JPH033026A - Input device - Google Patents
Input deviceInfo
- Publication number
- JPH033026A JPH033026A JP1138732A JP13873289A JPH033026A JP H033026 A JPH033026 A JP H033026A JP 1138732 A JP1138732 A JP 1138732A JP 13873289 A JP13873289 A JP 13873289A JP H033026 A JPH033026 A JP H033026A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- bases
- input device
- conductive
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 4
- 239000005020 polyethylene terephthalate Substances 0.000 abstract description 4
- 239000011521 glass Substances 0.000 abstract description 3
- -1 polyethylene terephthalate Polymers 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000006258 conductive agent Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Abstract
Description
本発明は入力装置に関する。 The present invention relates to an input device.
【従来の技術J
従来のこの種の二枚の基板を用い一方より外部接続端子
を出す入力装置の導通部は第2図(a)、(b)のよう
に基板上の秀明電極3.4を導電粒子の入った導通剤6
で接着することにより電気的接続をさせて、一方より他
方へ導通させていた。
【発明が解決しようとする課題】
しかしながら以上のような従来の人力装置の場合、透明
電極がITO(Indiam Tin0xide)の
ような無機物であり導通剤が主に有機物の接着剤より成
っていることから、電極と電極を接着させる接着力に限
界がある。特に、方の基板がフィルムで他方がガラスと
いった材質が異なる基板によって構成される入力装置の
導通部は熱などの外的要因により力が加わり、電極どう
しの接着力を保持できなくなり導通剤が剥れてしまうと
いう問題を有していた。
本発明はこのような問題点を解決するもので、その目的
は電極同志を接着させ且つ導通させる導通剤の電極への
密着力を向上させた入力装置を提供することにある。
[課題を解決するための手段]
本発明の入力装置は、上、下それぞれの基板表面に入力
用電極を形成し、該電極を内側にし複数個のスペーサー
を介して前記基板を対向配置した入力装置において、前
記上、下基板間の電気的導通をとるための上、下導通部
の前記上、下基板の少なくとも一方の電極にスリットを
設けたことを特徴とする。
〔実 施 例〕
第1図(a)、(b)は本発明の入力装置の一実施例に
おける導通部の断面図および正面図である。
lは二軸延伸PET (ポリエチレンテレフタレート)
を用いた基板、2はガラスを用いた基板、3.4はそれ
ぞれの基板上に形成された透明電極、5は両方の基板を
接着保持するシール材、6は導通材、この導通剤として
は、銀のフィラーを入れ、さらに所定の大きさの導電粒
子(例えば銅球)を混入したエポキシ系接着剤を用いた
。
また、7は電極部に入れたスリットである。なお、本実
施例以外に上、下基板両方の上、下導通部電極にスリッ
トを入れてもよい。
以上のような構成の導通部をもつ入力装置と従来の第2
図(a)、(b)のような導通部の入力装置を同時に作
成し60℃−90%の環境試験を行ない導通部の剥れ及
び電気抵抗値を比較した。
その結果環境試験500時間において本実施例のものは
、導通部の剥れ発生なし、電気抵抗値の1.2倍以内で
あったのに対し、従来のものは。
導通部は約1/3が剥離し電気抵抗値も1.1〜1.8
倍とバラツキが生じた。[Prior art J] The conductive part of an input device that uses two boards of this type and has an external connection terminal from one of them is as shown in Figure 2 (a) and (b), as shown in Figure 2 (a) and (b). A conductive agent containing conductive particles 6
By gluing them together, an electrical connection was made and conduction was established from one side to the other. [Problems to be Solved by the Invention] However, in the case of the above-mentioned conventional human-powered devices, the transparent electrode is made of an inorganic material such as ITO (India Tin Oxide), and the conductive agent is mainly made of an organic adhesive. However, there is a limit to the adhesive strength that bonds the electrodes together. In particular, the conductive parts of input devices that are composed of substrates made of different materials, such as film on one board and glass on the other, are subjected to force due to external factors such as heat, making it impossible to maintain the adhesive force between the electrodes and causing the conductive agent to peel off. The problem was that it would get lost. The present invention is intended to solve these problems, and its purpose is to provide an input device in which the adhesion of a conductive agent to the electrodes for adhering and conducting the electrodes to each other is improved. [Means for Solving the Problems] The input device of the present invention is an input device in which input electrodes are formed on the surfaces of upper and lower substrates, and the substrates are placed facing each other with the electrodes inside and a plurality of spacers interposed therebetween. The device is characterized in that a slit is provided in at least one electrode of the upper and lower substrates of the upper and lower conductive portions for establishing electrical continuity between the upper and lower substrates. [Embodiment] FIGS. 1(a) and 1(b) are a sectional view and a front view of a conductive portion in an embodiment of an input device of the present invention. l is biaxially oriented PET (polyethylene terephthalate)
2 is a substrate using glass, 3.4 is a transparent electrode formed on each substrate, 5 is a sealing material that adheres and holds both substrates, 6 is a conductive material, and this conductive agent is An epoxy adhesive containing silver filler and conductive particles (for example, copper spheres) of a predetermined size was used. Further, 7 is a slit inserted into the electrode section. In addition to this embodiment, slits may be provided in the upper and lower conductive portion electrodes of both the upper and lower substrates. An input device having a conductive part configured as described above and a conventional second
Input devices with conductive parts as shown in Figures (a) and (b) were simultaneously created and subjected to an environmental test at 60°C and 90% to compare peeling of the conductive parts and electrical resistance values. As a result, in the 500-hour environmental test, the product of this example did not cause peeling of the conductive part and the electrical resistance was within 1.2 times the electrical resistance value, whereas the conventional product did not have any peeling. Approximately 1/3 of the conductive part has peeled off and the electrical resistance value is 1.1 to 1.8.
There was a lot of variation.
以上述べたように本発明は電気的接続をさせるための導
通部の電極にスリットを入れたことより導通剤と基板と
の密着力を向上し、導通部の剥れを防止するという効果
を有する。As described above, the present invention has the effect of improving the adhesion between the conductive agent and the substrate and preventing peeling of the conductive part by providing a slit in the electrode of the conductive part for electrical connection. .
第1図(a)、(b)は本発明の入力装置の一実施例を
示す図。
第2図(a)、(b)は従来の入力装置を示す図。
・基板
・基板
・透明電極
・透明電極
・シール材
・導通剤
・スリット
第1図(α)
以上
出願人 セイコーエプソン株式会社
代理人 弁理士 鈴 木 喜三部(他1名)第1図(し
)FIGS. 1(a) and 1(b) are diagrams showing an embodiment of the input device of the present invention. FIGS. 2(a) and 2(b) are diagrams showing a conventional input device.・Substrate, Substrate, Transparent electrode, Transparent electrode, Sealing material, Conductive agent, Slit Figure 1 (α) Applicant Seiko Epson Corporation Representative Patent attorney Kizobe Suzuki (and 1 other person) Figure 1 (α) )
Claims (1)
極を内側にし複数個のスペーサーを介して前記基板を対
向配置した入力装置において、前記上、下基板間の電気
的導通をとるための上、下導通部の前記上、下基板の基
板の少なくとも一方の電極にスリットを設けたことを特
徴とする入力装置。In an input device in which input electrodes are formed on the surfaces of each of the upper and lower substrates, and the substrates are placed facing each other with the electrodes inside and a plurality of spacers interposed therebetween, for establishing electrical continuity between the upper and lower substrates. An input device characterized in that a slit is provided in at least one electrode of the upper and lower substrates of the upper and lower conductive portions.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1138732A JPH033026A (en) | 1989-05-31 | 1989-05-31 | Input device |
KR1019900007749A KR900018804A (en) | 1989-05-31 | 1990-05-29 | Input device |
EP19900305803 EP0400953A3 (en) | 1989-05-31 | 1990-05-29 | Input device |
US07/530,867 US5179460A (en) | 1989-05-31 | 1990-05-31 | Input device having double-layer adhesive conductive connecting portions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1138732A JPH033026A (en) | 1989-05-31 | 1989-05-31 | Input device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH033026A true JPH033026A (en) | 1991-01-09 |
Family
ID=15228872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1138732A Pending JPH033026A (en) | 1989-05-31 | 1989-05-31 | Input device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH033026A (en) |
-
1989
- 1989-05-31 JP JP1138732A patent/JPH033026A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4295711A (en) | Liquid crystal display device | |
KR890004423A (en) | Electrical connection method of IC chip, resin bump forming composition used therein, and liquid crystal display device electrically connected thereto | |
CH607666A5 (en) | Method for mechanically and electrically connecting two members each bearing a bundle of electrical conductors, and adhesive for implementing the method | |
MY122191A (en) | Liquid crystal display device having spacers with two sizes and metal films and protrusions | |
GB2064233A (en) | Liquid crystal display device | |
JPH0253911B2 (en) | ||
JPH07199209A (en) | Liquid crystal display device | |
JPS63267913A (en) | Electrooptic device | |
US4386293A (en) | Flat display cell and cable with electrical and mechanical interconnection structure | |
KR880004413A (en) | LCD Display | |
JPH033026A (en) | Input device | |
WO2000074023A8 (en) | Electrical connection structure and flat display device | |
JPS62135813A (en) | Liquid crystal display device | |
JPS5752027A (en) | Liquid-crystal display device | |
JPS59181428A (en) | Panel switch | |
TW352450B (en) | Semiconductor device with electrical connection between semiconductor chip and substrate less breakable during shrinkage of adhesive compound and process of assemblage thereof | |
EP0095283A3 (en) | Memory device | |
JPS5887581A (en) | Liquid crystal display element | |
JPS6279281A (en) | Anisotropic electrically conductive adhesive | |
JPH01236588A (en) | Aeolotropic conductive adhesive body | |
JPH06152112A (en) | Connection of circuit | |
JPS6419324A (en) | Active matrix type liquid crystal display panel | |
JPS61167924A (en) | Liquid-crystal display device | |
GB846559A (en) | Improvements in or relating to a method of securing electrical components to circuit panels having adhering conductors | |
JPH01201715A (en) | Touch panel |