JPH03296536A - Production of imidosilicon polymer article - Google Patents
Production of imidosilicon polymer articleInfo
- Publication number
- JPH03296536A JPH03296536A JP9885090A JP9885090A JPH03296536A JP H03296536 A JPH03296536 A JP H03296536A JP 9885090 A JP9885090 A JP 9885090A JP 9885090 A JP9885090 A JP 9885090A JP H03296536 A JPH03296536 A JP H03296536A
- Authority
- JP
- Japan
- Prior art keywords
- crosslinking
- imidosilicon
- polymer
- resistance
- electron beams
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000004132 cross linking Methods 0.000 claims abstract description 23
- 238000010894 electron beam technology Methods 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 125000000524 functional group Chemical group 0.000 claims abstract description 4
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 abstract description 3
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013065 commercial product Substances 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- -1 siloxanes Chemical class 0.000 description 2
- WVAFEFUPWRPQSY-UHFFFAOYSA-N 1,2,3-tris(ethenyl)benzene Chemical compound C=CC1=CC=CC(C=C)=C1C=C WVAFEFUPWRPQSY-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 description 1
- BXAAQNFGSQKPDZ-UHFFFAOYSA-N 3-[1,2,2-tris(prop-2-enoxy)ethoxy]prop-1-ene Chemical compound C=CCOC(OCC=C)C(OCC=C)OCC=C BXAAQNFGSQKPDZ-UHFFFAOYSA-N 0.000 description 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- NCWQJOGVLLNWEO-UHFFFAOYSA-N methylsilicon Chemical compound [Si]C NCWQJOGVLLNWEO-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- XJWOWXZSFTXJEX-UHFFFAOYSA-N phenylsilicon Chemical compound [Si]C1=CC=CC=C1 XJWOWXZSFTXJEX-UHFFFAOYSA-N 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 208000024891 symptom Diseases 0.000 description 1
- NZHHDFRSEQSGLN-ZRDIBKRKSA-N tris(prop-2-enyl) (e)-prop-1-ene-1,2,3-tricarboxylate Chemical compound C=CCOC(=O)C\C(C(=O)OCC=C)=C/C(=O)OCC=C NZHHDFRSEQSGLN-ZRDIBKRKSA-N 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- XHGIFBQQEGRTPB-UHFFFAOYSA-N tris(prop-2-enyl) phosphate Chemical compound C=CCOP(=O)(OCC=C)OCC=C XHGIFBQQEGRTPB-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、イミドシリコン系重合体にて構成された成形
物品、たとえばシート、バイブ、絶縁電線等の製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing molded articles such as sheets, vibrators, insulated wires, etc., made of imidosilicon polymers.
現在、絶縁電線の被覆材料として押出成形可能でしかも
特に耐熱性に優れた樹脂の開発が望まれている。かかる
樹脂の例として米国ＧＥ社のエーテルイミド重合体（商
品名１１Ｈｅｍ）がある。この樹脂は電気特性、耐熱性
が高いところから有望視されているが、アセトンのよう
な汎用溶剤に対して容易にクラックが発生する問題があ
る。Currently, there is a desire to develop a resin that can be extruded and has particularly excellent heat resistance as a coating material for insulated wires. An example of such a resin is etherimide polymer (trade name 11Hem) manufactured by GE Corporation in the United States. This resin is seen as promising due to its high electrical properties and heat resistance, but it has the problem of easily cracking when exposed to general-purpose solvents such as acetone.
押出成形可能でしかも特に耐熱性に優れた他の樹脂とし
て、最近イミドシリコン系共重合体が開発された。この
樹脂は、基本的にはシリコン樹脂等のシリコン化合物と
イミドとの共重合体であって上記特性の他に電気特性、
機械的特性、可１茹性、難燃性等にも優れているので電
線用の被覆材としてを望視されている。Imidosilicon copolymers have recently been developed as other resins that can be extruded and have particularly excellent heat resistance. This resin is basically a copolymer of a silicon compound such as silicone resin and an imide, and in addition to the above properties, it has electrical properties,
Because of its excellent mechanical properties, boilability, flame retardance, etc., it is expected to be used as a coating material for electric wires.
ところでイミドシリコン系重合体は、２００℃での耐熱
寿命が極めて優れてはいるが、時間と共に若干熱溶融が
生じて成形品が変形する問題、耐溶剤性や１５０℃前後
の高温でのカットスルー抵抗が必ずしも充分でない等の
問題がある。By the way, imidosilicon polymers have extremely excellent heat-resistant life at 200°C, but they have problems such as slight thermal melting over time and deformation of molded products, solvent resistance, and cut-through at high temperatures of around 150°C. There are problems such as resistance not necessarily being sufficient.
そこで本発明は、イミドシリコン系重合体の上記の問題
点を解消することにある。Therefore, the present invention aims to solve the above-mentioned problems of imidosilicon polymers.
イミドシリコン系重合体のこれら問題は、それを電子線
照射して架橋することにより就中特定の架橋助剤の存在
下で電子線照射して架橋することにより予想外の効果で
解消することが判明した。These problems of imidosilicon polymers can be solved with unexpected effects by crosslinking them by irradiating them with electron beams, especially in the presence of a specific crosslinking aid. found.
而して本発明は、イミドシリコン系重合体を所望の形状
に成形し、次いで電子線照射して、好ましくは少なくと
も２個のエチレン系不飽和官能基を有する架橋助剤の存
在下で電子線照射して架橋することを特徴とするイミド
シリコン系重合体物品の製造方法である。Accordingly, in the present invention, an imidosilicon polymer is molded into a desired shape, and then irradiated with an electron beam, preferably in the presence of a crosslinking agent having at least two ethylenically unsaturated functional groups. This is a method for producing an imidosilicon polymer article, which is characterized by crosslinking by irradiation.
従来イミドシリコン系重合体を電子線照射により架橋し
゛ζ使用することは知られていなかったが、本発明にお
けるこの架橋により熱変形性、耐溶剤性、高温でのカッ
トスルー抵抗等が予想外の好成績で改善される。Conventionally, it was not known to crosslink imidosilicon polymers by electron beam irradiation, but this crosslinking in the present invention has unexpectedly improved heat deformability, solvent resistance, cut-through resistance at high temperatures, etc. Improve with good results.
本発明において対象とされるイミドシリコン系重合体と
しては、メチルシリコンモノマー、フェニルシリコンモ
ノマー、各種のシロキサン、等のシリコン化合物とイミ
ドとのブロック共重合体やランダムに共重合体等が例示
され、製造方法例では米国特許第３．３２５．４５０号
、米国特許第３．５５３，２８２号、米国特許第３．３
３８，８５９号、等に記載されている。また市販品では
、商品名ＳＩＬＴＥＭ−１５００があり、イミドシロキ
サン共重合体の市販品では商品名Ｄ９０００ （以上、
いずれも米国ＧＥ社製）がある。Examples of imidosilicon-based polymers targeted in the present invention include block copolymers and random copolymers of imides and silicon compounds such as methyl silicon monomers, phenyl silicon monomers, various siloxanes, etc. Examples of manufacturing methods include U.S. Patent No. 3.325.450, U.S. Patent No. 3.553,282, and U.S. Patent No. 3.3.
No. 38,859, etc. In addition, there is a commercial product under the trade name SILTEM-1500, and a commercial product of imidosiloxane copolymer is under the trade name D9000.
Both are manufactured by GE Corporation in the United States).
本発明においては、イミドシリコン系重合体を押出等の
方法で所望の形状に成形した後、電子線照射により架橋
する。その際の電子線間は、一般に５〜５０Ｍｒａｄ程
度の範囲であり、特にはｌＯ〜３０Ｍｒａｄが好ましい
。なお電子線照射による架橋の際、架橋助剤の存在下で
電子線照射して架橋すると一層架橋密度が向上して特定
の改善効果が高まる。In the present invention, an imidosilicon polymer is formed into a desired shape by extrusion or the like, and then crosslinked by electron beam irradiation. The distance between the electron beams at that time is generally in the range of about 5 to 50 Mrad, and particularly preferably 10 to 30 Mrad. Note that when crosslinking is performed by electron beam irradiation, if the crosslinking is performed by electron beam irradiation in the presence of a crosslinking auxiliary agent, the crosslinking density is further improved and the specific improvement effect is enhanced.
架橋助剤としては、少なくとも２個のエチレン系不飽和
官能基を有するもの、たとえばトリメチロールプロパン
トリメタクリレート、エチレングリコールジメタクリレ
ート、トリエチレングリコールジメタクリレート、テト
ラエチレングリコールジメタクリレート、ポリエチレン
グリコールジメタクリレート、ラウリルメタクリレート
、トリアリルシアヌレート、トリアリルイソシアネート
、ジアリルフタレート、トリアリルトリメリテート、ト
リアリルホスフェート、ジアリルイタコネート、トリア
リルアコニテート、ジアリルフマレート、ジアリルシト
ラネート、オルソ−シリシック酸テトラアリルエステル
、テトラアリルオキシエタン、Ｎ、Ｎ“−メタ−フェニ
レンビスマレイミド、フェニルマレイミド、トリアクリ
ルヘキサハイドロトリアジンシアヌレート、ペンタエリ
スリトールトリアクリレート、ペンタエリスリトールテ
トラアクリレート、１．６−ヘキサンジオールジアクリ
レート、エチレングリコールジアクリレート、ジヒニル
ベンゼン、トリビニルベンゼン 、１．２−ポリブタジ
ェン（分子量１０００〜５０００）などであり、就中好
ましいものは、トリメチロールプロパントリメタクリレ
ート、トリアリルイソシアヌレート、トリアリルキリメ
リテートなどである。Examples of crosslinking aids include those having at least two ethylenically unsaturated functional groups, such as trimethylolpropane trimethacrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, lauryl Methacrylate, triallyl cyanurate, triallyl isocyanate, diallyl phthalate, triallyl trimellitate, triallyl phosphate, diallylutaconate, triallylaconitate, diallyl fumarate, diallyl citranate, ortho-silicic acid tetraallyl ester, tetra Allyloxyethane, N,N"-meta-phenylene bismaleimide, phenylmaleimide, triacrylhexahydrotriazine cyanurate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, 1,6-hexanediol diacrylate, ethylene glycol diacrylate, Dihinylbenzene, trivinylbenzene, 1,2-polybutadiene (molecular weight 1,000 to 5,000), etc., and preferred among them are trimethylolpropane trimethacrylate, triallyl isocyanurate, triallyl chirimellitate, and the like.
架橋助剤を使用する場合、その配合量はイミドシリコン
系重合体１００重量部あたり０．１〜１０重量部重量部
時に１．０〜５．０程度が適当である。架橋助剤は、イ
ミドシリコン系重合体を押出機のホッパーに投入しつつ
必要量をホッパー中の該重合体に滴下する、押出機バレ
ルの途中から注入する、あるいは予めヘンンエルミキサ
にて混合しておく、等の方法で添加してよく、またイミ
ドシリコン系重合体の成形品を得た後に架橋助剤または
その有機溶剤溶液と接触して拡散浸透させてもよい。When a crosslinking aid is used, the appropriate amount thereof is 0.1 to 10 parts by weight per 100 parts by weight of the imidosilicon polymer, and approximately 1.0 to 5.0 parts by weight. The crosslinking aid can be added by dropping the required amount onto the imidosilicon polymer in the hopper of the extruder, by injecting it from the middle of the extruder barrel, or by mixing it in advance in a Hennel mixer. Alternatively, after obtaining a molded product of the imidosilicon polymer, it may be brought into contact with the crosslinking aid or its organic solvent solution and diffused into the product.
また本発明においては、イミドシリコン系重合体に他の
配合剤、たとえばカーボンブラック、シリカ、クレー等
の充填剤、酸化防止剤、難燃剤、等を通常量配合しても
よい。Further, in the present invention, other compounding agents such as fillers such as carbon black, silica, and clay, antioxidants, flame retardants, etc. may be added to the imidosilicon polymer in normal amounts.
本発明において対象とするイミドシリコン系重合体は、
機械的特性、電気特性、難燃性に優れ、且つ成形加工性
に優れているので押出機等にて容易に所望の形状に成形
できる。たとえば銅導体の上に通常のクロスヘツドを用
いてイミドシリコン系重合体を押出被覆して被覆電線を
得ることかできる。またその成形品を本発明の方法によ
り架橋することにより熱変形性、耐溶剤性、高温でのカ
ットスルー抵抗等が予想外の好成績で改善される。The imidosilicon-based polymer targeted in the present invention is
It has excellent mechanical properties, electrical properties, flame retardancy, and moldability, so it can be easily molded into a desired shape using an extruder or the like. For example, a coated wire can be obtained by extrusion coating an imidosilicon polymer onto a copper conductor using a conventional crosshead. Further, by crosslinking the molded article by the method of the present invention, thermal deformability, solvent resistance, cut-through resistance at high temperature, etc. are improved with unexpectedly good results.
而して本発明は、被覆電線のみならず、イミドシリコン
系重合体からなる各種の成形品の製造に有用である。Therefore, the present invention is useful not only for producing covered electric wires but also for producing various molded products made of imidosilicon polymers.
以下に実施例及び比較例により本発明を一層詳細に説明
する。The present invention will be explained in more detail below using Examples and Comparative Examples.
実施例１
イミドシリコン重合体（ＳＩＬＴＥＭ−１５００、米国
ＧＥ社製商品名）のベレットのままプレス成形して０．
６ｍ厚のシートを作成した後、シートの片面に１５Ｍｒ
ａｄずつ両面を電子照射し架橋して架橋シートを得た。Example 1 A pellet of imidosilicon polymer (SILTEM-1500, trade name manufactured by GE Corporation, USA) was press-molded as it was.
After creating a 6m thick sheet, apply 15Mr on one side of the sheet.
Both sides were irradiated with electrons and crosslinked to obtain a crosslinked sheet.
実施例２
イミドシリコン重合体（Ｄ ９０００、米国ＧＥ社製商
品名）を用いた以外は実施例１と同様にして架橋シート
を得た。Example 2 A crosslinked sheet was obtained in the same manner as in Example 1, except that an imidosilicon polymer (D 9000, trade name, manufactured by GE, USA) was used.
実施例３
イミドシリコン重合体（ＳＩＬＴＥＭ−１５００、米国
ＧＥ社製商品名）とその１００重量部あたり２重量部の
トリアリルイソシアヌレートとをブラベンダーブラスト
ミル（東洋精機社製品）を用いて混練し、ついでプレス
成形してＱ、５ｍｎ厚のシートを作成した後、シートの
片面に１５Ｍｒａｄずつ両面を電子照射し架橋して架橋
シートを得た。Example 3 An imidosilicon polymer (SILTEM-1500, trade name manufactured by GE, USA) and 2 parts by weight of triallyl isocyanurate per 100 parts by weight were kneaded using a Brabender blast mill (manufactured by Toyo Seiki Co., Ltd.). Then, press molding was performed to prepare a sheet with a thickness of 5 mm, and then each side of the sheet was irradiated with electrons at a dose of 15 Mrad to crosslink the sheet to obtain a crosslinked sheet.
比較例１ 実施例１の未照射シートを比較例１とした。Comparative example 1 The unirradiated sheet of Example 1 was designated as Comparative Example 1.
比較例２ 実施例２の未照射シートを比較例２とした。Comparative example 2 The unirradiated sheet of Example 2 was designated as Comparative Example 2.
実施例１〜３及び比較例１〜２で得た各架橋シートにつ
き、引張り強さ、引張伸び、高温熱変形性、高温カット
スルー抵抗、酸素指数、耐有機溶剤性、低温脆化性並び
に体積抵抗率を評価した。For each crosslinked sheet obtained in Examples 1 to 3 and Comparative Examples 1 to 2, tensile strength, tensile elongation, high temperature thermal deformability, high temperature cut-through resistance, oxygen index, organic solvent resistance, low temperature embrittlement, and volume Resistivity was evaluated.
その結果を第１表に示す。なお高温熱変形性は２００℃
で１日加熱した後における変形の有無で評価した。高温
カットスルー抵抗は、１５０℃で評価した。耐有機溶剤
性は、試験シートを常温のアセトン中に７日間浸漬後、
取り出して７字状に折り曲げ１４日間常温で放置した後
、再び同様に折り曲げて割れの発生有無を調べた。低温
脆化性は、ＪＩＳ規格Ｃ−３００５に基づき一３０℃で
行った。The results are shown in Table 1. In addition, high temperature heat deformability is 200℃
Evaluation was made based on the presence or absence of deformation after heating for one day. High temperature cut-through resistance was evaluated at 150°C. Organic solvent resistance was determined by immersing the test sheet in acetone at room temperature for 7 days.
After taking it out, folding it into a figure 7 shape and leaving it at room temperature for 14 days, it was folded again in the same way and examined for cracks. Low-temperature embrittlement was measured at -30°C based on JIS standard C-3005.
第１表 度と比較例して名かに軽度であった。Table 1 The symptoms were mild compared to the comparative example.
各実施は、高温熱変形性、高温カットスルー抵抗が良好
であって、さらに難燃性も良好であることが明らかであ
る。また、引張り強さは少なくとも１．０ｋｇ／ｍ■：
、伸びは少なくとも５０％あれば電線被覆材料として適
用可能と考えられ、各実施例はそれらの基準に合格して
いる。It is clear that each implementation has good high-temperature thermal deformability, high-temperature cut-through resistance, and also good flame retardancy. In addition, the tensile strength is at least 1.0 kg/m■:
If the elongation is at least 50%, it is considered to be applicable as a wire covering material, and each of the examples passed those standards.
Claims (2)
次いで電子線照射して架橋することを特徴とするイミド
シリコン系重合体物品の製造方法。(1) Molding the imidosilicon polymer into the desired shape,
A method for producing an imidosilicon polymer article, which comprises then crosslinking it by irradiating it with an electron beam.
次いで少なくとも２個のエチレン系不飽和官能基を有す
る架橋助剤の存在下で電子線照射して架橋することを特
徴とするイミドシリコン系重合体物品の製造方法。(2) Molding the imidosilicon polymer into the desired shape,
A method for producing an imidosilicon polymer article, which is then crosslinked by electron beam irradiation in the presence of a crosslinking aid having at least two ethylenically unsaturated functional groups.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9885090A JP2832740B2 (en) | 1990-04-13 | 1990-04-13 | Method for producing imidosilicon polymer article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9885090A JP2832740B2 (en) | 1990-04-13 | 1990-04-13 | Method for producing imidosilicon polymer article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03296536A true JPH03296536A (en) | 1991-12-27 |
| JP2832740B2 JP2832740B2 (en) | 1998-12-09 |
Family
ID=14230712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9885090A Expired - Fee Related JP2832740B2 (en) | 1990-04-13 | 1990-04-13 | Method for producing imidosilicon polymer article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2832740B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7576140B2 (en) | 2005-10-18 | 2009-08-18 | Sabic Innovative Plastics Ip B.V. | Method of improving abrasion resistance of plastic article and article produced thereby |
| US7855241B2 (en) | 2005-10-18 | 2010-12-21 | Sabic Innovative Plastics Ip B.V. | Method of improving abrasion resistance of plastic article using nanoparticles and article produced thereby |
-
1990
- 1990-04-13 JP JP9885090A patent/JP2832740B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7576140B2 (en) | 2005-10-18 | 2009-08-18 | Sabic Innovative Plastics Ip B.V. | Method of improving abrasion resistance of plastic article and article produced thereby |
| US7855241B2 (en) | 2005-10-18 | 2010-12-21 | Sabic Innovative Plastics Ip B.V. | Method of improving abrasion resistance of plastic article using nanoparticles and article produced thereby |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2832740B2 (en) | 1998-12-09 |
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