JPH0339208A - Molding device and molding method - Google Patents
Molding device and molding methodInfo
- Publication number
- JPH0339208A JPH0339208A JP17412089A JP17412089A JPH0339208A JP H0339208 A JPH0339208 A JP H0339208A JP 17412089 A JP17412089 A JP 17412089A JP 17412089 A JP17412089 A JP 17412089A JP H0339208 A JPH0339208 A JP H0339208A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- stopper
- molding
- heating coil
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 65
- 239000011810 insulating material Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 101100334283 Arabidopsis thaliana FAR5 gene Proteins 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は樹脂等を成形する装置に関し、詳しくは高周波
により金型を加熱して成形を行う装置および成形方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for molding resin or the like, and more particularly to an apparatus and a molding method that perform molding by heating a mold with high frequency.
（従来の技術）
従来高周波加熱を利用し、金型によって樹脂材料を成形
する方法としては、特公昭５８−４０５０４号公報に記
載されているように、加熱コイルを金型の加熱面と相似
形とし、金型型開き時に金型内にコイルを挿入し、その
後型を閉じて加熱コイルを挟み込み、金型でコイルを挟
んだ状態で加熱する方法がある。(Prior art) Conventionally, as a method of molding a resin material using a mold using high-frequency heating, as described in Japanese Patent Publication No. 58-40504, a heating coil is shaped similar to the heating surface of the mold. There is a method in which a coil is inserted into the mold when the mold is opened, and then the mold is closed and the heating coil is sandwiched between the molds, and heating is performed with the coil sandwiched between the molds.
また同公報には、コイルを金型に直接接触させずに、適
当な空気間隔をあけた状態で加熱する方法が記載されて
いる。The same publication also describes a method of heating the coil without directly contacting the mold with an appropriate air gap between the coils and the mold.
（発明が解決しようとしている課題）
しかしながら金型でコイルを挟んだ状態で加熱する方法
は、加熱コイルを金型で挟むことにより金型表面が傷つ
くという問題を有し、特に鏡面性を持つ金型には通用で
きなかった。(Problem to be solved by the invention) However, the method of heating with the coil sandwiched between molds has the problem that the surface of the mold is damaged by sandwiching the heating coil between the molds. It didn't fit the mold.
また、コイルを金型に直接接触させずに適当な空気間隔
をあけた状態で加熱する方法は、加熱コイルと金型表面
との間隙を一定に保つのが困難であり、温度ムラが生じ
、その結果成形品の精度に難があるという問題を有して
いた。すなわち、金型表面温度Ｔと９気間隔ｔとの間に
は、Ｔ：ご ｋ−ｔ −自
に：高周波周波数、出力、金型材質、コイル形状により
決まる係数
なる関係があり、わずかな空気間隔の変化で著しい温度
差が生じる。In addition, in the method of heating the coil with an appropriate air gap between it and the mold without directly contacting the mold, it is difficult to maintain a constant gap between the heating coil and the mold surface, resulting in temperature unevenness. As a result, there was a problem in that the precision of the molded product was poor. In other words, there is a relationship between the mold surface temperature T and the air gap t, which is a coefficient determined by the high frequency frequency, output, mold material, and coil shape. Changes in spacing result in significant temperature differences.
従来例ではコイルと金型が別々の装置で動作し、金型と
コイルを連結する機構がないため、精度維持が困難であ
り、光学部品の成形等、金型表面温度に高精度を要する
ものには使用できなかった。In conventional methods, the coil and mold operate on separate devices, and there is no mechanism to connect the mold and coil, making it difficult to maintain precision.For molding of optical parts, etc., which requires high precision in mold surface temperature. could not be used.
本発明は、金型と、該金型と相似形の加熱コイルを有す
る高周波加熱装置とを備え、金型で加熱コイルを挟んだ
状態で金型の加熱を行う成形装置であって、金型がスト
ッパーピンを有し、高周波加熱装置がストッパーボスを
有し、該ストッパーピンと該ストッパーボスとが該金型
で該加熱コイルを挟んだときに接触するように配された
ことを特徴とする成形装置である。The present invention is a molding device that includes a mold and a high-frequency heating device having a heating coil similar to the mold, and heats the mold with the heating coil sandwiched between the molds. has a stopper pin, the high-frequency heating device has a stopper boss, and the stopper pin and the stopper boss are arranged so as to be in contact with each other when the heating coil is sandwiched between the molds. It is a device.
前記ストッパーボスが絶縁材料からなることが好ましい
。Preferably, the stopper boss is made of an insulating material.
また本発明は、上記の成形装置を用いて成形を行う成形
方法であって、前記金型が型開き状態の時に前記高周波
加熱装置を金型の間に進入させ、次に前記ストッパーピ
ンと前記ストッパーボスとが接触するまで高周波加熱装
置を金型表面方向に移動させ、該接触を保ったままで高
周波を発振させて金型を加熱し、加熱完了後高周波加熱
装置を金型内から取り出し、型締を行い、型内に被成形
物を注入することを特徴とする成形方法である。The present invention also provides a molding method in which molding is performed using the molding apparatus described above, in which the high-frequency heating device is inserted between the molds when the mold is in an open state, and then the stopper pin and the stopper The high-frequency heating device is moved toward the mold surface until it comes into contact with the boss, and while maintaining this contact, high-frequency waves are oscillated to heat the mold. After heating is completed, the high-frequency heating device is removed from the mold and the mold is clamped. This is a molding method characterized by injecting the object to be molded into the mold.
本発明は特には、前記高周波加熱装置を前記金型の間に
進入させるときに、前記ストッパーピンと金型のキャビ
ティコアとが金型パーティング面より突出していること
を特徴とする上記の方法である。The present invention particularly provides the above method, characterized in that the stopper pin and the cavity core of the mold protrude from the mold parting surface when the high-frequency heating device enters between the mold. be.
本発明によれば、金型を高周波で加熱する際の加熱コイ
ルと金型との空気間隔の精度を、金型に設けたストッパ
ーピンとコイルに設けたストッパーボスとを突き当てて
維持することにより、加熱の際の空気間隔ムラによる金
型表面の温度分布を均一にすることができる。すなわち
、金型ストッパーピンの精度と加熱コイルのストッパー
ボスの精度とを各々単独に保証することにより、金型と
加熱コイルとの相対位置の精度を保証しなくとも均一な
空気間隔を保つことができる。According to the present invention, the accuracy of the air gap between the heating coil and the mold when heating the mold with high frequency is maintained by abutting a stopper pin provided on the mold with a stopper boss provided on the coil. , the temperature distribution on the mold surface due to uneven air spacing during heating can be made uniform. In other words, by independently guaranteeing the accuracy of the mold stopper pin and the accuracy of the heating coil stopper boss, it is possible to maintain uniform air spacing without having to guarantee the accuracy of the relative position between the mold and the heating coil. can.
ストッパーボスが絶縁材料、例えばエポキシ樹脂等の樹
脂あるいはアルミナ等のセラミック材等からなっていれ
ば、高周波加熱装置の加熱コイルから金型へ電流がリー
クするのを防止する絶縁部材を兼ねることができる。If the stopper boss is made of an insulating material, such as a resin such as epoxy resin or a ceramic material such as alumina, it can also serve as an insulating member that prevents current from leaking from the heating coil of the high-frequency heating device to the mold. .
前記高周波加熱装置を前記金型の間に進入させるときに
、前記ストッパーピンと金型のキャビティコアとが金型
パーティング面より突出しているようにすれば、キャビ
ティコアだけを加熱できるので高い加熱効率が得られ、
またキャビティコアと型板との間のスパークを防止する
ことができる。When the high-frequency heating device is inserted between the molds, if the stopper pin and the cavity core of the mold protrude from the mold parting surface, only the cavity core can be heated, resulting in high heating efficiency. is obtained,
Furthermore, sparks between the cavity core and the template can be prevented.
本発明の成形装置および成形方法は上記のような特徴を
有するが、装置および方法のその他の部分は従来技術を
通用する。Although the molding apparatus and molding method of the present invention have the above-mentioned characteristics, other parts of the apparatus and method can be conventionally used.
（実施例）
第１図に本発明の装置の例を示す。ｌは射出成形機の射
出部、２は金型、３は加熱コイル、４は高周波発振装置
、５は加熱コイル駆動装置、６は金型温度調節機、７は
成形品取り出し装置である。(Example) FIG. 1 shows an example of the apparatus of the present invention. 1 is an injection section of the injection molding machine, 2 is a mold, 3 is a heating coil, 4 is a high frequency oscillator, 5 is a heating coil drive device, 6 is a mold temperature controller, and 7 is a molded product removal device.
第２図は金型と加熱コイルとを拡大して示し、２は金型
、２１は成形品表面を形成するキャビティコア、３１は
加熱コイル、３２は加熱コイルのキャビティコア加熱部
分、３３は加熱コイルに設けられたストッパーボス、２
２は金型に設けられたストッパーピン、Ｐは金型パーテ
ィング面を示す。Fig. 2 shows an enlarged view of the mold and the heating coil, 2 is the mold, 21 is the cavity core that forms the surface of the molded product, 31 is the heating coil, 32 is the cavity core heating part of the heating coil, and 33 is the heating Stopper boss provided on the coil, 2
Reference numeral 2 indicates a stopper pin provided on the mold, and P indicates a mold parting surface.
第２〜４図に基づき装置の動作について説明する。The operation of the apparatus will be explained based on FIGS. 2 to 4.
金型２が開いた状態で加熱コイル３１を金型の間に進入
させる（第２図）。キャビティコア２１とストッパーピ
ン２２は突出、後退が可能とされ、ここでは図のように
パーティング面Ｐより突出している。その後加熱コイル
３１を金型表面方向にそれぞれ移動させると、第３図の
ように加熱コイルのストッパーボス３３と金型のストッ
パーピン２２が接触する。With the mold 2 open, the heating coil 31 is inserted between the molds (FIG. 2). The cavity core 21 and the stopper pin 22 are capable of protruding and retracting, and here protrude from the parting surface P as shown in the figure. Thereafter, when the heating coils 31 are respectively moved toward the surface of the mold, the stopper boss 33 of the heating coil and the stopper pin 22 of the mold come into contact as shown in FIG.
その状態で高周波を発振させキャビティコア２１を加熱
する。加熱終了後、加熱コイル３１を金型表面から後退
させ、第２図の状態に戻す。その後加熱コイルを金型内
より取り出し、金型のストッパーピンおよびキャビティ
コアを後退し、型締を行う（第４図）。型締究ｒ後、第
４図の状態で樹脂を金型内に注入し成形を行う。In this state, high frequency waves are oscillated to heat the cavity core 21. After heating, the heating coil 31 is moved back from the mold surface to return to the state shown in FIG. 2. Thereafter, the heating coil is taken out of the mold, the stopper pin and cavity core of the mold are moved back, and the mold is clamped (FIG. 4). After mold clamping, resin is injected into the mold and molding is performed in the state shown in FIG.
本発明によれば、金型と加熱コイルとの間の空気間隔を
一定に保つことができ、金型表面温度分布を均一にでき
、高い精度で成形を行うことができる。According to the present invention, the air gap between the mold and the heating coil can be kept constant, the mold surface temperature distribution can be made uniform, and molding can be performed with high precision.
第１図は実施例の成形装置の全体概念図、第２図から第
４図は金型と加熱コイル部の拡大して示す実施例の方法
の工程図である。
１：射出部 ２：金型
３：加熱コイル ４：高周波光ＦＡＲ５：加熱
コイル移動装置 ６：ｔＭ度調節機２１：キャビティコ
ア ２２：ストッパーピン３１：加熱コイル
３２：キャどティコア加熱部
３３：ストッパーボス
第１図
Ｍ２図
ｆｉ、５１！１
月４図FIG. 1 is an overall conceptual diagram of the molding apparatus of the embodiment, and FIGS. 2 to 4 are process diagrams of the method of the embodiment, showing enlarged views of the mold and the heating coil section. 1: Injection part 2: Mold 3: Heating coil 4: High frequency light FAR5: Heating coil moving device 6: tM degree adjustment machine 21: Cavity core 22: Stopper pin 31: Heating coil 32: Cavity core heating section 33: Stopper Boss Figure 1 M2 Figure fi, 51! January Figure 4
Claims (1)
周波加熱装置とを備え、金型で加熱コイルを挟んだ状態
で金型の加熱を行う成形装置であって、金型がストッパ
ーピンを有し、高周波加熱装置がストッパーボスを有し
、該ストッパーピンと該ストッパーボスとが該金型で該
加熱コイルを挟んだときに接触するように配されたこと
を特徴とする成形装置。 （２）前記ストッパーボスが絶縁材料からなることを特
徴とする請求項１に記載の装置。（３）請求項１に記載
の成形装置を用いて成形を行う成形方法であって、前記
金型が型開き状態の時に前記高周波加熱装置を金型の間
に進入させ、次に前記ストッパーピンと前記ストッパー
ボスとが接触するまで高周波加熱装置を金型表面方向に
移動させ、該接触を保ったままで高周波を発振させて金
型を加熱し、加熱完了後高周波加熱装置を金型内から取
り出し、型締を行い、型内に被成形物を注入することを
特徴とする成形方法。 （４）前記高周波加熱装置を前記金型の間に進入させる
ときに、前記ストッパーピンと金型のキャビティコアと
が金型パーティング面より突出していることを特徴とす
る請求項３に記載の方法。[Claims] (1) A molding device comprising a mold and a high-frequency heating device having a heating coil similar in shape to the mold, and heating the mold with the heating coil sandwiched between the molds. The mold has a stopper pin, the high-frequency heating device has a stopper boss, and the stopper pin and the stopper boss are arranged so as to come into contact when the heating coil is sandwiched between the molds. A molding device featuring: (2) The device according to claim 1, wherein the stopper boss is made of an insulating material. (3) A molding method in which molding is performed using the molding apparatus according to claim 1, wherein the high-frequency heating device is inserted between the molds when the mold is in an open state, and then the stopper pin Move the high frequency heating device toward the mold surface until it comes into contact with the stopper boss, heat the mold by oscillating high frequency waves while maintaining the contact, and after heating is completed, remove the high frequency heating device from the mold, A molding method characterized by clamping the mold and injecting the object to be molded into the mold. (4) The method according to claim 3, wherein when the high-frequency heating device is inserted between the molds, the stopper pin and the cavity core of the mold protrude from the mold parting surface. .
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17412089A JPH0339208A (en) | 1989-07-07 | 1989-07-07 | Molding device and molding method |
| US07/448,544 US5062786A (en) | 1988-12-12 | 1989-12-11 | Molding device for molding optical elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17412089A JPH0339208A (en) | 1989-07-07 | 1989-07-07 | Molding device and molding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0339208A true JPH0339208A (en) | 1991-02-20 |
| JPH0525643B2 JPH0525643B2 (en) | 1993-04-13 |
Family
ID=15972994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17412089A Granted JPH0339208A (en) | 1988-12-12 | 1989-07-07 | Molding device and molding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339208A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5034130A (en) * | 1989-04-07 | 1991-07-23 | Nippon Oil And Fats Co., Ltd. | Method for producing a composite membrane and the composite membrane |
| JP2008277219A (en) * | 2007-05-07 | 2008-11-13 | Mitsubishi Electric Corp | Discharge lamp lighting device |
-
1989
- 1989-07-07 JP JP17412089A patent/JPH0339208A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5034130A (en) * | 1989-04-07 | 1991-07-23 | Nippon Oil And Fats Co., Ltd. | Method for producing a composite membrane and the composite membrane |
| JP2008277219A (en) * | 2007-05-07 | 2008-11-13 | Mitsubishi Electric Corp | Discharge lamp lighting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0525643B2 (en) | 1993-04-13 |
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