JPH0330472A - Solid-state image sensing device and manufacture thereof - Google Patents
Solid-state image sensing device and manufacture thereofInfo
- Publication number
- JPH0330472A JPH0330472A JP1163928A JP16392889A JPH0330472A JP H0330472 A JPH0330472 A JP H0330472A JP 1163928 A JP1163928 A JP 1163928A JP 16392889 A JP16392889 A JP 16392889A JP H0330472 A JPH0330472 A JP H0330472A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- package
- state image
- imaging device
- shielding plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、固体撮像装置のＷ遣方法の改良とこの方法を
実施して製造した固体撮像装置の改良とに関する。特に
、固体撮像装置の入力信号の光の透過領域であるウィン
ドグラスの接着方法の改良と、この改良されたウィンド
グラスの接着方法を使用して製造され、解像度が向上し
た固体撮像装置とに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a method for using W in a solid-state imaging device, and to an improvement in a solid-state imaging device manufactured by implementing this method. In particular, the present invention relates to an improved method of adhering a window glass, which is a region through which light of an input signal of a solid-state imaging device passes, and to a solid-state imaging device manufactured using this improved method of adhering a windshield and having improved resolution.
従来技術に係る固体撮像装置の構造を第２図を参照して
説明する。The structure of a solid-state imaging device according to the prior art will be explained with reference to FIG.
第２図参照
図において、ｌは固体撮像装置の引き出し導体（ビン）
であり、２は固体撮像装置のパッケージでありセラミッ
ク材等の絶縁材よりなり、３は固体撮像素子であり電荷
結合素子（以下ＣＯＤと云う、）等よりなり、４はカラ
ーフィルタであり各三原色の画像をそれぞれ別個に損傷
する場合には必須であり、５はポンディング線でありＣ
ＯＤ等の固体１ｉ像素子３の引き出し端子例えばポンデ
ィングパッド（図示せず）と引き出し導体（ビン）ｌと
を接続する。６は遮光板であり散乱光等の照光の侵入を
防止する機能を有する。８はウィンドグラスでありＣＣ
Ｄ等の固体撮像素子３を外気から保護すると−もに、入
力光を導入する機能を有する。９・１０−１１は加熱硬
化型接着剤の層である。In the diagram shown in Figure 2, l is the lead-out conductor (bin) of the solid-state imaging device.
2 is a package for a solid-state imaging device made of an insulating material such as a ceramic material, 3 is a solid-state imaging device and is made of a charge-coupled device (hereinafter referred to as COD), etc., and 4 is a color filter for each of the three primary colors. This is essential when damaging each of the images separately, 5 is the bonding line and C
A lead-out terminal of a solid-state 1i image element 3 such as an OD, such as a bonding pad (not shown), and a lead-out conductor (bin) l are connected. Reference numeral 6 denotes a light shielding plate, which has a function of preventing intrusion of illumination light such as scattered light. 8 is the wind glass and CC
It has the function of protecting the solid-state image sensor 3 such as D from the outside air and introducing input light. 9 and 10-11 are layers of heat-curable adhesive.
固体撮像素子３は、その特性を維持する目的のため、外
気特に水分の侵入を防止する必要がある。In order to maintain the characteristics of the solid-state image sensor 3, it is necessary to prevent outside air, particularly moisture, from entering the solid-state image sensor 3.
そのため、固体撮像素子３は、気密的に保護されること
が望ましいことは上記のとおりである。このため、従来
技術における固体撮像装置の組み立て工程においては、
ウィンドグラス８の一方の面とパッケージ２の接触領域
とには熱硬化型接着剤の層１１が、スクリーン印刷法等
を使用し−６形成されており、上記のウィンドグラス８
をパッケージ２の側壁２１上に載置した後、加圧・加熱
して気密・封止する工程が使用されている。Therefore, as described above, it is desirable that the solid-state image sensor 3 be protected airtight. For this reason, in the assembly process of solid-state imaging devices in the prior art,
A thermosetting adhesive layer 11 is formed on one surface of the windshield 8 and the contact area of the package 2 by using a screen printing method, etc.
A process is used in which the package 2 is placed on the side wall 21 of the package 2 and then pressurized and heated for airtight sealing.
また、ウィンドグラス８を透過した光の一部が、本来の
受光面ではないカラーフィルタ４の側面等から固体撮像
素子３に入射して照光として機能し、その結果、画像が
不鮮明になることを防止する［１的のために、ＣＣＤ等
固体撮像素子３の本来の受光領域を除外した領域（固体
撮像素子３の周辺部等）を遮光板６をもって遮光する構
造も一般に使用されている。この際、従来技術に係る遮
光板６は接着剤の層９をもってパッケージ２と接着され
ており、また、接着剤の層ＩＯをもってカラーフィルタ
４または固体撮像素子３のｊ＾１辺部と接着されている
。In addition, part of the light transmitted through the windshield 8 enters the solid-state image sensor 3 from the side of the color filter 4, which is not the original light-receiving surface, and functions as illumination, and as a result, the image becomes unclear. To prevent this, a structure is also generally used in which a light-shielding plate 6 is used to block light from an area other than the original light-receiving area of the solid-state image sensor 3 such as a CCD (such as the periphery of the solid-state image sensor 3). At this time, the light shielding plate 6 according to the prior art is bonded to the package 2 with an adhesive layer 9, and is also bonded to the color filter 4 or the side of the solid-state image sensor 3 with an adhesive layer IO. ing.
〔発明が解決しようとする課題］
しかし、従来技術に係る固体撮像素子の製造方法におい
て上記のウィンドグラス８をパッケージ２に接着するに
は、熱硬化型接着剤の１１１１１をウィンドグラス８の
周辺部に印刷しておき、この熱硬化型接着剤の層１１を
第２図に図示するように、パッケージ２の側壁２１の頂
部等（図においては段部とされている。）の密封部に押
圧・加熱して、接着をなしていた。そのため、あらかじ
め液状の熱硬化型接着剤をウィンドグラス８の周辺部に
塗布し、これを乾燥して固体の熱硬化型接着剤の層９・
ｌＯ・１１としておく必要があるが、この液状の熱硬化
型接着剤をウィンドグラス８の周辺部に塗布する際、こ
の液状の熱硬化型接着剤の濡がウィンドグラス８の中央
部（受光部）に飛散して付着することを完全に防止する
ことは極めて困難であり、この付着物によって固体撮像
素子の解像度が低下すると云う欠点を避けることは困難
であった。[Problems to be Solved by the Invention] However, in order to bond the above-mentioned window glass 8 to the package 2 in the method of manufacturing a solid-state image sensor according to the prior art, the thermosetting adhesive 11111 is applied to the periphery of the wind glass 8. This thermosetting adhesive layer 11 is pressed onto the sealing part of the top of the side wall 21 of the package 2 (shown as a stepped part in the figure), as shown in FIG.・It was heated and bonded. Therefore, a liquid thermosetting adhesive is applied to the periphery of the windshield 8 in advance, and this is dried to form a solid thermosetting adhesive layer 9.
When applying this liquid thermosetting adhesive to the periphery of the windshield 8, the liquid thermosetting adhesive should be applied to the central part of the windshield 8 (light-receiving area). ) It is extremely difficult to completely prevent the particles from scattering and adhering to the particles, and it is difficult to avoid the disadvantage that the resolution of the solid-state image sensor is reduced due to this adhering material.
特に、近年、ＣＣＤ等の固体撮像素子の微細化が進むに
ともない、上記のようなウィンドグラス８の面の汚れが
、例え数ミクロン程度の大きさであっても、それが固体
撮像素子の解像度に及ぼす影響はますます深刻となり、
その解決手段が強く求められていた。なお、このウィン
ドグラス８の汚れを除去するために、液状の接着剤層を
印刷した後に、この部分を洗滌することも試みられてい
るが、その場合は、残留した接着剤層の接着性能も同時
に低下させる等の問題が発生し、必ずしも好ましくない
ことがｆ１認されている。In particular, in recent years, with the progress of miniaturization of solid-state image sensors such as CCDs, even if the dirt on the surface of the windshield 8 is only a few microns in size, it will affect the resolution of the solid-state image sensor. The impact on
There was a strong need for a solution. In order to remove dirt from the windshield 8, attempts have been made to wash this area after printing a liquid adhesive layer, but in that case, the adhesive performance of the remaining adhesive layer may also be affected. At the same time, problems such as lowering occur, and f1 is recognized as not necessarily desirable.
本発明の目的は、これらの欠点を解消することにあり、
ウィンドグラスをパッケージに接着する際にウィンドグ
ラスが汚染する虞をなくし、且つ、組み立てを容易にす
る固体撮像装置の製造方法と、この製造方法を使用して
製造した固体撮像装置とを提供することにある。The purpose of the present invention is to eliminate these drawbacks,
To provide a manufacturing method for a solid-state imaging device that eliminates the risk of contamination of the windglass when bonding the windowglass to a package and facilitates assembly, and a solid-state imaging device manufactured using this manufacturing method. It is in.
上記の目的のうち、第１の目的は、
上面が開口とされ箱状をなすパッケージ（２）の内部底
面に固体撮像素子（３）を固定し、内周は前記固体撮像
素子（３）の上面外周より僅かに小さく、外周は前記の
パッケージ（２）の側壁（２１）の頂部内周より大きく
、表面には加熱硬化型接着剤層（１２）が形成されてい
る枠状部材よりなる遮光板（７）の内周部（７１）と外
周部（７２）とを、前記の固体撮像素子（３）の上面周
辺部と前記のパッケージ（２）の側壁（２１）の頂部（
１４）とに、それぞれ載置し、
前記の遮光板（７）の上面にウィンドグラス（８）を載
置し、加熱・冷却して、前記の加熱硬化型接着剤ＩＩ！
（１２）を加熱硬化する工程を有する
ことを特徴とする固体撮像装置の製造方法によって達成
される。Among the above objectives, the first objective is to fix a solid-state image sensor (3) to the inner bottom surface of a box-shaped package (2) with an opening on the top surface, and to fix the solid-state image sensor (3) on the inner periphery of the solid-state image sensor (3). A light shield made of a frame-shaped member, which is slightly smaller than the outer circumference of the upper surface, the outer circumference is larger than the inner circumference of the top of the side wall (21) of the package (2), and has a heat-curable adhesive layer (12) formed on the surface thereof. The inner peripheral part (71) and the outer peripheral part (72) of the plate (7) are connected to the upper peripheral part of the solid-state image sensor (3) and the top part (21) of the side wall (21) of the package (2).
14), the wind glass (8) is placed on the upper surface of the light shielding plate (7), heated and cooled, and the heat-curable adhesive II!
(12) This is achieved by a method for manufacturing a solid-state imaging device, which includes a step of heating and curing the solid-state imaging device.
上記の固体撮像装置の製造方法において、本発明の要旨
に係る遮光板（７）を漏斗状にする（遮光板（７）の内
周部（７１）と外周部（７２）との高さには、前記のパ
ッケージ（２）の側壁（２１）の頂部（１４）の高さと
前記固体撮像素子（３）の上面外周部（３１）の高さと
の差と同一の差を設ける）と、ワイヤボンディング等が
容易になり、有利である。In the method for manufacturing a solid-state imaging device described above, the light shielding plate (7) according to the gist of the present invention is formed into a funnel shape (the height of the inner peripheral part (71) and the outer peripheral part (72) of the light shielding plate (7) is the same as the height difference between the height of the top (14) of the side wall (21) of the package (2) and the height of the upper surface outer circumference (31) of the solid-state image sensor (3)) and the wire. This is advantageous because bonding etc. become easier.
また、本発明の要旨に係る遮光板（７）の表面に形成さ
れてなる加熱硬化型接着剤層（１２）に、前記パッケー
ジ（２）の側壁（２１）の頂部（１４）に対応する領域
の一部において、欠落部を形成しておき、前記の加熱硬
化型接着剤層（１２）を加熱硬化する工程に先立ち、前
記の加熱硬化型接着剤層（１２）に形成された欠落部（
１５）を介して、前記のパッケージ（２）内の空気を不
活性ガスと置換すると、固体撮像素子（３）の保護のた
めに有利である。Further, an area corresponding to the top (14) of the side wall (21) of the package (2) is added to the heat-curable adhesive layer (12) formed on the surface of the light shielding plate (7) according to the gist of the present invention. A missing portion (
15), it is advantageous to replace the air in the package (2) with an inert gas in order to protect the solid-state image sensor (3).
さらに、本発明の要旨に係る遮光板（７）の反射率は１
０％以下にしておけば、遮光板（７）の汚染を防止する
効果はさらに大きくなる。Furthermore, the reflectance of the light shielding plate (7) according to the gist of the present invention is 1
If it is kept below 0%, the effect of preventing contamination of the light shielding plate (7) will be even greater.
上記の目的のうち、第１の目的は、上記の固体撮像装置
の製造方法を実施して製造した固体撮像装置によって達
成される。Among the above objectives, the first objective is achieved by a solid-state imaging device manufactured by implementing the above solid-state imaging device manufacturing method.
本発明は、ウィンドグラスに、液状の接着剤を塗布して
接着剤層を形成する従来技術と異なり、予め接着剤が少
なくともその周辺部の両面に塗布されており、乾燥状態
の接着剤の層がその周辺部に形成されている板状の遮光
板を用意しておき、この本発明の要旨に係る遮光ｖｉ（
７）を、ウィンドグラスとそのウィンドグラスが載置さ
れるパッケージの側壁部との間に挿入し、加圧・加熱し
て、ウィンドグラスをパッケージに固定するものである
。上記の本発明の要旨に係る遮光板（７）への接着剤の
塗布は、ウィンドグラスとは全く独立に実施できるので
、塗布に際して液状の接着剤がウィンドグラスに付着す
るおそれは全くない。Unlike the conventional technology in which a liquid adhesive is applied to a windshield to form an adhesive layer, the present invention is characterized in that an adhesive is applied in advance to at least both sides of the periphery of the windshield, and a dry adhesive layer is formed on the windshield. A plate-shaped light-shielding plate having a shading plate formed on its periphery is prepared, and the light-shielding vi(
7) is inserted between the window glass and the side wall of the package on which the window glass is placed, and is pressurized and heated to fix the window glass to the package. Since the application of the adhesive to the light shielding plate (7) according to the gist of the present invention described above can be carried out completely independently of the window glass, there is no possibility that the liquid adhesive will adhere to the window glass during application.
また、上記の本発明の要旨に係る遮光板（７）とウィン
ドグラスとの接着面と遮光板（７）中央の開口部周辺上
の間は斜面としく漏斗状とし）、この遮光板（７）中央
の開口部周辺のみを接着剤をもってカラーフィルタ・固
体１電像素子に接着しておくこともできるので、この場
合は、ボンディング工程が容易になる。Further, the gap between the adhesive surface of the light shielding plate (7) and the window glass according to the gist of the present invention and the periphery of the central opening of the light shielding plate (7) is sloped and funnel-shaped); ) Since it is also possible to bond only the periphery of the central opening to the color filter/solid-state 1-electronic element using an adhesive, in this case, the bonding process becomes easier.
〔実施例〕
以下、図面を参照しつ一１本発明の三つの実施例に係る
固体撮像素子について説明する。[Embodiments] Hereinafter, solid-state imaging devices according to three embodiments of the present invention will be described with reference to the drawings.
ｍ の に る ７■
第１ａ図参照
固体撮像装置のパッケージ２はセラミック材等の絶縁物
で成形されている。このパッケージ２の底部は、端子引
き出しの都合上、その中央部（固体！最像素子が載置さ
れる領域）２２が台形にされていることが望ましい。こ
のパッケージ２の底部に固体撮像素子３が固定され、必
要に応じてカラーフィルタ４が、その上に貼り合わされ
る。勿論、固体撮像素子３上に、直接、カラーフィルタ
４を形成することもできる。ボンディング線５をもって
引き出し導体（ビン）■と固体撮像素子３のポンディン
グパッド（図示セず）とが接続される。7■ See Figure 1a The package 2 of the solid-state imaging device is molded from an insulating material such as a ceramic material. For the convenience of drawing out terminals, it is desirable that the bottom of the package 2 has a trapezoidal central portion 22 (an area where the solid image element is placed). A solid-state image sensor 3 is fixed to the bottom of this package 2, and a color filter 4 is bonded thereon as required. Of course, the color filter 4 can also be formed directly on the solid-state image sensor 3. The lead conductor (bin) 2 is connected to a bonding pad (not shown) of the solid-state image sensor 3 using a bonding wire 5 .
７が本発明の要旨に係る枠状板状体よりなる遮光板であ
り、その内周は、図示する例においては、カラーフィル
タ４の上面外周より僅かに小さくされ、外周はバ・ンケ
ージ２の側壁頂部内周よりいくらか大きくしてあり、そ
の表面には、熱硬化型接着剤のＩ’１１２（第１ｅ図・
第１ｆ図参照）がスクリーン印刷法等を使用して形成さ
れている。この熱硬化型接着剤の層１２を形成するには
、液状の接着剤を塗布し・乾燥して、５０〜１２０ｎの
厚さの１１１２を形成しておけばよい、この接着剤とし
ては、乾燥により粘着性がなくなり、加熱により融解し
接着性を発現した後硬化する溶剤タイプの接着剤が好ま
しく、特にエポキシ樹脂系接着剤であり耐水性の高いも
のが望ましい、このような特性を有するエポキシ樹脂系
接着剤の例としては、三井東圧■製ＥＳ−５０３０Ｃ（
商品名）、鹿島工業■製ＫＩＣＤＸ−１３１１Ｓ（商品
名）、東亜合成化学工業■製ＢＸ−６０、ＢＸ−７７Ａ
（商品名）等が挙げられる。Reference numeral 7 denotes a light shielding plate made of a frame-like plate according to the gist of the present invention, and its inner circumference is slightly smaller than the outer circumference of the upper surface of the color filter 4 in the illustrated example, and the outer circumference is made smaller than the outer circumference of the upper surface of the color filter 4. It is somewhat larger than the inner periphery of the top of the side wall, and a thermosetting adhesive I'112 (Fig. 1e) is applied to its surface.
(see FIG. 1f) is formed using a screen printing method or the like. To form the thermosetting adhesive layer 12, it is sufficient to apply a liquid adhesive and dry it to form a layer 1112 with a thickness of 50 to 120 nm. A solvent-type adhesive that loses its tackiness, melts by heating, exhibits adhesive properties, and then hardens is preferable, and an epoxy resin-based adhesive with high water resistance is particularly desirable.Epoxy resins with such characteristics Examples of adhesives include ES-5030C (manufactured by Mitsui Toatsu) (
Product name), KICDX-1311S (product name) manufactured by Kashima Kogyo, BX-60, BX-77A manufactured by Toagosei Chemical
(Product name) etc.
上記の本発明の要旨に係る板状遮光体７の材質は、アル
ミニウム・銅・ステンレス等の金属系材料でもよく、ま
た、ポリエチレン・ポリイミド・ポリウレタン等の合成
樹脂系材料でもよく、また、ガラス繊維強化合成樹脂等
の有機・無機複合材料でもよい。The material of the plate-shaped light shielding body 7 according to the above-mentioned gist of the present invention may be a metal material such as aluminum, copper, or stainless steel, or may be a synthetic resin material such as polyethylene, polyimide, or polyurethane, or may be a glass fiber material. Organic/inorganic composite materials such as reinforced synthetic resins may also be used.
上記の本発明の要旨に係る板状遮光体７は、遮光性を向
上し、反射率を低下するために、その表面に黒色処理が
実施されていることが望ましい。It is desirable that the surface of the plate-shaped light-shielding body 7 according to the above-mentioned gist of the present invention be black-treated in order to improve the light-shielding property and reduce the reflectance.
すなわち、アルミ表面の黒色染色と風花処理、ステンレ
スにおける酸化着色、各種金属に対する黒色ニッケルメ
ッキ、黒色クロムメツキ等が施されていることが望まし
い０合成樹脂基板または有機・無機複合基板の場合は、
黒色カーボンの充填または黒色塗料の表面塗装が実施さ
れることが望ましい。In other words, in the case of synthetic resin substrates or organic/inorganic composite substrates, it is preferable that the aluminum surface be dyed black and treated with flavour, oxidation coloring for stainless steel, black nickel plating for various metals, black chrome plating, etc.
It is desirable that black carbon be filled or the surface be painted with black paint.
上記の本発明の要旨に係る板状遮光体７の厚さは、金属
板の場合は０．０３論〜０．１５−が望ましい。金属以
外の場合は、金属の場合の２〜３倍が望ましい。The thickness of the plate-shaped light shielding body 7 according to the above-mentioned gist of the present invention is preferably 0.03 to 0.15 mm in the case of a metal plate. For materials other than metals, it is desirable that the amount is 2 to 3 times that for metals.
本発明の要旨に係る板状遮光体７の表面反射率は２０％
以下が必要であり、７％以下が望ましい。The surface reflectance of the plate-shaped light shielding body 7 according to the gist of the present invention is 20%.
The following is required, and 7% or less is desirable.
ウィンドグラス８をもって、固体撮像装置３を密閉・封
止するには、上記のボンディング工程が完了した後、本
発明の要旨に係る遮光板７とパッケージ２の側壁２１の
頂部１４（段部が設けられていると好都合である。）に
！！置し、ウィンドグラス８を遮光板７上に載置し、加
熱・加圧して熱硬化型接着剤を硬化すればよい。In order to seal/seal the solid-state imaging device 3 with the window glass 8, after the above bonding process is completed, the light shielding plate 7 and the top part 14 of the side wall 21 of the package 2 (where a stepped part is provided) according to the gist of the present invention are used. It is convenient if it is.) to! ! The window glass 8 may be placed on the light shielding plate 7, and the thermosetting adhesive may be cured by heating and pressurizing it.
第１ｂ図・第１Ｃ図・第１ｄ図参照
第１ａ図を参照して説明した例と相違するところは、パ
ッケージ２の底部が台形にされていない点と、本発明の
要旨に係る板状遮光体７が、図示するように漏斗状にさ
れていることである。ＣＯＤ等の固体撮像装置３と引き
出し導体（ビン）１とはボンディング方式以外の方法を
もっても接続しうるが、ボンディング方式が最も容易で
ある。See Figures 1b, 1C, and 1d The difference from the example explained with reference to Figure 1a is that the bottom of the package 2 is not trapezoidal, and the plate-like light shielding according to the gist of the present invention. The body 7 is funnel-shaped as shown. Although the solid-state imaging device 3 such as COD and the lead-out conductor (bin) 1 can be connected by a method other than the bonding method, the bonding method is the easiest.
この方式を使用するためには、本発明の要旨に係る板状
遮光体７が、図示するように漏斗状にされていることが
最も有利である。In order to use this method, it is most advantageous that the plate-shaped light shielding body 7 according to the gist of the present invention is shaped like a funnel as shown in the figure.
第１ｅ図参照
本例は第１例・第２例の改変であり、本発明の要旨に係
る遮光板７に形成される乾燥した熱硬化型接着剤の層１
２には、１部領域に欠落部１５が設けられており、ウィ
ンドグラス８を封止するに先立ち、パッケージ２内の空
気を窒素ガス等の不活性ガスと置換するようにしたもの
である。この欠落部１５の間隙は、ウィンドグラス８と
パッケージ２の頂部（段部Ｎ４とが遮光板７を介して接
着される際の加圧・加熱（１４５℃）工程において流動
化した接着剤１２により最終的には閉塞される程度の大
きさ（例えば０，６〜０．７閣程度）とする必要がある
。Refer to FIG. 1e This example is a modification of the first and second examples, and the dry thermosetting adhesive layer 1 formed on the light shielding plate 7 according to the gist of the present invention.
2 is provided with a cutout 15 in one area, and the air inside the package 2 is replaced with an inert gas such as nitrogen gas before the window glass 8 is sealed. This gap 15 is created by the adhesive 12 fluidized during the pressurization and heating (145° C.) process when the windshield 8 and the top of the package 2 (step N4) are bonded together via the light shielding plate 7. Ultimately, it needs to be large enough to be occluded (for example, about 0.6 to 0.7 degrees).
本例における固体撮像装置を、１３０’Ｃ，２，８気圧
の条件下で、１時間、耐水性テストを行った結果、耐水
性が完全であることが確認された。The solid-state imaging device in this example was subjected to a water resistance test under conditions of 130'C and 2.8 atm for 1 hour, and as a result, it was confirmed that the solid-state imaging device was completely water resistant.
なお、第１ｄ図に示すように、乾燥した熱硬化型接着剤
の層は、本発明の要旨に係る遮光板７の全面に塗布せず
、図示するように、１部領域に、乾燥した熱硬化型接着
剤の層１２・１３として形成しておいてもよい。Note that, as shown in FIG. 1d, the dry thermosetting adhesive layer is not applied to the entire surface of the light shielding plate 7 according to the gist of the present invention, but as shown in the figure, a layer of dry thermosetting adhesive is applied to one area. They may also be formed as layers 12 and 13 of curable adhesive.
上記いづれの例においても云えることであるが、遮光板
７の反射率はできるだけ低いことが望ましい。散乱光が
照光となりうるからである。実験の結果によれば、反射
率は１０％以下であることが望ましい。As can be said in any of the above examples, it is desirable that the reflectance of the light shielding plate 7 be as low as possible. This is because scattered light can become illumination. According to the results of experiments, it is desirable that the reflectance is 10% or less.
〔発明の効果］
以上説明せるとおり、本発明に係る固体撮像装置は、液
状の接着剤を、直接、ウィンドグラスに塗布するのでは
なく、液状の接着剤は、リインドグラスとは無関係に、
遮光板の上下両面に塗布し、これを乾燥して、遮光板の
上下両面に乾燥した熱硬化型接着剤層を形成しておき、
ウィンドグラスをもってパッケージを密閉するときは、
この乾燥した熱硬化型接着剤層を加圧・加熱して一旦溶
融の上、冷却して、硬化・接着すること−されているの
で、ウィンドグラス面中央部が接着剤で汚染されること
が全くなくなり、固体撮像装置の解像度を著しく向上す
ることが可能となる。[Effects of the Invention] As explained above, in the solid-state imaging device according to the present invention, the liquid adhesive is not directly applied to the windshield, but the liquid adhesive is applied independently of the windshield.
Apply it to both the top and bottom of the light shielding plate and dry it to form a dry thermosetting adhesive layer on both the top and bottom of the light shielding plate.
When sealing the package using a windshield,
This dry thermosetting adhesive layer is pressurized and heated to melt it and then cooled to harden and bond, so there is no possibility that the central part of the windshield surface will be contaminated with the adhesive. This eliminates the problem completely, making it possible to significantly improve the resolution of the solid-state imaging device.
第１ａ図は、本発明の第１の実施例に係る固体撮像装置
の製造方法及び固体撮像装置を実施して製造した固体撮
像装置の断面図である。
第１ｂ図は、本発明の第２の実施例に係る固体撮像装置
の製造方法及び固体撮像装置を実施して製造した固体撮
像装置の断面図である。
第１ｃ図は、本発明の第２の実施例に係る固体撮像装置
の遮光板の斜視図である。
第１ｄ図は、本発明の第２の実施例に係る固体ｌ最像装
置用の遮光機の接着剤塗布方法の改変を示す断面図であ
る。
第１ｅ図は、本発明の第３の実施例に係る固体描像装置
の遮光板の接着剤塗布状況を示す平面図である。
第ｉｔ図は、本発明の第３の実施例に係る固体撮像装置
の遮光板の他の接着剤塗布状況を示す断面図である。
第２図は、従来波４＋ｉに係る固体撮像装置の断面図で
ある。
４ ・ ・ ・
５ ・ ・ ・
６ ・ ・ ・
７ ・ ・
７１・ ・ ・
７２・ ・ ・
８ ・ ・ ・
９ ・１０
カラーフィルタ、
ボンディング線、
従来技術に係る遮光板、
本発明の要旨に係る遮光板、
本発明の要旨に係る遮光板の内周部、
本発明の要旨に係る遮光板の外周部、
ウィンドグラス、
・・加熱硬化型接着剤層接着剤層。
引き出し導体、
加熱硬化型接着剤層、
加熱硬化型接着剤層、
パッケージの側壁の頂部、
パッケージの側壁の頂部に形成された加熱硬化型接着剤
層の一部に形成された欠落部、
パッケージ、
パッケージの側壁、
パッケージ側部中央の台形部、
固体撮像素子、FIG. 1a is a sectional view of a solid-state imaging device manufactured by carrying out the solid-state imaging device manufacturing method and solid-state imaging device according to the first embodiment of the present invention. FIG. 1b is a sectional view of a solid-state imaging device manufactured by carrying out the solid-state imaging device manufacturing method and solid-state imaging device according to the second embodiment of the present invention. FIG. 1c is a perspective view of a light shielding plate of a solid-state imaging device according to a second embodiment of the present invention. FIG. 1d is a sectional view showing a modification of the adhesive application method of a light shielding machine for a solid-state imager according to a second embodiment of the present invention. FIG. 1e is a plan view showing the state of adhesive application on the light-shielding plate of the solid-state imaging device according to the third embodiment of the present invention. FIG. 1 is a sectional view showing another state of applying adhesive to the light shielding plate of the solid-state imaging device according to the third embodiment of the present invention. FIG. 2 is a sectional view of a solid-state imaging device according to conventional wave 4+i. 4 ・ ・ ・ 5 ・ ・ ・ 6 ・ ・ 7 ・ ・ 71 ・ ・ 72 ・ ・ 8 ・ ・ ・ 9 ・10 Color filter, bonding line, light shielding plate according to prior art, light shielding according to the gist of the present invention A plate, an inner peripheral part of a light shielding plate according to the gist of the present invention, an outer peripheral part of a light shielding plate according to the gist of the present invention, a window glass, ... a heat-curing adhesive layer, an adhesive layer. Extraction conductor, heat-curable adhesive layer, heat-curable adhesive layer, top of side wall of package, missing part formed in part of heat-curable adhesive layer formed on top of side wall of package, package, Side wall of the package, trapezoidal part at the center of the side of the package, solid-state image sensor,
Claims (1)
内部底面に固体撮像素子（３）を固定し、内周は前記固
体撮像素子（３）の上面外周より僅かに小さく、外周は
前記パッケージ（２）の側壁（２１）の頂部内周より大
きく、表面には加熱硬化型接着剤層（１２）が形成され
てなる枠状部材よりなる遮光板（７）の内周部（７１）
と外周部（７２）とを、前記固体撮像素子（３）の上面
周辺部と前記パッケージ（２）の側壁（２１）の頂部（
１４）とに、それぞれ載置し、 前記遮光板（７）の上面にウィンドグラス（８）を載置
し、加熱・冷却して、前記加熱硬化型接着剤層（１２）
を加熱硬化する 工程を有する ことを特徴とする固体撮像装置の製造方法。 ［２］上面が開口とされ箱状をなすパッケージ（２）の
内部底面に固体撮像素子（３）が固定され、 内周は前記固体撮像素子（３）の上面外周より僅かに小
さく、外周は前記パッケージ（２）の側壁（２１）の頂
部内周より大きく、表面には加熱硬化型接着剤層（１２
）が形成されてなる枠状部材よりなる遮光板（７）の内
周部（７１）と外周部（７２）とが、前記固体撮像素子
（３）の上面周辺部と前記パッケージ（２）の側壁（２
１）の頂部（１４）とに、それぞれ載置され、 前記遮光板（７）の上面にウィンドグラス（８）が載置
され、加熱・冷却して、前記加熱硬化型接着剤層（１２
）が加熱硬化されてなる ことを特徴とする固体撮像装置。 ［３］前記パッケージ（２）の側壁（２１）の頂部（１
４）の高さは前記固体撮像素子（３）の上面外周部（３
１）の高さより高く、前記遮光板（７）の内周部（７１
）と外周部（７２）との高さには、前記パッケージ（２
）の側壁（２１）の頂部（１４）の高さと前記固体撮像
素子（３）の上面外周部（３１）の高さとの差と同一の
差が設けられてなり、前記遮光板（７）は漏斗状とされ
てなることを特徴とする請求項［１］記載の固体撮像装
置の製造方法。 ［４］前記パッケージ（２）の側壁（２１）の頂部（１
４）の高さは前記固体撮像素子（３）の上面外周部（３
１）の高さより高く、前記遮光板（７）の内周部（７１
）と外周部（７２）との高さには、前記パッケージ（２
）の側壁（２１）の頂部（１４）の高さと前記固体撮像
素子（３）の上面外周部（３１）の高さとの差と同一の
差が設けられてなり、前記遮光板（７）はロード状とさ
れてなることを特徴とする請求項［２］記載の固体撮像
装置。 ［５］前記遮光板（７）の表面に形成されてなる加熱硬
化型接着剤層（１２）には、前記パッケージ（２）の側
壁（２１）の頂部（１４）に対応する領域の一部におい
て、欠落部（１５）を形成し、前記加熱硬化型接着剤層
（１２）を加熱硬化する工程に先立ち、前記加熱硬化型
接着剤層（１２）に形成された欠落部（１５）を介して
、前記パッケージ（２）内の空気を不活性ガスと置換し
、 前記欠落部（１５）は前記加熱硬化工程において閉塞す
ることを特徴とする請求項［１］または［３］記載の固
体撮像装置の製造方法。 ［６］前記遮光板（７）の反射率は１０％以下であるこ
とを特徴とする請求項［２］または［４］記載の固体撮
像装置。 ［７］前記遮光板（７）の反射率は１０％以下であるこ
とを特徴とする、請求項［１］、［３］、または、［５
］記載の固体撮像装置の製造方法を実施して製造した固
体撮像装置。[Scope of Claims] [1] A solid-state image sensor (3) is fixed to the inner bottom surface of a box-shaped package (2) with an opening on the top surface, and the inner periphery is closer to the outer periphery of the top surface of the solid-state image sensor (3). A light-shielding plate (7) made of a frame-shaped member that is slightly smaller, has an outer circumference larger than the inner circumference of the top of the side wall (21) of the package (2), and has a heat-curable adhesive layer (12) formed on its surface. Inner periphery (71)
and the outer peripheral part (72), and the upper peripheral part of the solid-state image sensor (3) and the top part (21) of the side wall (21) of the package (2).
14), a wind glass (8) is placed on the upper surface of the light shielding plate (7), and heated and cooled to form the heat-curable adhesive layer (12).
1. A method for manufacturing a solid-state imaging device, comprising a step of heating and curing the solid-state imaging device. [2] A solid-state image sensor (3) is fixed to the inner bottom surface of a box-shaped package (2) with an opening on the top surface, the inner periphery is slightly smaller than the outer periphery of the top surface of the solid-state image sensor (3), and the outer periphery is It is larger than the inner circumference of the top of the side wall (21) of the package (2), and has a heat-curing adhesive layer (12) on the surface.
), the inner peripheral part (71) and the outer peripheral part (72) of the light shielding plate (7), which is a frame-shaped member, are connected to the upper surface peripheral part of the solid-state image sensor (3) and the package (2). Side wall (2
1), and a window glass (8) is placed on the top surface of the light shielding plate (7), and heated and cooled to form the heat-curable adhesive layer (12).
) is heat-cured. [3] The top (1) of the side wall (21) of the package (2)
4) is the height of the upper surface outer periphery (3) of the solid-state image sensor (3).
1), and the inner circumference (71) of the light shielding plate (7) is higher than the height of
) and the outer periphery (72).
) is provided with the same difference in height as the height of the top (14) of the side wall (21) and the height of the upper surface outer circumference (31) of the solid-state image sensor (3), and the light shielding plate (7) is The method for manufacturing a solid-state imaging device according to claim 1, wherein the solid-state imaging device is formed into a funnel shape. [4] The top (1) of the side wall (21) of the package (2)
4) is the height of the upper surface outer periphery (3) of the solid-state image sensor (3).
1), and the inner circumference (71) of the light shielding plate (7) is higher than the height of
) and the outer periphery (72).
) is provided with the same difference in height as the height of the top (14) of the side wall (21) and the height of the upper surface outer circumference (31) of the solid-state image sensor (3), and the light shielding plate (7) is The solid-state imaging device according to claim 2, wherein the solid-state imaging device is in the form of a load. [5] The heat-curable adhesive layer (12) formed on the surface of the light shielding plate (7) includes a part of the area corresponding to the top (14) of the side wall (21) of the package (2). In this step, prior to the step of forming a cutout (15) and heating and curing the heat-curable adhesive layer (12), the cutout (15) formed in the heat-curable adhesive layer (12) is The solid-state imaging device according to claim 1 or 3, wherein the air in the package (2) is replaced with an inert gas, and the missing portion (15) is closed in the heat curing step. Method of manufacturing the device. [6] The solid-state imaging device according to claim 2 or 4, wherein the light shielding plate (7) has a reflectance of 10% or less. [7] Claim [1], [3], or [5], wherein the reflectance of the light shielding plate (7) is 10% or less.
A solid-state imaging device manufactured by implementing the method for manufacturing a solid-state imaging device described in ].
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1163928A JPH0330472A (en) | 1989-06-28 | 1989-06-28 | Solid-state image sensing device and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1163928A JPH0330472A (en) | 1989-06-28 | 1989-06-28 | Solid-state image sensing device and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330472A true JPH0330472A (en) | 1991-02-08 |
Family
ID=15783489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1163928A Pending JPH0330472A (en) | 1989-06-28 | 1989-06-28 | Solid-state image sensing device and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330472A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11261861A (en) * | 1998-03-11 | 1999-09-24 | Olympus Optical Co Ltd | Image pickup unit for lens mirror frame |
| US6064062A (en) * | 1998-06-02 | 2000-05-16 | Hewlett-Packard Company | Optical stray light baffle for image scanner |
| JP2001274370A (en) * | 2000-01-21 | 2001-10-05 | Nikon Corp | Package for photodetector and solid-state imaging apparatus |
| KR100407407B1 (en) * | 2001-11-20 | 2003-11-28 | 한국 고덴시 주식회사 | Color sensor |
| JP2009105771A (en) * | 2007-10-24 | 2009-05-14 | Sharp Corp | Case member, sensor module and electronic information device |
| JP2009302102A (en) * | 2008-06-10 | 2009-12-24 | Sony Corp | Solid-state imaging device and its manufacturing method |
-
1989
- 1989-06-28 JP JP1163928A patent/JPH0330472A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11261861A (en) * | 1998-03-11 | 1999-09-24 | Olympus Optical Co Ltd | Image pickup unit for lens mirror frame |
| US6064062A (en) * | 1998-06-02 | 2000-05-16 | Hewlett-Packard Company | Optical stray light baffle for image scanner |
| JP2001274370A (en) * | 2000-01-21 | 2001-10-05 | Nikon Corp | Package for photodetector and solid-state imaging apparatus |
| KR100407407B1 (en) * | 2001-11-20 | 2003-11-28 | 한국 고덴시 주식회사 | Color sensor |
| JP2009105771A (en) * | 2007-10-24 | 2009-05-14 | Sharp Corp | Case member, sensor module and electronic information device |
| JP4543072B2 (en) * | 2007-10-24 | 2010-09-15 | シャープ株式会社 | Case member, sensor module, and electronic information device |
| JP2009302102A (en) * | 2008-06-10 | 2009-12-24 | Sony Corp | Solid-state imaging device and its manufacturing method |
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