JPH0336761U - - Google Patents
Info
- Publication number
- JPH0336761U JPH0336761U JP3640789U JP3640789U JPH0336761U JP H0336761 U JPH0336761 U JP H0336761U JP 3640789 U JP3640789 U JP 3640789U JP 3640789 U JP3640789 U JP 3640789U JP H0336761 U JPH0336761 U JP H0336761U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- main body
- measuring element
- sizing device
- biasing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004513 sizing Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3640789U JPH0336761U (da) | 1989-03-31 | 1989-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3640789U JPH0336761U (da) | 1989-03-31 | 1989-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0336761U true JPH0336761U (da) | 1991-04-10 |
Family
ID=31542609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3640789U Pending JPH0336761U (da) | 1989-03-31 | 1989-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0336761U (da) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006334276A (ja) * | 2005-06-06 | 2006-12-14 | Reiko Fujita | 歯ブラシ装置 |
| JP2007222986A (ja) * | 2006-02-23 | 2007-09-06 | Disco Abrasive Syst Ltd | 研削装置 |
| JP2010167532A (ja) * | 2009-01-22 | 2010-08-05 | Disco Abrasive Syst Ltd | 研削装置のチャックテーブルの基準位置確認方法 |
| JP2015102365A (ja) * | 2013-11-22 | 2015-06-04 | 株式会社ディスコ | ワーク厚み測定器 |
| JP2018027597A (ja) * | 2016-08-18 | 2018-02-22 | 株式会社ディスコ | 測定治具 |
| TWI723293B (zh) * | 2018-04-19 | 2021-04-01 | 南韓商舒語科技股份有限公司 | 半導體封裝件研磨機的研磨厚度調節裝置及方法 |
-
1989
- 1989-03-31 JP JP3640789U patent/JPH0336761U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006334276A (ja) * | 2005-06-06 | 2006-12-14 | Reiko Fujita | 歯ブラシ装置 |
| JP4522324B2 (ja) * | 2005-06-06 | 2010-08-11 | 玲子 藤田 | 歯ブラシ装置 |
| JP2007222986A (ja) * | 2006-02-23 | 2007-09-06 | Disco Abrasive Syst Ltd | 研削装置 |
| JP2010167532A (ja) * | 2009-01-22 | 2010-08-05 | Disco Abrasive Syst Ltd | 研削装置のチャックテーブルの基準位置確認方法 |
| JP2015102365A (ja) * | 2013-11-22 | 2015-06-04 | 株式会社ディスコ | ワーク厚み測定器 |
| JP2018027597A (ja) * | 2016-08-18 | 2018-02-22 | 株式会社ディスコ | 測定治具 |
| TWI723293B (zh) * | 2018-04-19 | 2021-04-01 | 南韓商舒語科技股份有限公司 | 半導體封裝件研磨機的研磨厚度調節裝置及方法 |