JPH033746U - - Google Patents

Info

Publication number
JPH033746U
JPH033746U JP6516689U JP6516689U JPH033746U JP H033746 U JPH033746 U JP H033746U JP 6516689 U JP6516689 U JP 6516689U JP 6516689 U JP6516689 U JP 6516689U JP H033746 U JPH033746 U JP H033746U
Authority
JP
Japan
Prior art keywords
lead terminal
mold part
synthetic resin
semiconductor device
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6516689U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6516689U priority Critical patent/JPH033746U/ja
Publication of JPH033746U publication Critical patent/JPH033746U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP6516689U 1989-06-02 1989-06-02 Pending JPH033746U (US06521211-20030218-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6516689U JPH033746U (US06521211-20030218-C00004.png) 1989-06-02 1989-06-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6516689U JPH033746U (US06521211-20030218-C00004.png) 1989-06-02 1989-06-02

Publications (1)

Publication Number Publication Date
JPH033746U true JPH033746U (US06521211-20030218-C00004.png) 1991-01-16

Family

ID=31596755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6516689U Pending JPH033746U (US06521211-20030218-C00004.png) 1989-06-02 1989-06-02

Country Status (1)

Country Link
JP (1) JPH033746U (US06521211-20030218-C00004.png)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121862A (ja) * 1982-12-28 1984-07-14 Fujitsu Ltd 樹脂封止形半導体装置
JPS60189940A (ja) * 1984-03-09 1985-09-27 Nec Corp 樹脂封止型半導体装置の製法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121862A (ja) * 1982-12-28 1984-07-14 Fujitsu Ltd 樹脂封止形半導体装置
JPS60189940A (ja) * 1984-03-09 1985-09-27 Nec Corp 樹脂封止型半導体装置の製法

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