JPH0331083Y2 - - Google Patents

Info

Publication number
JPH0331083Y2
JPH0331083Y2 JP1983029773U JP2977383U JPH0331083Y2 JP H0331083 Y2 JPH0331083 Y2 JP H0331083Y2 JP 1983029773 U JP1983029773 U JP 1983029773U JP 2977383 U JP2977383 U JP 2977383U JP H0331083 Y2 JPH0331083 Y2 JP H0331083Y2
Authority
JP
Japan
Prior art keywords
stand
stem
hole
insulating material
circuit component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983029773U
Other languages
English (en)
Japanese (ja)
Other versions
JPS609327U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2977383U priority Critical patent/JPS609327U/ja
Publication of JPS609327U publication Critical patent/JPS609327U/ja
Application granted granted Critical
Publication of JPH0331083Y2 publication Critical patent/JPH0331083Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Die Bonding (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2977383U 1983-02-28 1983-02-28 回路部品用ステム Granted JPS609327U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2977383U JPS609327U (ja) 1983-02-28 1983-02-28 回路部品用ステム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2977383U JPS609327U (ja) 1983-02-28 1983-02-28 回路部品用ステム

Publications (2)

Publication Number Publication Date
JPS609327U JPS609327U (ja) 1985-01-22
JPH0331083Y2 true JPH0331083Y2 (un) 1991-07-01

Family

ID=30160643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2977383U Granted JPS609327U (ja) 1983-02-28 1983-02-28 回路部品用ステム

Country Status (1)

Country Link
JP (1) JPS609327U (un)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613754U (un) * 1979-07-13 1981-02-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613754U (un) * 1979-07-13 1981-02-05

Also Published As

Publication number Publication date
JPS609327U (ja) 1985-01-22

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