JPH0330835U - - Google Patents
Info
- Publication number
- JPH0330835U JPH0330835U JP9175089U JP9175089U JPH0330835U JP H0330835 U JPH0330835 U JP H0330835U JP 9175089 U JP9175089 U JP 9175089U JP 9175089 U JP9175089 U JP 9175089U JP H0330835 U JPH0330835 U JP H0330835U
- Authority
- JP
- Japan
- Prior art keywords
- mounting member
- contact surface
- plate
- conductor
- sensor body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 3
- 238000013021 overheating Methods 0.000 claims 3
- 239000013013 elastic material Substances 0.000 claims 2
- 239000000470 constituent Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9175089U JPH0330835U (fr) | 1989-08-03 | 1989-08-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9175089U JPH0330835U (fr) | 1989-08-03 | 1989-08-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0330835U true JPH0330835U (fr) | 1991-03-26 |
Family
ID=31641218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9175089U Pending JPH0330835U (fr) | 1989-08-03 | 1989-08-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0330835U (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009066111A (ja) * | 2007-09-12 | 2009-04-02 | Takazono Sangyo Co Ltd | 薬剤分包装置 |
JP2020173112A (ja) * | 2019-04-08 | 2020-10-22 | Tdk株式会社 | 温度センサユニット |
-
1989
- 1989-08-03 JP JP9175089U patent/JPH0330835U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009066111A (ja) * | 2007-09-12 | 2009-04-02 | Takazono Sangyo Co Ltd | 薬剤分包装置 |
JP2020173112A (ja) * | 2019-04-08 | 2020-10-22 | Tdk株式会社 | 温度センサユニット |