JPH0335608U - - Google Patents
Info
- Publication number
- JPH0335608U JPH0335608U JP9667089U JP9667089U JPH0335608U JP H0335608 U JPH0335608 U JP H0335608U JP 9667089 U JP9667089 U JP 9667089U JP 9667089 U JP9667089 U JP 9667089U JP H0335608 U JPH0335608 U JP H0335608U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- metal tape
- metal
- coated
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9667089U JPH0335608U (de) | 1989-08-21 | 1989-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9667089U JPH0335608U (de) | 1989-08-21 | 1989-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0335608U true JPH0335608U (de) | 1991-04-08 |
Family
ID=31645859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9667089U Pending JPH0335608U (de) | 1989-08-21 | 1989-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0335608U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101456673B1 (ko) * | 2007-09-11 | 2014-11-03 | 삼성전자주식회사 | 테입 구조물 및 이를 이용한 웨이퍼 분리 방법 및 장치 |
-
1989
- 1989-08-21 JP JP9667089U patent/JPH0335608U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101456673B1 (ko) * | 2007-09-11 | 2014-11-03 | 삼성전자주식회사 | 테입 구조물 및 이를 이용한 웨이퍼 분리 방법 및 장치 |
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