JPH0338634U - - Google Patents
Info
- Publication number
- JPH0338634U JPH0338634U JP9948789U JP9948789U JPH0338634U JP H0338634 U JPH0338634 U JP H0338634U JP 9948789 U JP9948789 U JP 9948789U JP 9948789 U JP9948789 U JP 9948789U JP H0338634 U JPH0338634 U JP H0338634U
- Authority
- JP
- Japan
- Prior art keywords
- film substrate
- bonded
- chip
- conductor wiring
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9948789U JPH0338634U (cs) | 1989-08-25 | 1989-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9948789U JPH0338634U (cs) | 1989-08-25 | 1989-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338634U true JPH0338634U (cs) | 1991-04-15 |
Family
ID=31648538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9948789U Pending JPH0338634U (cs) | 1989-08-25 | 1989-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338634U (cs) |
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1989
- 1989-08-25 JP JP9948789U patent/JPH0338634U/ja active Pending