JPH0337237Y2 - - Google Patents

Info

Publication number
JPH0337237Y2
JPH0337237Y2 JP11361085U JP11361085U JPH0337237Y2 JP H0337237 Y2 JPH0337237 Y2 JP H0337237Y2 JP 11361085 U JP11361085 U JP 11361085U JP 11361085 U JP11361085 U JP 11361085U JP H0337237 Y2 JPH0337237 Y2 JP H0337237Y2
Authority
JP
Japan
Prior art keywords
heat
sealed
cavity
condensable fluid
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11361085U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6221542U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11361085U priority Critical patent/JPH0337237Y2/ja
Publication of JPS6221542U publication Critical patent/JPS6221542U/ja
Application granted granted Critical
Publication of JPH0337237Y2 publication Critical patent/JPH0337237Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP11361085U 1985-07-24 1985-07-24 Expired JPH0337237Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11361085U JPH0337237Y2 (enrdf_load_stackoverflow) 1985-07-24 1985-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11361085U JPH0337237Y2 (enrdf_load_stackoverflow) 1985-07-24 1985-07-24

Publications (2)

Publication Number Publication Date
JPS6221542U JPS6221542U (enrdf_load_stackoverflow) 1987-02-09
JPH0337237Y2 true JPH0337237Y2 (enrdf_load_stackoverflow) 1991-08-07

Family

ID=30995577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11361085U Expired JPH0337237Y2 (enrdf_load_stackoverflow) 1985-07-24 1985-07-24

Country Status (1)

Country Link
JP (1) JPH0337237Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6221542U (enrdf_load_stackoverflow) 1987-02-09

Similar Documents

Publication Publication Date Title
JP3651790B2 (ja) 高密度チップ実装用装置
US6976527B2 (en) MEMS microcapillary pumped loop for chip-level temperature control
TW591984B (en) Micro-circulating flow channel system and its manufacturing method
US4995451A (en) Evaporator having etched fiber nucleation sites and method of fabricating same
TWI247873B (en) Flat heat transferring device and method of fabricating the same
US5223747A (en) Heat dissipating device
CN209822624U (zh) 一种微通道-纳米多孔复合结构蒸发器
US7842553B2 (en) Cooling micro-channels
JP2004518269A (ja) 冷却装置及びその製造プロセス
US20070190685A1 (en) Cooling facility and method for integrated circuit
JPH0338838Y2 (enrdf_load_stackoverflow)
JPH0337237Y2 (enrdf_load_stackoverflow)
JP3178288B2 (ja) 冷却モジュールおよびその製造方法
JPH0334951Y2 (enrdf_load_stackoverflow)
Meyer et al. A silicon-carbide micro-capillary pumped loop for cooling high power devices
JPH0337238Y2 (enrdf_load_stackoverflow)
JP2559212B2 (ja) 熱伝導性の良い集積回路用基板
JPS61265850A (ja) 熱伝導率の良い集積回路用基板
JPS6216551A (ja) 熱伝導率の良い集積回路用基板の製法
JPS629650A (ja) 熱伝導率の良い集積回路用基板の製法
JPH03273669A (ja) 冷却機構付き半導体装置
JPS629651A (ja) 熱伝導性の良い集積回路用基板の製法
JPH0682768B2 (ja) 放熱制御装置
JPH0310706Y2 (enrdf_load_stackoverflow)
US6620735B2 (en) Method for processing substrates