JPH0339878U - - Google Patents

Info

Publication number
JPH0339878U
JPH0339878U JP10094889U JP10094889U JPH0339878U JP H0339878 U JPH0339878 U JP H0339878U JP 10094889 U JP10094889 U JP 10094889U JP 10094889 U JP10094889 U JP 10094889U JP H0339878 U JPH0339878 U JP H0339878U
Authority
JP
Japan
Prior art keywords
electronic components
circuit board
mounting electronic
circuit boards
prepreg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10094889U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0735414Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989100948U priority Critical patent/JPH0735414Y2/ja
Publication of JPH0339878U publication Critical patent/JPH0339878U/ja
Application granted granted Critical
Publication of JPH0735414Y2 publication Critical patent/JPH0735414Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1989100948U 1989-08-29 1989-08-29 電子部品搭載用多層回路基板 Expired - Lifetime JPH0735414Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989100948U JPH0735414Y2 (ja) 1989-08-29 1989-08-29 電子部品搭載用多層回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989100948U JPH0735414Y2 (ja) 1989-08-29 1989-08-29 電子部品搭載用多層回路基板

Publications (2)

Publication Number Publication Date
JPH0339878U true JPH0339878U (US06330241-20011211-M00004.png) 1991-04-17
JPH0735414Y2 JPH0735414Y2 (ja) 1995-08-09

Family

ID=31649925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989100948U Expired - Lifetime JPH0735414Y2 (ja) 1989-08-29 1989-08-29 電子部品搭載用多層回路基板

Country Status (1)

Country Link
JP (1) JPH0735414Y2 (US06330241-20011211-M00004.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179733A (ja) * 2004-12-24 2006-07-06 Casio Comput Co Ltd 多層配線基板およびその製造方法
KR101297482B1 (ko) * 2013-05-08 2013-08-16 이흥재 천정 빨래 건조대

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204994111U (zh) * 2013-02-15 2016-01-20 株式会社村田制作所 层叠电路基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6381998A (ja) * 1986-09-26 1988-04-12 三菱瓦斯化学株式会社 Icチツプ搭載用多層板の製造法
JPS6381999A (ja) * 1986-09-26 1988-04-12 三菱瓦斯化学株式会社 Icチツプ搭載用多層板の製造法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6381998A (ja) * 1986-09-26 1988-04-12 三菱瓦斯化学株式会社 Icチツプ搭載用多層板の製造法
JPS6381999A (ja) * 1986-09-26 1988-04-12 三菱瓦斯化学株式会社 Icチツプ搭載用多層板の製造法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179733A (ja) * 2004-12-24 2006-07-06 Casio Comput Co Ltd 多層配線基板およびその製造方法
KR101297482B1 (ko) * 2013-05-08 2013-08-16 이흥재 천정 빨래 건조대

Also Published As

Publication number Publication date
JPH0735414Y2 (ja) 1995-08-09

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