JPH0330464U - - Google Patents
Info
- Publication number
- JPH0330464U JPH0330464U JP8990489U JP8990489U JPH0330464U JP H0330464 U JPH0330464 U JP H0330464U JP 8990489 U JP8990489 U JP 8990489U JP 8990489 U JP8990489 U JP 8990489U JP H0330464 U JPH0330464 U JP H0330464U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- wiring board
- printed wiring
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8990489U JPH0330464U (de) | 1989-07-31 | 1989-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8990489U JPH0330464U (de) | 1989-07-31 | 1989-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330464U true JPH0330464U (de) | 1991-03-26 |
Family
ID=31639455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8990489U Pending JPH0330464U (de) | 1989-07-31 | 1989-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330464U (de) |
-
1989
- 1989-07-31 JP JP8990489U patent/JPH0330464U/ja active Pending