JPH033739U - - Google Patents

Info

Publication number
JPH033739U
JPH033739U JP6387489U JP6387489U JPH033739U JP H033739 U JPH033739 U JP H033739U JP 6387489 U JP6387489 U JP 6387489U JP 6387489 U JP6387489 U JP 6387489U JP H033739 U JPH033739 U JP H033739U
Authority
JP
Japan
Prior art keywords
bond
applicator
smooth
extension part
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6387489U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6387489U priority Critical patent/JPH033739U/ja
Publication of JPH033739U publication Critical patent/JPH033739U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP6387489U 1989-05-31 1989-05-31 Pending JPH033739U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6387489U JPH033739U (fr) 1989-05-31 1989-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6387489U JPH033739U (fr) 1989-05-31 1989-05-31

Publications (1)

Publication Number Publication Date
JPH033739U true JPH033739U (fr) 1991-01-16

Family

ID=31594312

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6387489U Pending JPH033739U (fr) 1989-05-31 1989-05-31

Country Status (1)

Country Link
JP (1) JPH033739U (fr)

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