JPH0333114A - Heat-resistant resin composition - Google Patents
Heat-resistant resin compositionInfo
- Publication number
- JPH0333114A JPH0333114A JP1169302A JP16930289A JPH0333114A JP H0333114 A JPH0333114 A JP H0333114A JP 1169302 A JP1169302 A JP 1169302A JP 16930289 A JP16930289 A JP 16930289A JP H0333114 A JPH0333114 A JP H0333114A
- Authority
- JP
- Japan
- Prior art keywords
- acrylate
- meth
- heat
- structural formula
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 12
- 229920006015 heat resistant resin Polymers 0.000 title claims abstract description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims description 10
- 239000003999 initiator Substances 0.000 abstract description 5
- 230000001588 bifunctional effect Effects 0.000 abstract description 4
- 230000003287 optical effect Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 30
- 239000000463 material Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 150000002978 peroxides Chemical class 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- RGBXDEHYFWDBKD-UHFFFAOYSA-N propan-2-yl propan-2-yloxy carbonate Chemical compound CC(C)OOC(=O)OC(C)C RGBXDEHYFWDBKD-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- -1 thioxanthone Chemical class 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は光で記録、再生、消去を行う光デイスク基板と
して主に用いられる耐熱性樹脂組成物に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a heat-resistant resin composition mainly used as an optical disk substrate for recording, reproducing, and erasing using light.
従来の技術
近年コンピュータ用メモリー素子として光ディスクが注
目を浴びその実用化が強く望まれている。2. Description of the Related Art In recent years, optical disks have attracted attention as memory devices for computers, and their practical use is strongly desired.
その中で、ディスク基板の成形方法についてみると、ポ
リカーボネイトやＰＭＭＡに代表される熱可塑性樹脂に
よる射出成形や、ガラスやエポキシ基板上にフォトポリ
マー法〈以下２Ｐ法と略す〉により記録溝を形成する方
法などが主流を占めている。Among these methods, recording grooves are formed by injection molding using thermoplastic resin such as polycarbonate or PMMA, or by photopolymer method (hereinafter abbreviated as 2P method) on a glass or epoxy substrate. methods are predominant.
更に、ディスク構成についてみると、従来の基板用材料
ではその耐熱性が不十分であり、書込み消去時の強力な
レーザ光により瞬時にして記録膜が数百℃まで上昇し、
伝熱によりその熱が基板に伝えられ、基板そのものの劣
化や軟化、熱分解によるガス発生などが起こり、記録膜
に穴が開いたりしていた。それを防ぐため、基板と記録
膜との間に断熱層を形成して基板への熱応力を低減させ
ているが、この場合ディスク構造がたいへん複雑となっ
ていた。Furthermore, regarding the disk structure, the heat resistance of conventional substrate materials is insufficient, and the recording film can instantly heat up to hundreds of degrees Celsius due to the powerful laser beam during writing and erasing.
The heat was transferred to the substrate, causing deterioration and softening of the substrate itself, gas generation due to thermal decomposition, and holes in the recording film. In order to prevent this, a heat insulating layer is formed between the substrate and the recording film to reduce thermal stress on the substrate, but in this case the disk structure has become very complicated.
発明が解決しようとする課題
しかしながら射出成形においては成形時樹脂に高圧をか
けるため、溝を転写するスタンパ−の寿命が短くなる。Problems to be Solved by the Invention However, in injection molding, high pressure is applied to the resin during molding, which shortens the life of the stamper that transfers the grooves.
また、金型内での樹脂の流れにより分子傾向が生じ複屈
折が大きくなったり、分布を持ったりしていた。更には
、材料中に混入した異物を除去することが困難であるこ
となどが問題となっていた。In addition, the flow of the resin within the mold causes molecular trends, resulting in increased birefringence and distribution. Furthermore, there has been a problem that it is difficult to remove foreign substances mixed into the material.
一方、２Ｐ法においては、確かにガラス基板やエポキシ
基板を用い、その上に２Ｐ材料を注入、硬化させるため
２Ｐ材材料体は反応性材料であり、成形直前に洗浄や濾
過などにより材料中の異物は除去できるが、ガラス基板
においては基板の生産タクト、コストが高くなり、エポ
キシ基板においてはエポキシ樹脂の硬化時間が長いこと
（数時間〜数十時間）や離型性が悪いことなどが問題と
なっている。On the other hand, in the 2P method, it is true that a glass substrate or epoxy substrate is used, and the 2P material is injected onto it and cured, so the 2P material body is a reactive material, and the material is washed or filtered immediately before molding. Foreign matter can be removed, but with glass substrates, the production takt time and cost are high, and with epoxy substrates, there are problems such as the long curing time of the epoxy resin (several hours to several tens of hours) and poor mold releasability. It becomes.
更に、ディスク構成からみると、熱可塑性樹脂や２Ｐ材
料はその耐熱性が不十分であり、基板又は２Ｐ上に必ず
断熱層を形成し、その上に記録膜を形成して基板を保護
する必要がある。その断熱層はスパッタなどにより真空
成膜するため、形成するのに多くの問題がかかり、量産
に適したディスク構造とはなっていなかった。Furthermore, from the perspective of the disk structure, thermoplastic resins and 2P materials have insufficient heat resistance, so it is necessary to form a heat insulating layer on the substrate or 2P, and to protect the substrate by forming a recording film on top of it. There is. Since the heat insulating layer is formed in a vacuum using sputtering or the like, there are many problems involved in forming the layer, and the disk structure is not suitable for mass production.
そこで本発明は上記問題点を解決することを目的とし、
６官能〈メタ〉アクリレートと、４官能（メタ）アクリ
レートと、３官能（メタ〉アクリレートと、２官能アク
リレートと、１１以上のラジカル重合開始剤より成る耐
熱性樹脂組成物を提供するものである。ここで〈メタ〉
アクリレートとはアクリレートとメタアクリレートを意
味する。Therefore, the present invention aims to solve the above problems,
The present invention provides a heat-resistant resin composition comprising a hexafunctional (meth)acrylate, a tetrafunctional (meth)acrylate, a trifunctional (meth)acrylate, a bifunctional acrylate, and 11 or more radical polymerization initiators. Here <meta>
Acrylate means acrylate and methacrylate.
課題を解決するための手段
上記課題を解決するために本発明の耐熱性樹脂組成物は
、構造式（１）
で示される６官能〈メタ）アクリレートと、構造式（ｎ
）
〜
で示される３官能（メタ〉
アク
Ｊレートと、
構造式（ＩＩＩ）
で示される４官能（メタ）アクリレートと、構造式（Ｉ
Ｖ）
曙十〇−４
で示される２官能アクリレートと、
１種以上のう
ジカル重合開始剤とから構成されているものである。Means for Solving the Problems In order to solve the above problems, the heat-resistant resin composition of the present invention comprises a hexafunctional <meth)acrylate represented by the structural formula (1) and a structural formula (n
) ~ A trifunctional (meth)acrylate represented by ~, a tetrafunctional (meth)acrylate represented by the structural formula (III), and a structural formula (I
V) It is composed of a bifunctional acrylate shown by Akebono 10-4 and one or more kinds of dical polymerization initiators.
更に、構造式（１）の配合量としては、反応性。Furthermore, the amount of structural formula (1) to be blended depends on the reactivity.
硬化収縮等を考慮すると全樹脂量の３０ｗｔ％以下が好
ましく、より好ましくは全樹脂量の１０〜２０ｗｔ％の
範囲にある方が良い。また、構造式（ｎ）の配合量とし
ては、全樹脂量の２０〜５０ｗｔ％が好ましく、より好
ましくは３０〜５０ｗｔ％の範囲にある方が良い。構造
式（ＩＩＩ）の配合量としては、全樹脂量の２０ｗｔ％
以下が好ましく、より好ましくは５〜１５ｗｔ％の範囲
にある方が良い。構造式（ＩＶ）の配合量としては、フ
ェニル基に由来する複屈折を考慮すると全樹脂量の４０
ｗｔ％以下が好ましく、より好ましくは１０〜３０ｗｔ
％の範囲にある方が良い。Considering curing shrinkage and the like, the amount is preferably 30 wt% or less of the total resin amount, and more preferably 10 to 20 wt% of the total resin amount. The amount of structural formula (n) is preferably 20 to 50 wt% of the total resin amount, more preferably 30 to 50 wt%. The amount of structural formula (III) is 20 wt% of the total resin amount.
The content is preferably below, more preferably in the range of 5 to 15 wt%. Considering the birefringence derived from the phenyl group, the amount of Structural Formula (IV) should be 40% of the total resin amount.
Preferably less than wt%, more preferably 10 to 30 wt
It is better to be in the % range.
更に、必要に応じ粘度調整用（メタ）アクリレートを２
０ ｗ ｔ％の範囲で使用可能であり、その粘度調整用
（メタ）アクリレートとして、２゜２゛−ビス（４−（
Ｂ−（メタ）アクリロイルオキシ）シクロヘキシル〕プ
ロパン、２−２゛−ビス（４−（Ｂ （メタ）アクリロ
イルオキシジェトキシ）シクロヘキシル】プロパン、１
．４−ビス（（メタ）アクリロイルオキシメチル）シク
ロヘキサン、トリメチロールプロパントリ（メタ）アク
リレート、ネオペンチルグリコールジ（メタ）アクリレ
ート、１．６−ヘキサンシオールジ（メタ）アクリレー
ト、ジエチレングリコールジ（メタ）アクリレート等の
多官能（メタ）アクリレートや、シクロヘキシル（メタ
）アクリレート、ジシクロペンテニル（メタ）アクリレ
ート、ジシクロペンテニルオキシエチル（メタ）アクリ
レート、トリシクロ（５，２，１，０）デカン（メタ）
アクリレート等の半盲 能（メタ）アクリレートの単体
又はそれらの混合物であることが良い。Furthermore, if necessary, add (meth)acrylate for viscosity adjustment.
It can be used in the range of 0 wt%, and 2゜2゛-bis(4-(
B-(meth)acryloyloxy)cyclohexyl]propane, 2-2゛-bis(4-(B(meth)acryloyloxyjethoxy)cyclohexyl]propane, 1
．． 4-bis((meth)acryloyloxymethyl)cyclohexane, trimethylolpropane tri(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanethiol di(meth)acrylate, diethylene glycol di(meth)acrylate, etc. polyfunctional (meth)acrylates, cyclohexyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, tricyclo(5,2,1,0)decane (meth)
It is preferable to use a single hemianopic (meth)acrylate such as acrylate or a mixture thereof.
重合方法としては、熱重合、光重合（紫外線（ＵＶ））
、光、熱の併用した重合等全て使用可能であり、特に
限定されない。また、重合開始剤もラジカル重合開始剤
であれば特に限定されず、一例をあげるならば、過酸化
ベンゾイル、ジイソプロピルパーオキシカーボネート、
ラウロイルパーオキサイド、デイクミルパーオキサイド
。Polymerization methods include thermal polymerization, photopolymerization (ultraviolet (UV))
, polymerization using light, heat, etc. can all be used, and there are no particular limitations. In addition, the polymerization initiator is not particularly limited as long as it is a radical polymerization initiator, and examples include benzoyl peroxide, diisopropyl peroxycarbonate,
Lauroyl peroxide, Deikmil peroxide.
ターシャリ−ブチルパーオキシビバレート等の過酸化物
、アゾビスイソブチロニトリル等のアゾ化合物、ベンゾ
フェノン、ベンゾインエチルエーテル、ベンジル、アセ
トフェノン、アントラキノイン等の光増感剤、チオキサ
ントン等の硫黄化合物等公知のラジカル開始剤は使用可
能であり、単独又は２種以上併用することも可能である
。Peroxides such as tert-butyl peroxyvivalate, azo compounds such as azobisisobutyronitrile, photosensitizers such as benzophenone, benzoin ethyl ether, benzyl, acetophenone, anthraquinoin, sulfur compounds such as thioxanthone, etc. Known radical initiators can be used, and can be used alone or in combination of two or more.
開始剤量としては、１種当り全樹脂量の１．５ｗｔ％以
下であり、その全開始剤量としては、全樹脂量に大志０
．Ｏ１〜３ ｗ ｔ％の範囲内で用い、より好ましくは
、光増感剤としては１種当たり０．１〜Ｑ、５ｗｔ％、
過酸化物としては１種当り０．５〜１．２ｗｔ％である
。また９重合温度（ＵＶ硬化も含む）は０〜３００℃で
より好ましくは２０〜２００℃である。The amount of initiator is 1.5 wt% or less of the total resin amount per type, and the total amount of initiator is 0.
．． Used within the range of O1 to 3 wt%, more preferably 0.1 to Q per type as a photosensitizer, 5 wt%,
The amount of peroxide is 0.5 to 1.2 wt% per type. Further, the polymerization temperature (including UV curing) is 0 to 300°C, more preferably 20 to 200°C.
重合雰囲気としては、空気中、不活性ガス中、真空中い
ずれも行うことができるが、硬化物の熱分解、酸化９重
合禁止などを考慮すると不活性ガス中、真空中又は、そ
の併用が好ましい。The polymerization atmosphere can be carried out in air, inert gas, or vacuum, but in consideration of thermal decomposition of the cured product and inhibition of oxidation 9 polymerization, inert gas, vacuum, or a combination thereof is preferable. .
作 用
本発明は上記した構成によって反応性液状材料となるた
め、材料中に混入している異物は濾過により除去される
と共に、単官能および多官能（メタ）アクリレート上り
構成されているため、エポキシ樹脂に比較し著しく硬化
時間が短縮（数時間→数秒〜数十分）でき、かつ、離型
性も向上するため生産タクトの向上が図れるとともに、
射出成形のように成形時に実大な圧力をかけて樹脂を溝
転写用スタンパ−上に流す必要がな（、大気圧〜微小加
圧（１ｋｇ／ｃｊ以下）ですむため、ガラス型などの簡
易型や成形装置の小型化が可能となりクリーンルーム内
での作業性に適し、更にスタンパ−寿命も大幅に伸ばす
ことが可能となった。更に、ディスクの構造についてみ
ると、本発明の耐熱性樹脂組成物によるディスク基板は
その耐熱性が従来のディスク基板用材料に比較し著しく
高いため、基板保護のためにディスク基板上に断熱層を
形成する必要がなくなり、ディスク構造の単純化とそれ
に伴う生産性向上、コストダウン更には信頼性の向上を
図ることができた。Effect Since the present invention becomes a reactive liquid material with the above-described structure, foreign substances mixed in the material are removed by filtration, and since it is composed of monofunctional and polyfunctional (meth)acrylates, epoxy Compared to resins, curing time can be significantly shortened (from several hours to several seconds to several tens of minutes), and the mold releasability is also improved, so production tact can be improved.
Unlike injection molding, there is no need to apply enormous pressure during molding to flow the resin onto the stamper for groove transfer. It has become possible to downsize the mold and molding equipment, making it suitable for workability in clean rooms, and it has also become possible to significantly extend the life of the stamper.Furthermore, regarding the structure of the disk, the heat-resistant resin composition of the present invention Since the heat resistance of the disk substrate made of solid material is significantly higher than that of conventional disk substrate materials, there is no need to form a heat insulating layer on the disk substrate to protect the substrate, which simplifies the disk structure and increases productivity. We were able to improve the performance, reduce costs, and improve reliability.
実施例 以下、本発明の実施例について説明する。Example Examples of the present invention will be described below.
本実施例に用いた構造式（１）に用いた化合物として、
新中村化学工業（株の商品名ニスラミンＮ−６Ａ（以下
Ｎ−６Ａと略す）を、構造式（ｎ）に用いた化合物とし
て、同ニスラミンＮ−３Ｍ （以下Ｎ−３Ｍと略す）を
、構造式（ＩＩＩ）に用いた化合物として、テトラメチ
ロールメタンテトラアクリレート（新中村化学工業（掬
の商品名、ＮＫエステルＡ−ＴＭＭＴ以下Ａ−ＴＭＭＴ
と略す）を、構造式（ＩＶ）に用いた化合物として、共
栄社油脂化学工業■製の商品名ＢＰ４ＥＡを、光重合開
始剤としてチバガイギー社製の商品名１ ｒｇａｃｕｒ
ｅ １８４を、熱重合開始剤としてデイクミルパーオキ
サイド（ＤＣＰ○と略す〉。日本油脂（掬製の商品名パ
ークミルＤを用いた。As a compound used in structural formula (1) used in this example,
Nislamin N-6A (hereinafter abbreviated as N-6A) manufactured by Shin Nakamura Chemical Industry Co., Ltd. is used as a compound with the structural formula (n), and Nislamin N-3M (hereinafter abbreviated as N-3M) is used as a compound with the structure The compound used in formula (III) was tetramethylolmethanetetraacrylate (trade name of Shin Nakamura Chemical Co., Ltd.
), the compound used in structural formula (IV) was BP4EA (trade name, manufactured by Kyoeisha Yushi Kagaku Kogyo ■), and the photopolymerization initiator was 1 rgacur (trade name, manufactured by Ciba Geigy).
e 184 and Deicmil peroxide (abbreviated as DCP○) as a thermal polymerization initiator. Percmill D (trade name, manufactured by Nippon Oil & Fats Co., Ltd.) was used.
全樹脂量を１００重量部とした時、構造式（１）および
（Ｉｔ）の占める組織割合は各々３０重量部以下、５０
重量部以下が好ましくそれ以上増加すると硬化物にクラ
ックが入ったりして基板成形がむつかしくなる。また、
構造式（ＩＩＩ）は室温でワックス状態となるため、２
０重量部以上配合すると偏析することがある。構造式（
ＩＶ）は、４０！量部以上入れると複屈折が大きくなる
ため、４０重量部以下にする必要がある。When the total resin amount is 100 parts by weight, the structural formulas (1) and (It) occupy 30 parts by weight or less and 50 parts by weight, respectively.
The amount is preferably less than 1 part by weight, and if it increases more than that, cracks may appear in the cured product, making it difficult to mold the substrate. Also,
Structural formula (III) is in a wax state at room temperature, so 2
If 0 parts by weight or more is added, segregation may occur. Structural formula(
IV) is 40! If more than 40 parts by weight is added, birefringence will increase, so it is necessary to use 40 parts by weight or less.
評価としては、第１図に示したように、各組成比の基板
２〈厚み１．２ｍ）を作成しＴｅ、Ｇｅ。For evaluation, as shown in FIG. 1, substrates 2 (thickness: 1.2 m) with various composition ratios were prepared, including Te and Ge.
ｓｂ系の記録膜３と反射層４を所定膜厚真空成膜し、基
板側上りレーザービーム１を照射し、記録パワー８ ｍ
Ｗ 、消去ワワー８ｍＷと２ ｍ Ｗの２回照射を行
い記ｔ！／消去を行い、これを１サイクルとして記録時
の反射率と消去時の反射率の差がＯになった時をライフ
エンドとして、そのサイクル数を比較し、サイクル数１
０５回以上を合格とした。An sb-based recording film 3 and a reflective layer 4 are deposited in a vacuum to a predetermined thickness, and the substrate side is irradiated with an upward laser beam 1 at a recording power of 8 m.
W, erase power was irradiated twice with 8 mW and 2 mW. / Erasing is performed, and this is regarded as one cycle.When the difference between the reflectance at the time of recording and the reflectance at the time of erasure becomes O is the life end, the number of cycles is compared, and the number of cycles is 1.
05 times or more was considered a pass.
基板成形としては、紫外線を３０００ ｍ Ｊ ／ ｃ
ｕｔ照射後、型上り脱型して、熱硬化（２００℃２時間
、Ｎ２雰囲気中）を行い基板を完全硬化させた。For substrate molding, ultraviolet rays are used at 3000 mJ/c.
After the UT irradiation, the mold was removed and thermally cured (200° C. for 2 hours in a N2 atmosphere) to completely cure the substrate.
結果を第１表に示した。The results are shown in Table 1.
１ノ・７Ｚ、Ｆ 会合） 発明の効果 以上のように本発明は、構造式（１）、（ｎ）。1no.7Z, F meeting) Effect of the invention As described above, the present invention relates to structural formulas (1) and (n).
（ＩＩＩ）、 （ＩＶ）で示される多官能（メタ）アク
リレートをラジカル重合開始剤により共重合させること
により、耐熱性を著しく向上させ、従来必要とされてい
た基板保護用の断熱層が不要となり、基板に直接記録膜
を成膜できることが可能となり、真空成膜装置の台数の
削減やクリアルーム。内での設備スペースの削減が可能
となり大幅なコストダウンが図られた。また、この材料
を用いたディスク基板成形プロセスは、クリーンルーム
内での作業に適した小型、小スペースのディスク基板成
形システムにすることが可能になった。更に、反応性液
状材料の特徴を生かし、クリーン度を保つことにより、
ディスク基板中の異物混入量がポリカーボネート基板に
比較し１／１０以下となり、ピットエラーレートも１オ
一ダ以上低減できた。また、多官能（メタ）アクリレー
トが主成分であるため遊離モノマー（未反応モノマー）
が極めて少なく、記録膜の腐食もなく信頼性の高いディ
スク基板ができた。By copolymerizing the polyfunctional (meth)acrylates represented by (III) and (IV) with a radical polymerization initiator, heat resistance is significantly improved, and the conventionally required heat insulating layer for protecting the substrate is no longer required. , it becomes possible to deposit a recording film directly on the substrate, reducing the number of vacuum deposition equipment and clear room. This made it possible to reduce the equipment space within the company, resulting in significant cost reductions. In addition, the disk substrate molding process using this material has made it possible to create a compact, small-space disk substrate molding system suitable for work in a clean room. Furthermore, by taking advantage of the characteristics of reactive liquid materials and maintaining cleanliness,
The amount of foreign matter mixed into the disk substrate was reduced to 1/10 or less compared to a polycarbonate substrate, and the pit error rate was also reduced by more than one order of magnitude. In addition, since polyfunctional (meth)acrylate is the main component, free monomers (unreacted monomers)
A highly reliable disk substrate with very little corrosion and no corrosion of the recording film was created.
図は本発明の一実施例における記録装置の構成図である
。
１・・・・・・レーザービーム、２・・・・・・基板、
３・・・・・・記録膜、４・・・・・・反射膜。The figure is a configuration diagram of a recording apparatus in an embodiment of the present invention. 1... Laser beam, 2... Substrate,
3...Recording film, 4...Reflection film.
Claims (6)
I） ▲数式、化学式、表等があります▼ Ｒ＿８、Ｒ＿９、Ｒ＿１＿０は▲数式、化学式、表等が
あります▼ ▲数式、化学式、表等があります▼ で示される３官能（メタ）アクリレートと 構造式（III） ▲数式、化学式、表等があります▼ Ｒ＿１＿２、Ｒ＿１＿３、Ｒ＿１＿４、Ｒ＿１＿５は▲
数式、化学式、表等があります▼で示される４官能（メ
タ）アクリレートと 構造式（IV） ▲数式、化学式、表等があります▼ で示される２官能アクリレートと、ラジカル重合開始剤
とより成る耐熱性樹脂組成物。(1) Structural formula (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼ A hexafunctional (meth)acrylate shown by the structural formula (I)
I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼ R_8, R_9, R_1_0 are ▲There are mathematical formulas, chemical formulas, tables, etc.▼ ▲There are mathematical formulas, chemical formulas, tables, etc.▼ The trifunctional (meth)acrylate and structural formula shown by (III) ▲There are mathematical formulas, chemical formulas, tables, etc.▼ R_1_2, R_1_3, R_1_4, R_1_5 are ▲
There are mathematical formulas, chemical formulas, tables, etc. ▼A heat-resistant product consisting of a tetrafunctional (meth)acrylate shown by ▼, a structural formula (IV) ▲A mathematical formula, chemical formula, tables, etc. shown▼ and a difunctional acrylate shown by ▼ and a radical polymerization initiator resin composition.
が全樹脂量の３０ｗｔ％以下である請求項１記載の耐熱
性樹脂組成物。(2) The heat-resistant resin composition according to claim 1, wherein the (meth)acrylate represented by structural formula (I) is 30 wt% or less of the total resin amount.
全樹脂量の２０ｗｔ％以上５０ｗｔ％以下である請求項
１記載の耐熱性樹脂組成物。(3) The heat-resistant resin composition according to claim 1, wherein the (meth)acrylate represented by structural formula (II) is 20 wt% or more and 50 wt% or less of the total resin amount.
が全樹脂量の２０ｗｔ％以下である請求項１記載の耐熱
性樹脂組成物。(4) The heat-resistant resin composition according to claim 1, wherein the (meth)acrylate represented by structural formula (III) is 20 wt% or less of the total resin amount.
の４０ｗｔ％以下である請求項１記載の耐熱性樹脂組成
物。(5) The heat-resistant resin composition according to claim 1, wherein the acrylate represented by structural formula (IV) is 40 wt% or less of the total resin amount.
し、ラジカル重合開始剤１種当たり、全樹脂量の１．５
ｗｔ％以下である請求項１記載の耐熱性樹脂組成物。(6) Contains at least one type of radical polymerization initiator, and 1.5 of the total resin amount per type of radical polymerization initiator
The heat-resistant resin composition according to claim 1, which has a content of % by weight or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1169302A JPH0333114A (en) | 1989-06-29 | 1989-06-29 | Heat-resistant resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1169302A JPH0333114A (en) | 1989-06-29 | 1989-06-29 | Heat-resistant resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0333114A true JPH0333114A (en) | 1991-02-13 |
Family
ID=15884011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1169302A Pending JPH0333114A (en) | 1989-06-29 | 1989-06-29 | Heat-resistant resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0333114A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6336266B1 (en) | 1999-03-17 | 2002-01-08 | Tdk Corporation | Electronic parts insertion head and electronic parts insertion device |
| EP2128144A1 (en) * | 2008-05-30 | 2009-12-02 | Basf Se | Amphiphilic molecules with a triazine core |
-
1989
- 1989-06-29 JP JP1169302A patent/JPH0333114A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6336266B1 (en) | 1999-03-17 | 2002-01-08 | Tdk Corporation | Electronic parts insertion head and electronic parts insertion device |
| EP2128144A1 (en) * | 2008-05-30 | 2009-12-02 | Basf Se | Amphiphilic molecules with a triazine core |
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