JPH03291976A - Optical device - Google Patents

Abstract

PURPOSE:To obtain an optical device in which an optical semiconductor component securing work is easy and leads are not apprehended to be short-circuited by composing an edge part in which the sidewall of a square groove is crossed with the inner wall of a large-diameter side hole in a circular-arc shaped surface. CONSTITUTION:A square groove 15 to be engaged with a protrusion piece 3 of an optical semiconductor component 1 is provided on the inner wall in a large-diameter hole 13B, and an edge part in which the sidewall of the groove 15 is crossed with the inner wall of the hole 13B is formed in a circular-arc shaped surface R. On the other hand, the outer diameter side of a cylinder 20 made of the same metal of that of an adapter 10 is increased larger than the inner diameter size of the hole 13B to provide a margin of a desired amount. A semicircular groove 30 is provided at a position of the inner wall of the hole 13B corresponding to the groove 15. Further, the opening side of the hole 13B is formed in a conical surface 130 opened larger than the diameter of the cylinder 20.

Description

[Detailed Description of the Invention] [Summary] Regarding an optical device in which an optical semiconductor component is incorporated in a predetermined manner by using a stepped through hole of an adapter, the work of fixing the optical semiconductor component is easy, and there is a risk that the leads may be short-circuited. The purpose of the present invention is to provide an optical device in which an optical semiconductor element is housed in a cylindrical package with a bottom, and the optical semiconductor component has a protrusion on the circumferential surface of the bottom flange of the disc-shaped package. , an adapter that holds the optical semiconductor component in the stepped through-hole has a square groove on the inner wall of the large-diameter side hole of the stepped through-hole, with which the protruding piece engages, and a main body part that holds the optical semiconductor component in the small-diameter side hole. so that the bottom flange of the package is locked to the step end surface of the hole.
The optical semiconductor component is inserted into the stepped through hole, and the optical semiconductor component is fixed by a cylindrical body press-fitted into the large diameter side hole, the device comprising: a side wall of the square groove and the large diameter side hole; The ridgeline portion where the inner wall intersects with the inner wall is formed into an arcuate surface.

[Industrial application field]

The present invention relates to an optical device in which an optical semiconductor component is installed in a predetermined manner using a stepped through hole of an adapter.

Light-receiving element 9 Insert an optical semiconductor component packaged with a light-emitting element, etc., or an optical semiconductor component with a lens and optical semiconductor element built into the package, into the through-hole of the adapter so that the optical axis and the hole axis coincide. Such optical devices are widely used in optical sensors, optical communication devices, and the like.

Such an optical device has the advantage that the optical semiconductor component and the optical path can be efficiently connected by attaching the reference surface of the adapter in close contact with the reference surface of the device base or the like.

FIG. 4 is a diagram of the optical device as described above, (al is a perspective view shown in separated form, and (b) is a sectional view.

In FIG. 4, reference numeral 1 denotes an optical semiconductor component in which an optical semiconductor element such as a light emitting element and a light receiving element is housed in a package. 2 is provided.

The optical semiconductor element has a light emitting surface or a light receiving surface on the axial hole side of the front end of the package, and a plurality of leads 4 are led out rearward from the hole in the package bottom flange 2 and are housed in the package. .

Note that when the square protrusion 3 is made to protrude from the circumferential surface of the package bottom flange 2 and the optical semiconductor component 1 is inserted into the hole of the adapter, the relative position of the glue 4 and the adapter will be It is set in a predetermined manner.

10 is an adapter that holds the lens 5 and the optical semiconductor component 1 together in a predetermined relative position.

The adapter 10 made of metal consists of a rectangular plate-shaped fixing plate part 11 having a pair of screw holes 16 near the left and right side edges, and a cylindrical part 12 protruding from one side of the fixing plate part 11. A stepped through hole 13 passing through the fixing plate portion 11 and the cylindrical portion 12 is provided.

The stepped through-hole 13 consists of a small-diameter side hole 13A and a large-diameter side hole 13B, and the inner diameter of the small-diameter side hole 13A is such that the cylindrical main body of the optical semiconductor component 1 is snugly inserted therein. The inner diameter of the large-diameter side hole 13B is sufficiently larger than the outer diameter of the package bottom flange 2.

Further, the inner wall of the large-diameter side hole 13B is provided with a square groove 15 in which the protruding piece 3 of the optical semiconductor component 1 engages.

The lens 5 is inserted into the small diameter side hole 13A of such an adapter 10.
Push in to secure it in place.

On the other hand, with the distal end surface (light-receiving surface or light-emitting surface) facing the lens 5, the protrusion 3 is engaged with the square groove 15, and the optical semiconductor component l is inserted through the large-diameter side hole 13B to open the main body. The optical semiconductor component 1 is firmly fitted into the small diameter side hole 13A, the package bottom flange 2 is brought into close contact with the stepped end surface of the stepped through hole 13, and the optical semiconductor component 1 is fixed to the adapter 10 in this state.

By combining in this way, the optical axes of both the optical semiconductor component 1 and the lens 5 coincide, and the tip surface of the optical semiconductor component 1 is located at the focal length of the lens 5.

Note that optical semiconductor components in which an optical semiconductor element and a lens are directly incorporated into a package are also widely used.

In an optical device incorporating a lens and an optical semiconductor component in this way, the light emitted from the optical semiconductor element (in the case of a light emitting element) is output from the adapter 10 as a parallel beam. In addition, the light incident on the lens is transmitted to the optical semiconductor element (in the case of a light receiving element).
The light is focused on the light receiving surface.

As described above, the adapter 10, which combines the optical semiconductor component 1 and a lens, is made by inserting a small screw into the screw hole 16 after the side surface of the fixing plate portion 11 is brought into close contact with a reference surface such as a base. By doing so, it can be attached to the device.

At this time, there is a need for a method for fixing optical semiconductor components to adapters easily and without electrical interference.

[Conventional technology]

FIG. 5 is a sectional view of a conventional optical device, and FIG. 6 is another conventional diagram, in which (al is a sectional view and ('b) is a front view.

In FIG. 5, the lens 5 is pushed into the small diameter side hole 13A of the stepped through hole of the adapter 10 and fixed at a predetermined position.

On the other hand, with the tip end facing toward the lens 5, the protrusion is engaged with the square groove, the optical semiconductor component 1 is inserted through the large-diameter side hole 13B, the main body is snugly fitted into the small-diameter side hole 13A, and the package is packaged. The bottom flange 2 is brought into close contact with the stepped end surface of the stepped through hole 13.

Then, the peripheral edge of the package bottom flange 2 and the large diameter side hole 1
The optical semiconductor component 1 is fixed to the adapter by soldering to the inner wall of 3B with solder 18.

Also, instead of soldering, adhesive is used for fixing.

In FIG. 6, 20 is a cylindrical body made of the same metal as the adapter 10.

The cylindrical body 20 has an outer diameter larger than an inner diameter of the large-diameter hole 13B to provide a desired amount of interference.

Push the lens 5 into the small-diameter side hole 13A of the stepped through-hole of the adapter 10 and fix it in a predetermined position, and at the same time, set the tip end face to the lens 5 side, engage the protruding piece 3 in the square groove 15, and then The optical semiconductor component 1 is inserted through the diameter side hole 13B, and the end surface of the package bottom flange 2 is brought into close contact with the stepped end surface of the stepped through hole 13.

Thereafter, the optical semiconductor component 1 is fixed to the adapter 10 by press-fitting the cylindrical body 20 into the large-diameter side hole 13B and pressing the front end surface of the cylindrical body 20 against the rear end surface of the package bottom flange 2.

[Problem to be solved by the invention]

By the way, the above-mentioned conventional fixing means by soldering is inferior in workability because it is sometimes necessary to heat the optical semiconductor component 1 during soldering. Furthermore, there was a risk that the solder would adhere to the leads and cause a short circuit between the adapter and the leads.

Fixing means using an adhesive has a problem in that it takes time for the adhesive to harden.

On the other hand, the means for press-fitting the cylindrical body has excellent workability because the work can be completed in a short time without heating.

However, when press-fitting the cylindrical body into the large-diameter side hole, the end surface or outer circumference of the cylindrical body bites into the ridgeline between the side wall of the square groove and the inner wall of the large-diameter side hole, and the cylindrical body is pressed into the large-diameter side hole while scraping the ridgeline. pushed into.

As a result, as shown in FIG. 6, whiskers 25 are generated, causing a short circuit between the cylindrical body 20 and the lead 4.

The present invention was created in view of these points, and provides an optical device that combines an optical semiconductor component and a lens, in which the work of fixing the optical semiconductor component is easy and there is no risk of lead short-circuiting. The purpose is to

[Means for Solving the Problems] In order to achieve the above object, as illustrated in FIG. It is housed in a cylindrical package with a bottom, and the bottom flange 2 of the package has a
It has a protrusion 3 on the circumferential surface.

The adapter 10 that holds the optical semiconductor component 1 in the stepped through hole 13 has a square groove 15 in which the protruding piece 3 engages with the inner wall of the large diameter side hole 13B.

The main body of the optical semiconductor component 1 is inserted into the small diameter side hole 1 of the stepped through hole 13.
3A, and with the package bottom flange 2 locked to the stepped end surface of the stepped through hole 13, the cylindrical body 20 is press-fitted into the large diameter side hole 13B, thereby fixing the optical semiconductor component 1.

At this time, the ridgeline portion where the side wall of the square groove 15 intersects with the inner wall of the large diameter side hole 13B is configured to be an arcuate surface R.

Further, as illustrated in FIG. 2, a semicircular shape having an opening approximately equal to the opening width of the square groove 15 at a position symmetrical to the square groove 15 at least on the inner wall of the large-diameter side hole 13B into which the cylindrical body 20 is press-fitted. The configuration is such that a groove 30 is provided.

Alternatively, as illustrated in FIG. 3, the opening side of the large-diameter hole 13B into which the cylindrical body 20 is press-fitted is configured to be a conical surface 130 that is expanded to a greater extent than the outer diameter of the cylindrical body 20.

[Effect]

In the present invention, the cylindrical body 20 is inserted into the large-diameter side hole 13B of the adapter lO.
The optical semiconductor component 1 is fixed by press-fitting the cylindrical body 20, but since the ridge line formed by the side wall of the square groove 15 and the inner wall of the large-diameter side hole 13B is an arcuate surface R, the cylindrical body 20
The ridge line will not be scraped when press-fitting. Therefore, hairs do not occur and the adapter 10 and the lead 4 are not short-circuited.

Moreover, in the invention of claim 2, a semicircular groove 30 is provided on the inner wall of the large diameter side hole 13B at a position corresponding to the square groove 15.

Therefore, when the cylindrical body 20 is press-fitted, the cylindrical body 20 fits into the square groove 15.
The axial center of the large-diameter side hole 13B and the axial center of the cylindrical body 20 are aligned without being eccentrically pushed in to the side.

Therefore, not only the generation of whiskers is further suppressed, but also the tightening margin of the cylindrical body 20 becomes substantially uniform, making the press-fitting operation of the cylindrical body 20 easier.

Moreover, in the invention of claim 3, since the opening side of the large-diameter side hole 13B is a conical surface 130 that is expanded larger than the outer diameter of the cylindrical body 20, the cylindrical body 20 when the cylindrical body 20 is press-fitted is
0 and the large-diameter side hole 13B, the insertion-side end surface of the cylindrical body 20 is inserted into the large-diameter side hole 13B.

Therefore, not only is positioning easy, but the cylindrical body 2
The press-fitting work is completed.

Note that since the press-fitting stroke is short, even if whiskers occur, they are short and there is no risk of short circuiting to the wire 4.

〔Example〕

The present invention will be specifically described below with reference to the drawings. Note that the same reference numerals refer to the same objects throughout the plan.

FIG. 1 is a diagram of the invention according to claim 1, in which (al) is a perspective view shown in an isolated form, (b) is a plan view, and (C) is a sectional view. Further, FIG. 2 is a front view of the invention according to claim 2, and FIG. 3 is a diagram of the invention according to claim 3, in which (a) is a sectional view and (b) is a front view.

In FIG. 1, an optical semiconductor component 1 is a light emitting element.

An optical semiconductor element such as a light receiving element is housed in a bottomed cylindrical package having a disc-shaped package bottom flange 2. The optical semiconductor element has a light emitting surface or a light receiving surface on the axial hole side of the front end of the package, and the package bottom flange 2
A plurality of glues 4 are led out rearward from the hole.

Furthermore, when the square protruding piece 3 is made to protrude from the circumferential surface of the package bottom flange 2 and the optical semiconductor component 1 is inserted into the hole of the adapter, the relative position of the glue 4 and the adapter can be adjusted. It is set in a predetermined manner.

The adapter 10 holds the lens 5 and the optical semiconductor component 1 in a predetermined relative position when inserted into the hole of the adapter, so that the relative position between the glue 4 and the adapter is fixed in a predetermined position. A pair of screw holes 16 near the left and right side edges
The fixing plate part 11 has a fixed plate part 11 and a cylindrical part 12 protruding from one side surface of the fixing plate part 11.

The stepped through-hole 13 consists of a small-diameter side hole 13A and a large-diameter side hole 13B, and the inner diameter of the small-diameter side hole 13^ is such that the cylindrical main body of the optical semiconductor component 1 can be inserted snugly therein. The inner diameter of the large-diameter side hole 13B is sufficiently larger than the outer diameter of the package bottom flange 2.

Further, the inner wall of the large-diameter side hole 13B is provided with a square groove 15 in which the protruding piece 3 of the optical semiconductor component 1 engages.

Then, the ridgeline portion between the side wall of the square groove 15 and the inner wall of the large diameter side hole 13B is formed into a circular arc surface R.

On the other hand, a cylindrical body 20 made of the same metal as the adapter 10
The outer diameter thereof is made larger than the inner diameter of the large diameter side hole 13B to provide a desired amount of interference.

The lens 5 is inserted into the small diameter side hole 13A of such an adapter 10.
is pushed in and fixed in a predetermined position, and on the other hand, with the tip surface (light receiving surface or light emitting surface) facing the lens 5 side, the protruding piece 3 is engaged with the square groove 15, and the optical semiconductor component is inserted through the large diameter side hole 13B. 1, fit the main body snugly into the small diameter side hole 13A, bring the end surface of the package bottom flange 2 into close contact with the stepped end surface of the stepped through hole 13, and in that state insert the cylindrical body into the large diameter side hole 13B. 20 is press-fitted and the front end surface of the cylindrical body 20 is crimped onto the rear end surface of the package bottom flange 2, thereby fixing the optical semiconductor component 1 to the adapter 10.

In this way, the lens 5 and the optical semiconductor component 1 are connected to the adapter 10.
By incorporating the optical semiconductor component 1 into the optical semiconductor component 1, the optical axes of both the optical semiconductor component 1 and the lens 5 are made to coincide with each other, and the tip surface of the optical semiconductor component 1 is positioned at the focal length of the lens 5.

Therefore, the ridgeline portion is not scraped when the cylindrical body 20 is press-fitted, and the generation of whiskers is prevented.

The invention of claim 2 provides a rectangular groove 15 as shown in FIG.
The ridgeline portion between the side wall of the side wall and the inner wall of the large diameter side hole 13B is made into a circular arc surface R, and the large diameter side hole 13 into which the cylindrical body 20 is press-fitted.
The position of the inner wall of B symmetrical to the square groove 15 and the square grooves 15 and 9
Semicircular grooves 30 having openings approximately equal to the opening width of the square grooves 15 are provided at two locations in the 0 degree direction, a total of three locations.

Moreover, as shown in FIG. The opening side of the radial hole 13B is a conical surface 130 that is expanded larger than the outer diameter of the cylindrical body 20.

It goes without saying that the present invention can be applied to an optical semiconductor component package in which a lens and an optical semiconductor element are incorporated.

〔Effect of the invention〕

As explained above, the present invention eliminates the risk of hairs occurring when the cylindrical body is press-fitted into the large-diameter hole side and the optical semiconductor component is fixed to the stepped through-hole of the adapter. There will be no short circuit between the leads and the adapter. Further, since there is little eccentricity between the cylindrical body and the stepped through hole, and the pressing force is small, the cylindrical body can be press-fitted easily, which provides excellent practical effects.

[Brief explanation of drawings]

FIG. 1 is a diagram of the invention of claim 1, (a) is a perspective view shown in separated form; ω) is a plan view, tc) is a cross-sectional view, FIG. 2 is a front view of the invention of claim 2; FIG. 3 is a diagram of the invention of claim 3, (a) is a cross-sectional view, (b) is a front view; Figure 4 is a diagram of an optical device. (a) is a perspective view shown in separated form; (bl is a cross-sectional view, Figure 5 is a diagram of the conventional example; Figure 6 is a diagram of another conventional example, (a) is a cross-sectional view, (bl is a front view. In the figure, 1 is an optical semiconductor component, 2 is the package bottom flange, 3 is a protrusion, 4 is lead, 10 is an adapter, 12 is a cylindrical part; 13A is a small diameter side hole, 15 is a square groove; 25 is a beard; 130 is a conical surface, R indicates a circular arc surface. 5 is the lens, 11 is a fixing plate part; Work 3 is a stepped through hole, 13B is a large diameter side hole; 20 is a cylindrical body, 30 is a semicircular groove, Yu-ku Agpuku Jin Ming Li map of packed ice term 1 Deaf 1 Diagram Optical device diagram Diagram of conventional example Figure 5 Date of origin of name blue request item 2 Between the front of the moon Figure 2 Noku (a,) (the law of nature Claim 3/)! Ming figure No. figure (a) Ise otsu no (da square ita・1) No. figure

Claims (3)

[Claims] (1) An optical semiconductor component (1) in which an optical semiconductor element is housed in a cylindrical package with a bottom has a projection (3) on the circumferential surface of a disc-shaped package bottom flange (2), The adapter (10) that holds the optical semiconductor component (1) in the stepped through hole (13) is connected to the large diameter side hole (13B) of the stepped through hole (13).
) has a square groove (15) in which the projecting piece (3) engages, and the main body fits into the small diameter side hole (13A) and the package bottom flange (2) engages with the step end surface of the hole. The optical semiconductor component (1) is inserted into the stepped through hole (13) so that the optical semiconductor component (1) An optical device to be fixed, characterized in that a ridgeline portion where the side wall of the square groove (15) intersects with the inner wall of the large-diameter side hole (13B) is formed into an arcuate surface R. (2) The device according to claim 1, wherein the cylindrical body (2
A semicircular groove (30) having an opening width approximately equal to the opening width of the square groove (15) is located at least at a position symmetrical to the square groove (15) on the inner wall of the large-diameter side hole (13B) into which the large-diameter side hole (13B) is press-fitted. An optical device characterized by being provided with. (3) The device according to claim 1, wherein the cylindrical body (2
A conical surface (130
).