に二次加硫の温度が200℃を越える場
合には、フツ素ゴムから発生したフツ化水素によ
る金属面での剥離を起すことが殆んどである。
本発明者は、高い温度で熱処理を行なつても、
フツ素ゴム一金属間に十分な接着力が得られる接
着剤配合物を求めて種々検討の結果、ポリアミド
イミド樹脂、ノボラツク型フエノール樹脂および
ヘキサメチレンテトラミン硬化剤を含有してなる
加硫接着剤配合物が上記目的を十分に達成せしめ
ることをここに見出した。
従つて、本発明は、かかる各配合成分を含有し
てなるフツ素ゴムと金属との接着用加硫接着剤配
合物に関する。
このようにして、本発明に係る加硫接着剤配合
物を用いて接着を行なつた場合には、フツ素ゴム
の加硫剤としてアミン系、ポリオール系、パーオ
キサイド系などの各種の加硫剤を用いた場合に
も、その種類によらず、安定した接着性と高い耐
熱性とを有し、また加熱時にフツ素ガスから発生
されるフツ化水素による金属の腐食をも有効に防
止し得るという顕著な効果を奏する。
ポリアミドイミド樹脂は、ポリアミド樹脂の主
鎖中にアミド結合を導入し、この結合によりポリ
イミド樹脂にたわみ性が加わり、加工性を向上さ
せたものであり、例えば次のようにして製造され
る。
ノボラツク型フエノール樹脂は、フエノールと
ホルマリンとを酸触媒の存在下に加熱することに
より、アルコール、アセトンなどの有機溶剤に可
溶性の松脂状物として得られ、これにヘキサメチ
レンテトラミンを硬化剤として加え、加熱するこ
とにより不溶不融のフエノール樹脂を形成する。
本発明においては、融点が約100℃前後、分子量
が約数万程度の2段法フエノール樹脂が一般に用
いられる。
本発明に係る加硫接着剤配合物は、このような
ポリアミドイミド樹脂、ノボラツク型フエノール
樹脂およびそれの硬化剤としてのヘキサメチレン
テトラミンを含有してなり、それらはポリアミド
イミド樹脂100重量部に対しノボラツク型フエロ
ール樹脂が約5〜50重量部、好ましくは約20〜40
重量部の割合で、またノボラツク型フエノール樹
脂100重量部に対しヘキサメチレンテトラミンが
約5〜20重量部の割合で配合して用いられる。ポ
リアミドイミド樹脂に対するノボラツク型フエノ
ール樹脂の割合がこれより少ないと、フツ素ゴム
などとの結合力が弱く、反応性に乏しくなる。こ
れは、ポリアミドイミド樹脂の硬化速度が非常に
遅いため、ゴムなどとの結合が開始される前に、
接着剤層が流動されるためと考えられる。一方、
これ以上の割合で用いられると、ポリアミドイミ
ド樹脂の割合が少なくなり、耐熱性に劣るように
なる。また、ノボラツク型フエノール樹脂に対す
るヘキサメチレンテトラミンの割合は、従来から
硬化剤として使用さている割合そのものである
が、その使用割合はその範囲内で少ない方が好ま
しい。
これらの各配合成分を含有してなる加硫接着剤
組成物は、一般に有機溶剤溶液の形に調製されて
用いられる。有機溶剤としては、これらの各配合
成分を溶解し得るものであれば任意のものを使用
し得るが、ジメチルホルムアミドを単独で使用す
ることが特に好ましい。
接着に際しては、この加硫接着剤組成物溶液が
金属上に塗布され、それを約130〜150℃程度に加
熱して乾燥させた後、約230〜250℃に約10〜30分
間程度加熱して、焼付け処理が行われる。その
後、フツ素ゴムの未加硫配合物と接合させ、フツ
素ゴムの加硫温度である約160〜200℃に加熱しな
がら、金型などを用いて加圧加硫する。
金属としては、軟鋼、アルミニウム、アルミニ
ウムダイキヤスト、黄鋼、ステンレススチール、
亜鉛などが用いられる。
また、フツ素ゴムの未加硫配合物としては、例
えば次のような配合のものが用いられる。
配合例 A
フツ素ゴム(デユポン社製品バイトンE60C)
100重量部
Ca(OH)2 6 〃
MgO 3 〃
MTカーボンブラツク 30 〃
配合例 B
フツ素ゴム(デユポン社製品バイトンA)
100重量部
リサージ(酸化鉛) 15 〃
加硫剤(デユポン社製品ダイヤツクNo.4)
3 〃
MTカーボンブラツク 20 〃
配合例 C
フツ素ゴム(ダイキン製品ダイエルG902)
100重量部
加硫剤(日本油脂製品パーヘキサ25B40)
1.5 〃
トリアリルイソシアヌレート 4 〃
MTカーボンブラツク 20 〃
本発明により得られるフツ素ゴムと金属との間
の接着物は、高熱処理を行なつた場合にも、金属
面での剥れを生ずることがなく、特にアルミニウ
ム、銅、亜鉛などの耐食性の少ない金属の場合に
ひん発していたそれらの金属面での剥れが殆んど
みられないという顕著な効果を奏する。
次に、実施例について本発明の効果を説明す
る。
実施例 1
ポリアミドイミド樹脂(三井石油化学製品ケル
イミド500)100部(重量、以下同じ)、ノボラツ
ク型フエノール樹脂(融点100℃、分子量数百〜
数万の混合物)20部およびヘキサメチレンテトラ
ミン2部をジメチホルムアミド120部に溶解し、
この溶液状加硫接着剤配合物を、リン酸亜鉛被膜
処理を施した軟鋼板に塗装した。130℃で10分間
乾燥後、230℃で10分間焼付け処理を行なつた。
前記配合例Aよりなるフツ素ゴム未加硫配合物
を、JISK−6301 90℃剥離テスト法に従つて、上
記の如くに処理された軟鋼板に接合させ、金型を
用いて180℃で8分間加圧加硫を行ない、その後
加硫した接着物を200℃で22時間熱処理した。
実施例 2
実施例1において、ポリアミドイミド樹脂100
部、ノボラツク型フエノール樹脂40部、ヘキサメ
チレンテトラミン4部およびジメチルホルムアミ
ド40部よりなる溶液状加硫接着剤配合物が用いら
れた。
比較例
実施例1において、ポリアミドイミド樹脂100
部およびジメチルホルムアミド100部よりなる樹
脂溶液が接着剤として用いられた。
以上の各実施例および比較例の接着物につい
て、JISK−6301 90℃剥離テスト法に従つて、剥
離力およびゴム残り面積(ゴム残り以外は接着剤
とゴムとの間の剥れ)をそれぞれ測定した。得ら
れた結果は、次の表に示される。
【表】DETAILED DESCRIPTION OF THE INVENTION The present invention relates to vulcanized adhesive formulations. More specifically, the present invention relates to a vulcanized adhesive formulation that is effectively used for adhesion between fluororubber and metal. Conventionally, organic silane-based adhesives have been used to bond fluorocarbon rubber and metals, but when this adhesive is used, there are problems with heat resistance after bonding, especially for secondary If the temperature of the subsequent vulcanization exceeds 200°C, hydrogen fluoride generated from the fluororubber will most likely cause peeling on the metal surface. The inventor has discovered that even if heat treatment is performed at high temperatures,
As a result of various studies in search of an adhesive formulation that would provide sufficient adhesive strength between fluorocarbon rubber and metal, we developed a vulcanized adhesive formulation containing polyamideimide resin, novolac type phenolic resin, and hexamethylenetetramine curing agent. It has now been discovered that the above object can be fully achieved. Therefore, the present invention relates to a vulcanized adhesive composition for adhesion between fluororubber and metal, which contains these components. In this way, when adhesion is carried out using the vulcanizable adhesive composition according to the present invention, various vulcanizing agents such as amine-based, polyol-based, peroxide-based, etc. Regardless of the type of agent used, it has stable adhesion and high heat resistance, and also effectively prevents corrosion of metals due to hydrogen fluoride generated from fluorine gas during heating. It has a remarkable effect of obtaining. Polyamide-imide resin is produced by introducing an amide bond into the main chain of the polyamide resin, and this bond adds flexibility to the polyimide resin and improves processability, and is produced, for example, as follows. Novolac-type phenolic resin is obtained as a rosin-like substance that is soluble in organic solvents such as alcohol and acetone by heating phenol and formalin in the presence of an acid catalyst, and adding hexamethylenetetramine as a curing agent to this. By heating, an insoluble and infusible phenolic resin is formed.
In the present invention, a two-stage phenolic resin having a melting point of about 100° C. and a molecular weight of about several tens of thousands is generally used. The vulcanized adhesive formulation according to the present invention contains such a polyamide-imide resin, a novolac-type phenolic resin, and hexamethylenetetramine as a curing agent thereof, and they contain a novolac-type phenolic resin based on 100 parts by weight of the polyamide-imide resin. The type ferol resin is about 5 to 50 parts by weight, preferably about 20 to 40 parts by weight.
Hexamethylenetetramine is used in a ratio of about 5 to 20 parts by weight per 100 parts by weight of novolak type phenolic resin. If the ratio of the novolac type phenolic resin to the polyamide-imide resin is less than this, the bonding force with fluorocarbon rubber etc. will be weak and the reactivity will be poor. This is because the curing speed of polyamide-imide resin is very slow, so before it starts bonding with rubber etc.
This is thought to be because the adhesive layer is fluidized. on the other hand,
If the proportion is higher than this, the proportion of the polyamide-imide resin will decrease, resulting in poor heat resistance. Further, the ratio of hexamethylenetetramine to the novolak type phenol resin is the same as that conventionally used as a curing agent, but it is preferable that the ratio used is as small as possible within that range. A vulcanized adhesive composition containing each of these ingredients is generally prepared and used in the form of an organic solvent solution. Any organic solvent can be used as long as it can dissolve these components, but it is particularly preferred to use dimethylformamide alone. For bonding, this vulcanized adhesive composition solution is applied to the metal, heated to approximately 130 to 150°C to dry, and then heated to approximately 230 to 250°C for approximately 10 to 30 minutes. Then, a baking process is performed. Thereafter, it is bonded to an unvulcanized compound of fluororubber, and is vulcanized under pressure using a mold or the like while heating to approximately 160 to 200°C, which is the vulcanization temperature of fluororubber. Metals include mild steel, aluminum, aluminum die-casting, yellow steel, stainless steel,
Zinc etc. are used. Further, as an unvulcanized compound of fluororubber, for example, the following compound is used. Compounding example A Fluororubber (DuPont product Viton E60C)
100 parts by weight Ca (OH) 2 6 〃 MgO 3 〃 MT Carbon Black 30 〃 Compounding example B Fluororubber (DuPont product Viton A)
100 parts by weight Resurge (lead oxide) 15 Vulcanizing agent (DuPont product Diamond No. 4)
3 〃 MT Carbon Black 20 〃 Compounding example C Fluorine rubber (Daikin product Daiel G902)
100 parts by weight vulcanizing agent (NOF Perhexa 25B40)
1.5 〃 Triallylisocyanurate 4 〃 MT Carbon Black 20 〃 The adhesive between fluororubber and metal obtained by the present invention does not cause peeling on the metal surface even when subjected to high heat treatment. It has the remarkable effect of almost no peeling on the metal surface, which often occurs with metals with low corrosion resistance, such as aluminum, copper, and zinc. Next, the effects of the present invention will be explained with reference to Examples. Example 1 Polyamide-imide resin (Mitsui Petrochemical Kerimide 500) 100 parts (weight, same hereinafter), novolac type phenolic resin (melting point 100°C, molecular weight several hundred ~
20 parts of a mixture of tens of thousands) and 2 parts of hexamethylenetetramine are dissolved in 120 parts of dimethyformamide,
This solution-form vulcanizable adhesive formulation was applied to a mild steel plate treated with a zinc phosphate coating. After drying at 130°C for 10 minutes, baking treatment was performed at 230°C for 10 minutes. The unvulcanized fluororubber compound of Formulation Example A was bonded to a mild steel plate treated as described above in accordance with the JISK-6301 90°C peel test method, and was then bonded to a mild steel plate treated as described above at 180°C using a mold. Pressure vulcanization was performed for 1 minute, and then the vulcanized adhesive was heat-treated at 200° C. for 22 hours. Example 2 In Example 1, polyamideimide resin 100
A solution vulcanizable adhesive formulation was used consisting of 40 parts of novolac-type phenolic resin, 4 parts of hexamethylenetetramine, and 40 parts of dimethylformamide. Comparative example In Example 1, polyamideimide resin 100
A resin solution consisting of 100 parts and 100 parts of dimethylformamide was used as the adhesive. For the adhesives of each of the above Examples and Comparative Examples, the peel force and remaining rubber area (excluding the remaining rubber, peeling between the adhesive and rubber) were measured according to the JISK-6301 90°C peel test method. did. The results obtained are shown in the following table. 【table】
Claims (1)
ール樹脂およびヘキサメチレンテトラミン硬化剤
を含有してなる、フツ素ゴムと金属との接着用加
硫接着剤配合物。 2 有機溶剤溶液の形で調製された特許請求の範
囲第1項記載の加硫接着剤配合物。[Scope of Claims] 1. A vulcanized adhesive composition for bonding fluororubber and metal, comprising a polyamideimide resin, a novolak type phenolic resin, and a hexamethylenetetramine curing agent. 2. A vulcanized adhesive formulation according to claim 1 prepared in the form of an organic solvent solution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7010782A JPS58187478A (en) | 1982-04-26 | 1982-04-26 | Vulcanizable adhesive composition and bonding method using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7010782A JPS58187478A (en) | 1982-04-26 | 1982-04-26 | Vulcanizable adhesive composition and bonding method using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58187478A JPS58187478A (en) | 1983-11-01 |
JPH0341513B2 true JPH0341513B2 (en) | 1991-06-24 |
Family
ID=13421981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7010782A Granted JPS58187478A (en) | 1982-04-26 | 1982-04-26 | Vulcanizable adhesive composition and bonding method using the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58187478A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022230762A1 (en) | 2021-04-27 | 2022-11-03 | 三ツ星ベルト株式会社 | Toothed belt and belt transmission mechanism |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6181473A (en) * | 1984-09-28 | 1986-04-25 | Nok Corp | Vulcanizable adhesive composition and bonding method using same |
JPS6284154A (en) * | 1985-10-07 | 1987-04-17 | Youbea Le-Ron Kogyo Kk | Polyamide imide resin composition |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50130894A (en) * | 1974-04-05 | 1975-10-16 | ||
JPS5518447A (en) * | 1978-07-28 | 1980-02-08 | Asahi Organic Chem Ind Co Ltd | Phenolic resin solid solution for shell molding and its preparation |
JPS55108482A (en) * | 1979-02-14 | 1980-08-20 | Toshiba Corp | Adhesive for mouth piece of tube bulb |
JPS5692948A (en) * | 1979-12-27 | 1981-07-28 | Mitsui Toatsu Chem Inc | Composition for curable resin |
-
1982
- 1982-04-26 JP JP7010782A patent/JPS58187478A/en active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50130894A (en) * | 1974-04-05 | 1975-10-16 | ||
JPS5518447A (en) * | 1978-07-28 | 1980-02-08 | Asahi Organic Chem Ind Co Ltd | Phenolic resin solid solution for shell molding and its preparation |
JPS55108482A (en) * | 1979-02-14 | 1980-08-20 | Toshiba Corp | Adhesive for mouth piece of tube bulb |
JPS5692948A (en) * | 1979-12-27 | 1981-07-28 | Mitsui Toatsu Chem Inc | Composition for curable resin |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022230762A1 (en) | 2021-04-27 | 2022-11-03 | 三ツ星ベルト株式会社 | Toothed belt and belt transmission mechanism |
Also Published As
Publication number | Publication date |
---|---|
JPS58187478A (en) | 1983-11-01 |
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