JPH0337283A - Heat-resistant coating material and copper sheet coated therewith - Google Patents
Heat-resistant coating material and copper sheet coated therewithInfo
- Publication number
- JPH0337283A JPH0337283A JP17162389A JP17162389A JPH0337283A JP H0337283 A JPH0337283 A JP H0337283A JP 17162389 A JP17162389 A JP 17162389A JP 17162389 A JP17162389 A JP 17162389A JP H0337283 A JPH0337283 A JP H0337283A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- coating material
- benzotriazole
- resin
- adhesive properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 20
- 239000010949 copper Substances 0.000 title claims abstract description 20
- 239000011248 coating agent Substances 0.000 title claims abstract description 11
- 238000000576 coating method Methods 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 title abstract description 5
- 239000004962 Polyamide-imide Substances 0.000 claims abstract description 15
- 229920002312 polyamide-imide Polymers 0.000 claims abstract description 15
- 229920003180 amino resin Polymers 0.000 claims abstract description 12
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000012964 benzotriazole Substances 0.000 claims abstract description 11
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 6
- 239000003973 paint Substances 0.000 claims description 25
- 239000004640 Melamine resin Substances 0.000 claims description 4
- 150000007974 melamines Chemical class 0.000 claims description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000004135 Bone phosphate Substances 0.000 abstract description 4
- 150000008065 acid anhydrides Chemical class 0.000 abstract description 4
- 239000007795 chemical reaction product Substances 0.000 abstract description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004202 carbamide Substances 0.000 abstract description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract 5
- 238000004381 surface treatment Methods 0.000 abstract 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 abstract 1
- 150000004985 diamines Chemical class 0.000 abstract 1
- 125000005442 diisocyanate group Chemical group 0.000 abstract 1
- 238000006198 methoxylation reaction Methods 0.000 abstract 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 14
- 229910000906 Bronze Inorganic materials 0.000 description 13
- 239000010974 bronze Substances 0.000 description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- -1 1-oxybenzotriazole Chemical compound 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- QABYBLFTBSCYHR-UHFFFAOYSA-N 1-(benzotriazol-1-yl)-n,n-dimethylmethanamine Chemical compound C1=CC=C2N(CN(C)C)N=NC2=C1 QABYBLFTBSCYHR-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- NIIUIBKEGRPPDK-UHFFFAOYSA-N 1-(benzotriazol-1-yl)ethanone Chemical compound C1=CC=C2N(C(=O)C)N=NC2=C1 NIIUIBKEGRPPDK-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- WMTLVUCMBWBYSO-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 WMTLVUCMBWBYSO-UHFFFAOYSA-N 0.000 description 1
- 229910000936 Naval brass Inorganic materials 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- UXNBTDLSBQFMEH-UHFFFAOYSA-N [Cu].[Zn].[Pb] Chemical compound [Cu].[Zn].[Pb] UXNBTDLSBQFMEH-UHFFFAOYSA-N 0.000 description 1
- PDYXSJSAMVACOH-UHFFFAOYSA-N [Cu].[Zn].[Sn] Chemical compound [Cu].[Zn].[Sn] PDYXSJSAMVACOH-UHFFFAOYSA-N 0.000 description 1
- ITBPIKUGMIZTJR-UHFFFAOYSA-N [bis(hydroxymethyl)amino]methanol Chemical compound OCN(CO)CO ITBPIKUGMIZTJR-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- UJEMOXPSTTXLRE-UHFFFAOYSA-N benzotriazol-1-yl(phenyl)methanone Chemical compound N1=NC2=CC=CC=C2N1C(=O)C1=CC=CC=C1 UJEMOXPSTTXLRE-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007739 conversion coating Methods 0.000 description 1
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical compound [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、密着性に優れた耐熱性塗料及びこれを用いた
被覆ｗ４板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heat-resistant paint with excellent adhesion and a coated W4 board using the same.
主にエナメル銅線の絶縁皮膜に使用されているポリアミ
ドイミドは、耐熱性、耐摩耗性、耐薬品性などに優れて
いる。このポリアミドイミドを各種の金属板のコート剤
に使用する検討が行われているが、金属の種類によって
は、ポリアミドイミドと金属板の密着性が著しく劣り、
実用上問題がある。Polyamide-imide, which is mainly used in the insulation coating of enamelled copper wire, has excellent heat resistance, abrasion resistance, and chemical resistance. Studies are underway to use this polyamide-imide as a coating agent for various metal plates, but depending on the type of metal, the adhesion between the polyamide-imide and the metal plate may be significantly poor.
There are practical problems.
そこで本発明者らは、特に、銅板との密着性の良好なポ
リアミドイミド含有塗料を開発するため鋭意研究を重ね
た。Therefore, the present inventors conducted extensive research in order to develop a polyamide-imide-containing paint that has particularly good adhesion to copper plates.
本発明は、密着性向上のための種々の表面調整（ブラス
ト処理、化成皮膜処理、メツキ処理など）を行うことな
く、優れた密着性を有する耐熱性塗料及びこれを用いた
被覆銅板を提供するものである。The present invention provides a heat-resistant paint that has excellent adhesion without performing various surface adjustments (blasting, chemical conversion coating, plating, etc.) to improve adhesion, and a coated copper plate using the same. It is something.
本発明は、ポリアミドイミド樹脂１００重量部、アルコ
キシ変性アミノ樹脂１〜４０重量部及びベンゾトリアゾ
ール又はその誘導体０．０１−０．７重量部を含んでな
る耐熱性塗料及び該塗料を塗布焼付けして得られる被覆
銅板に関する。The present invention provides a heat-resistant paint comprising 100 parts by weight of a polyamide-imide resin, 1 to 40 parts by weight of an alkoxy-modified amino resin, and 0.01 to 0.7 parts by weight of benzotriazole or its derivative, and a method of applying and baking the paint. The present invention relates to the obtained coated copper plate.
本発明に用いられるポリアミドイミド樹脂は、芳香族ジ
イソシアネート又は芳香族シアミンと芳香族三塩基酸無
水物とを反応させて得られるものである。The polyamide-imide resin used in the present invention is obtained by reacting an aromatic diisocyanate or an aromatic cyamine with an aromatic tribasic acid anhydride.
芳香族ジイソシアネートとしては、４．４′ジフエニル
メタンジイソシアネート、４．４′ジフエニルエーテル
ジイソシア不一ト、トリレンジイソシアネート、キシリ
レンジイソシアネートなどが挙げられ、芳香族シア尖ン
としては、４゜４′〜ジアミノジフエニルメタン、４．
４′−ジアミノジフェニルエーテル、ｍ−キシリレンジ
アミン、ｐ−キシリレンジアミンなどが挙げられる。Examples of the aromatic diisocyanate include 4.4' diphenylmethane diisocyanate, 4.4' diphenyl ether diisocyanate, tolylene diisocyanate, and xylylene diisocyanate. 4'~diaminodiphenylmethane, 4.
Examples include 4'-diaminodiphenyl ether, m-xylylene diamine, and p-xylylene diamine.
芳香族三塩基酸無水物としては、無水トリメリット酸が
挙げられる。酸成分の一部に、ピロメリット酸無水物、
ベンゾフェノンテトラカルボン酸無水物などのジ無水物
あるいはテレフタル酸、イソフタル酸、アジピン酸、セ
バシン酸なとのジカルボン酸を併用してもよい。また、
反応性の点から芳香族ジアミンよりも芳香族ジイソシア
ネートの使用が好ましい。The aromatic tribasic acid anhydride includes trimellitic anhydride. Some of the acid components include pyromellitic anhydride,
Dianhydrides such as benzophenone tetracarboxylic anhydride or dicarboxylic acids such as terephthalic acid, isophthalic acid, adipic acid, and sebacic acid may be used in combination. Also,
From the viewpoint of reactivity, it is preferable to use aromatic diisocyanates rather than aromatic diamines.
高分子量のポリアミトイごドを得るために、反応時の芳
香族三塩基酸無水物と芳香族ジイソシアネート又は芳香
族ジアミンのモル比は当モルに近いことが望ましく、通
常、前者：後者のモル比ｌ：０．８〜１．２の範囲で反
応させるのが好ましい。In order to obtain a high molecular weight polyamide Igodo, it is desirable that the molar ratio of aromatic tribasic acid anhydride and aromatic diisocyanate or aromatic diamine during the reaction be close to equimolar, and usually the molar ratio of the former to the latter is l. : It is preferable to react within the range of 0.8 to 1.2.
反応は、Ｎ−メチル−２−ピロリドン、ジメチルホルム
アミド、ジメチルアセトアミド、クレゾールなどの極性
溶媒の共存下で通常８０〜２１０℃の温度で行われる。The reaction is usually carried out at a temperature of 80 to 210°C in the coexistence of a polar solvent such as N-methyl-2-pyrrolidone, dimethylformamide, dimethylacetamide, or cresol.
市販されている代表的なポリアミドイミドワニスとして
は、Ｈｌ−４００，Ｈｌ−４０５、Ｈｌ−４０６（いず
れも日立化成工業■製）などが挙げられる。Typical commercially available polyamide-imide varnishes include Hl-400, Hl-405, and Hl-406 (all manufactured by Hitachi Chemical Co., Ltd.).
本発明に使用するアルコキシ変性アミノ樹脂は、既に公
知の樹脂であり、尿素、メラミン、ペンジグアナ累ンな
どとホルムアルデヒドの反応物をメトキシ化又はブトキ
シ化した物である。樹脂の相溶性の点でメトキシ化アミ
ノ樹脂の使用が好ましい。The alkoxy-modified amino resin used in the present invention is already a known resin, and is a methoxylated or butoxylated product of a reaction product of formaldehyde with urea, melamine, pendiguana, etc. From the viewpoint of resin compatibility, it is preferable to use methoxylated amino resins.
市販されている代表的なアルコキシ変性アミノ樹脂とし
ては、フラン１１１２．２０，２８．３２６Ｅ、５２３
（いずれも日立化成工業■製）、サイノル３００ （ア
メリカンシアナミド社製）、スーパーベッカミン（日本
ライしホールド社製）などが挙げられる。Typical commercially available alkoxy-modified amino resins include Furan 1112.20, 28.326E, and 523.
(all manufactured by Hitachi Chemical Co., Ltd.), Cynor 300 (manufactured by American Cyanamid Co., Ltd.), and Super Beckamine (manufactured by Nippon Laishi Hold Co., Ltd.).
本発明に使用されるベンゾトリアゾール又はその誘導体
としては、例えばベンゾトリアゾール、ｌ−オキシベン
ゾトリアゾール、１−Ｎ−ベンゾイル−ベンゾトリアゾ
ール、１−Ｎ−アセチルベンゾトリアゾール、１−ジメ
チルアミノメチルベンゾトリアゾールなどが挙げられる
。Examples of benzotriazole or its derivatives used in the present invention include benzotriazole, 1-oxybenzotriazole, 1-N-benzoyl-benzotriazole, 1-N-acetylbenzotriazole, 1-dimethylaminomethylbenzotriazole, etc. Can be mentioned.
ポリアミドイミド樹脂、アルコキシ変性７２ノ樹脂及び
ベンゾトリアゾール又はその誘導体の配合量は、ポリア
ミドイミド樹脂１００重量部に対してアルコキシ変性ア
ミノ樹脂１〜４０重量部、ベンゾトリアゾール又はその
誘導体０．０１〜０．７重量部の範囲とされる。アルコ
キシ変性アミノ樹脂及びベンゾトリアゾールの配合量が
上記よりも少ないと、十分に密着性が向上せず、また、
上記より多いと、逆に密着性が低下する。The blending amount of the polyamide-imide resin, alkoxy-modified 72 resin, and benzotriazole or its derivative is 1 to 40 parts by weight of the alkoxy-modified amino resin and 0.01 to 0.0 parts by weight of the alkoxy-modified amino resin and 0.01 to 0.0 parts by weight of the benzotriazole or its derivative. The range is 7 parts by weight. If the blending amount of the alkoxy-modified amino resin and benzotriazole is less than the above, the adhesion will not be sufficiently improved, and
If the amount is more than the above, the adhesion will be reduced.
ポリアミドイミド樹脂、アルコキシ変性アミノ樹脂及び
ベンゾトリアゾール又はその誘導体は、Ｎ−メチル−２
−ピロリドン、ジメチルホルムアミド、ジメチルアセト
アミド、クレゾールなどの極性溶剤に熔解し、好適な粘
度の塗料とする。Polyamideimide resin, alkoxy-modified amino resin and benzotriazole or its derivatives are N-methyl-2
- Dissolve in a polar solvent such as pyrrolidone, dimethylformamide, dimethylacetamide, cresol, etc. to form a paint of suitable viscosity.
更に、触媒として、トリエチルアミン、Ｎ−メチルモル
ホリン、トリメタノールアミン、ジエチルヒドロキシア
ミンなどのアミノ化合物をポリアミドイミド樹脂１００
重量部に対して０．０１〜２重量部添加するのが好まし
い。Furthermore, as a catalyst, an amino compound such as triethylamine, N-methylmorpholine, trimethanolamine, diethylhydroxyamine, etc. is added to the polyamideimide resin 100.
It is preferable to add 0.01 to 2 parts by weight per part by weight.
硬化剤として、ブロックイソシアネート、例えばコロネ
ー）２５０３、ＡＰＳステーフ゛ル（日、本ポリウレタ
ン工業社製）、エポキシ樹脂、例えばエピコート８２８
、エピコー）１００７ （シェル社製）などをポリア
ミドイミド樹脂１００重量部に対して２０重量部以下併
用してもよい。As a curing agent, block isocyanates such as Coronet 2503, APS staple (manufactured by Honpolyurethane Kogyo Co., Ltd., Japan), and epoxy resins such as Epicoat 828 are used.
, Epicor) 1007 (manufactured by Shell) or the like may be used in combination with 20 parts by weight or less per 100 parts by weight of the polyamideimide resin.
上記のようにして得られた塗料を銅板に塗布焼付けして
密着性に優れた耐熱性塗料被覆銅板を得る。銅板は塗布
前に、アセトン、クロロセンなどの溶剤でよく脱脂する
ことが必要がある。塗布法、焼付法には特に制限はない
が、２０〜３０μ程度の塗膜を焼付ける場合、２５０〜
３５０°Ｃで１０分〜６０分前後の焼付けが一般的であ
る。The paint obtained as described above is applied and baked on a copper plate to obtain a heat-resistant paint-coated copper plate with excellent adhesion. Copper plates must be thoroughly degreased with a solvent such as acetone or chlorocene before coating. There are no particular restrictions on the coating method or baking method, but when baking a coating film of about 20 to 30μ, 250 to
Baking at 350°C for about 10 to 60 minutes is common.
本発明に使用される銅板としては、銅単体からなる無酸
素銅、タフピッチ銅の他、銅−亜鉛系の丹銅、黄銅、銅
−錫系のりん青銅、銅−亜鉛−鉛系の快削黄銅、銅−亜
鉛−錫系のネーバル黄銅、銅−アルξニウル系のアルミ
ニウム青銅、銅−けい素青銅などが挙げられる。Copper plates used in the present invention include oxygen-free copper made of simple copper, tough pitch copper, red bronze made of copper-zinc, brass, phosphor bronze made of copper-tin, and free-cutting copper made of copper-zinc-lead. Examples include brass, copper-zinc-tin naval brass, copper-aluminum bronze, copper-silicon bronze, and the like.
次に、本発明を実施例及び比較例によりさらに詳しく説
明するが、本発明はこれに制限されるものではない。Next, the present invention will be explained in more detail with reference to Examples and Comparative Examples, but the present invention is not limited thereto.
比較例１
ポリアミトイ旦ドワニスＨ１−４０５−３０（日立化成
工業■製）をりん青銅板に塗布焼付けして耐熱性塗料被
覆りん青銅板を作製した。Comparative Example 1 A heat-resistant paint-coated phosphor bronze plate was prepared by applying polyamide varnish H1-405-30 (manufactured by Hitachi Chemical Co., Ltd.) to a phosphor bronze plate and baking it.
実施例１
Ｈｌ−４０５−３０、フラン−５２３（メトキシ化メラ
ミン樹脂、日立化成工業■製）、１−ジメチルアミノメ
チルベンゾトリアゾール、ジエチルヒドロキシアミン、
エピコート８２Ｂ （シェル社製）を重量比１００／’
７１０．２１０．５／２の割合で５０°Ｃで１時間部合
撹拌して塗料を調製した。Example 1 Hl-405-30, Furan-523 (methoxylated melamine resin, manufactured by Hitachi Chemical), 1-dimethylaminomethylbenzotriazole, diethylhydroxyamine,
Epicoat 82B (manufactured by Shell) at a weight ratio of 100/'
A paint was prepared by stirring in a ratio of 710.210.5/2 at 50° C. for 1 hour.
この塗料をりん青銅板に塗布焼付けして耐熱性塗料被覆
りん青銅板を作製した。This paint was applied to a phosphor bronze plate and baked to produce a heat-resistant paint-coated phosphor bronze plate.
実施例２
ボリアξトイミドワニスＨ１−４０６−３０（日立化成
工業■製）、サイノル３００ （メトキシ化メラミン樹
脂、アメリカンシアナミド社製）、ｌ−ジメチルアミノ
メチルベンゾトリアゾール、ジエチルヒドロキシアミン
、エピコート１００１（シェル社製）を重量比１００／
２０１０．１１０、５ ／ １の割合で５０’Ｃ″？！
１時間混合撹拌して塗料を調製した。この塗料をりん青
銅板に塗布焼付けして耐熱性塗料被覆りん青銅板を作製
した。Example 2 Boria ξ toimide varnish H1-406-30 (manufactured by Hitachi Chemical Co., Ltd.), Cynor 300 (methoxylated melamine resin, manufactured by American Cyanamid Co., Ltd.), l-dimethylaminomethylbenzotriazole, diethylhydroxyamine, Epicoat 1001 (Shell Co., Ltd.) (manufactured by) at a weight ratio of 100/
2010.110, 50'C'' at a rate of 5/1?!
A paint was prepared by mixing and stirring for 1 hour. This paint was applied to a phosphor bronze plate and baked to produce a heat-resistant paint-coated phosphor bronze plate.
実施例３
ポリアミドイミドワニスＨ１−４０５−３０（日立化成
工業■製）、フラン５２３（メトキシ化メラミン樹脂、
日立化成工業■製）、ｌ−ジメチルアごノメチルベンゾ
トリアゾール、ジエチルヒドロキシアミン、コロネー）
２５０３（７’ロツクイソシアネート、日本ポリウレタ
ン工業社製）を重量比１００／Ｉ Ｏｌｏ、４１０．３
１０．２の割合で５０°Ｃで１時間部合撹拌して塗料を
調製した。Example 3 Polyamide imide varnish H1-405-30 (manufactured by Hitachi Chemical Co., Ltd.), Furan 523 (methoxylated melamine resin,
Hitachi Chemical Co., Ltd.), l-dimethylagonomethylbenzotriazole, diethylhydroxyamine, coronet)
2503 (7' lock isocyanate, manufactured by Nippon Polyurethane Kogyo Co., Ltd.) at a weight ratio of 100/I Olo, 410.3
A coating was prepared by stirring the mixture at a ratio of 10.2 for 1 hour at 50°C.
この塗料をりん青銅板に塗布焼付けして耐熱性塗料被覆
りん青銅板を作製した。This paint was applied to a phosphor bronze plate and baked to produce a heat-resistant paint-coated phosphor bronze plate.
実施例４
実施例３と同様に作製した塗料を銅板に塗布焼付けし耐
熱性塗料被覆りん青銅板を作製した。Example 4 A paint prepared in the same manner as in Example 3 was applied to a copper plate and baked to produce a heat-resistant paint-coated phosphor bronze plate.
塗料の塗布焼付は条件を第１表に示し、密着性をＪＩＳ
Ｂ−０２０２に準じて測定し、評価結果を第２表に
示す。The conditions for applying and baking the paint are shown in Table 1, and the adhesion was determined according to JIS.
It was measured according to B-0202, and the evaluation results are shown in Table 2.
第 １ 表 塗膜の作製条件
注水
基材の寸法は、厚さ０．３ ａｍ、幅５１．Ｏｍａ＋、
長さ２００■であった。Table 1: Coating film production conditions The dimensions of the water-filled base material are 0.3 am thick and 51 mm wide. Oma+,
The length was 200cm.
第
表
密着性
第２表に示すように、本発明の実施例１〜４でで示され
る耐熱性塗料被覆銅板の密着性は、クロスカット残率が
１００％で、比較例１のクロスカット残率が０％と比較
して著しく向上している。Table Adhesion As shown in Table 2, the adhesion of the heat-resistant paint-coated copper plates shown in Examples 1 to 4 of the present invention is as follows: when the cross-cut residual ratio is 100%, and the cross-cut residual ratio of Comparative Example 1 is 100%. The rate is significantly improved compared to 0%.
本発明の耐熱性塗料は、銅板に対する密着性に優れてお
り、密着゛性向上のための各種の表面調整を行うことな
く、密着性の高い被覆銅板を提供することができる。The heat-resistant paint of the present invention has excellent adhesion to a copper plate, and can provide a coated copper plate with high adhesion without performing various surface adjustments to improve adhesion.
したがって、本発明によれば、従来、密着性に難のあっ
たボリアξトイミド被覆銅板の実用化が可能となり、工
業的に大きな意味を持つものである。Therefore, according to the present invention, it is possible to put into practical use a copper plate coated with boria ξ toimide, which has hitherto had difficulty in adhesion, and is of great industrial significance.
Claims (1)
性アミノ樹脂１〜４０重量部及びベンゾトリアゾール又
はその誘導体０．０１〜０．７重量部を含んでなる耐熱
性塗料。 ２、アルコキシ変性アミノ樹脂がメトキシ化メラミン樹
脂である請求項１記載の耐熱性塗料。 ３、請求項１記載の塗料を塗布焼付けして得られる被覆
銅板。[Scope of Claims] 1. A heat-resistant paint comprising 100 parts by weight of a polyamide-imide resin, 1 to 40 parts by weight of an alkoxy-modified amino resin, and 0.01 to 0.7 parts by weight of benzotriazole or its derivative. 2. The heat-resistant paint according to claim 1, wherein the alkoxy-modified amino resin is a methoxylated melamine resin. 3. A coated copper plate obtained by coating and baking the paint according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17162389A JPH0337283A (en) | 1989-07-03 | 1989-07-03 | Heat-resistant coating material and copper sheet coated therewith |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17162389A JPH0337283A (en) | 1989-07-03 | 1989-07-03 | Heat-resistant coating material and copper sheet coated therewith |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0337283A true JPH0337283A (en) | 1991-02-18 |
Family
ID=15926610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17162389A Pending JPH0337283A (en) | 1989-07-03 | 1989-07-03 | Heat-resistant coating material and copper sheet coated therewith |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0337283A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002072673A2 (en) * | 2001-03-14 | 2002-09-19 | E.I. Dupont De Nemours And Company | Coating solutions suitable for improving the adhesion of nylon coatings and processes for the application thereof |
| JP2003056588A (en) * | 2001-08-21 | 2003-02-26 | Koyo Seiko Co Ltd | Jointing member |
| US6734361B2 (en) | 2000-02-10 | 2004-05-11 | The Furukawa Electric Co., Ltd. | Insulated wire |
| WO2010071107A1 (en) * | 2008-12-15 | 2010-06-24 | 宇部興産株式会社 | Thermosetting modified polyamide resin composition |
-
1989
- 1989-07-03 JP JP17162389A patent/JPH0337283A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6734361B2 (en) | 2000-02-10 | 2004-05-11 | The Furukawa Electric Co., Ltd. | Insulated wire |
| WO2002072673A2 (en) * | 2001-03-14 | 2002-09-19 | E.I. Dupont De Nemours And Company | Coating solutions suitable for improving the adhesion of nylon coatings and processes for the application thereof |
| WO2002072673A3 (en) * | 2001-03-14 | 2003-02-13 | Du Pont | Coating solutions suitable for improving the adhesion of nylon coatings and processes for the application thereof |
| JP2003056588A (en) * | 2001-08-21 | 2003-02-26 | Koyo Seiko Co Ltd | Jointing member |
| WO2010071107A1 (en) * | 2008-12-15 | 2010-06-24 | 宇部興産株式会社 | Thermosetting modified polyamide resin composition |
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