JPH0338653U - - Google Patents

Info

Publication number

JPH0338653U

JPH0338653U JP9796789U JP9796789U JPH0338653U JP H0338653 U JPH0338653 U JP H0338653U JP 9796789 U JP9796789 U JP 9796789U JP 9796789 U JP9796789 U JP 9796789U JP H0338653 U JPH0338653 U JP H0338653U

Authority

JP

Japan

Prior art keywords

integrated circuit

pattern

heat dissipation

dissipation structure

patterns

Prior art date

1989-08-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 230000017525 heat dissipation Effects 0.000 claims description 3
• 239000004020 conductor Substances 0.000 claims description 2
• 239000000758 substrate Substances 0.000 claims description 2
• 239000000919 ceramic Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (4)