JPH033739U - - Google Patents
Info
- Publication number
- JPH033739U JPH033739U JP1989063874U JP6387489U JPH033739U JP H033739 U JPH033739 U JP H033739U JP 1989063874 U JP1989063874 U JP 1989063874U JP 6387489 U JP6387489 U JP 6387489U JP H033739 U JPH033739 U JP H033739U
- Authority
- JP
- Japan
- Prior art keywords
- bond
- applicator
- smooth
- extension part
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989063874U JPH033739U (enFirst) | 1989-05-31 | 1989-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989063874U JPH033739U (enFirst) | 1989-05-31 | 1989-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033739U true JPH033739U (enFirst) | 1991-01-16 |
Family
ID=31594312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989063874U Pending JPH033739U (enFirst) | 1989-05-31 | 1989-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033739U (enFirst) |
-
1989
- 1989-05-31 JP JP1989063874U patent/JPH033739U/ja active Pending