JPH0329181B2 - - Google Patents

Info

Publication number
JPH0329181B2
JPH0329181B2 JP12101884A JP12101884A JPH0329181B2 JP H0329181 B2 JPH0329181 B2 JP H0329181B2 JP 12101884 A JP12101884 A JP 12101884A JP 12101884 A JP12101884 A JP 12101884A JP H0329181 B2 JPH0329181 B2 JP H0329181B2
Authority
JP
Japan
Prior art keywords
refrigerant
frame
heat transfer
boiling
frame body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12101884A
Other languages
Japanese (ja)
Other versions
JPS611041A (en
Inventor
Atsushi Kanda
Kazuo Kitani
Kiichiro Shirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP12101884A priority Critical patent/JPS611041A/en
Publication of JPS611041A publication Critical patent/JPS611041A/en
Publication of JPH0329181B2 publication Critical patent/JPH0329181B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

【発明の詳細な説明】 〔発明の属する技術分野〕 本発明は半導体スタツクの如き電気機器を密閉
容器内の沸騰性冷媒中に浸し、該冷媒の気液の相
変化を伴う循環を利用して前記電気機器の冷却を
行う沸騰冷媒式冷却装置に関する。この種の冷却
装置においては前記密閉容器に対し沸騰冷媒の漏
れや外気の侵入を極力防止するための高い気密性
が要求されかつ収納される電気機器の帯電部に対
して有害な異物の混入防止が要件になるととも
に、その生産に際して特に量産の場合には品質管
理が容易である上に製作コストの低いことが望ま
れる。
[Detailed description of the invention] [Technical field to which the invention pertains] The present invention immerses electrical equipment such as a semiconductor stack in a boiling refrigerant in a closed container, and utilizes circulation involving a gas-liquid phase change of the refrigerant. The present invention relates to a boiling refrigerant type cooling device for cooling the electrical equipment. In this type of cooling device, the sealed container is required to be highly airtight to prevent boiling refrigerant from leaking and outside air from entering as much as possible, and to prevent harmful foreign matter from entering the charged parts of the electrical equipment that is housed. is a requirement, and especially in the case of mass production, it is desired that quality control is easy and production costs are low.

〔従来技術とその問題点〕[Prior art and its problems]

この種の沸騰冷媒式冷却装置として従来第7図
及び第8図に示す如きものがしられている。即ち
発熱源となる半導体スタツクの如き電気機器6は
密閉容器の冷媒沸騰部1の内部に貯留された沸騰
冷媒7の中に適宜の手段により完全に浸る如く保
持されている。前記電気機器6のリード線は前記
密閉容器の冷媒沸騰部1の適宜の個所に配置され
た気密端子5を介して外部に引き出される。更に
前記密閉容器の冷媒沸騰部1の上部には電気機器
6の損失熱を吸収して沸騰気化した冷媒7の気相
部分が流入する伝熱フイン15を備えた冷媒凝縮
室8とその上方に位置する空気だめ室10、並び
に冷媒凝縮室8を複数の溝状の室に分割する如く
配置されたその外壁が前記冷媒7の気相部分に接
触しかつそれ自体の内部を外気が流通する如く両
側面が外界に開口した溝状に形成され内部に伝熱
フイン13の配置された冷却室9から構成される
冷媒凝縮部2が設けられる。その際前記密閉容器
の冷媒沸騰部1の内部の電気機器6には高電圧が
印加されるから沸騰冷媒としては通常フロン11
3の如く電気的に絶縁性を有する物質が使用され
る。
As this type of boiling refrigerant type cooling device, the one shown in FIGS. 7 and 8 is known. That is, an electric device 6 such as a semiconductor stack which is a heat source is held by appropriate means so as to be completely immersed in a boiling refrigerant 7 stored inside a refrigerant boiling section 1 of a closed container. Lead wires of the electrical equipment 6 are led out to the outside through airtight terminals 5 disposed at appropriate locations in the refrigerant boiling section 1 of the hermetic container. Further, in the upper part of the refrigerant boiling part 1 of the sealed container, there is a refrigerant condensing chamber 8 equipped with a heat transfer fin 15 into which the vapor phase portion of the refrigerant 7 which has absorbed the heat loss of the electrical equipment 6 and has been boiled and vaporized flows thereinto. The air reservoir chamber 10 located therein as well as its outer wall arranged to divide the refrigerant condensing chamber 8 into a plurality of groove-shaped chambers are in contact with the gas phase portion of the refrigerant 7 and the outside air flows through the interior thereof. A refrigerant condensing section 2 is provided, which is constituted by a cooling chamber 9 formed in the shape of a groove with both sides open to the outside and in which heat transfer fins 13 are arranged. At that time, since a high voltage is applied to the electrical equipment 6 inside the refrigerant boiling part 1 of the sealed container, the boiling refrigerant is usually CFC 11.
An electrically insulating material such as No. 3 is used.

前記の如くにして構成された沸騰冷媒冷却装置
においては気液の相変化を伴う沸騰冷媒7の前記
密閉容器内の循環の際に、前記電気機器6の損失
熱が当該電気機器に接触する部分における沸騰熱
伝達、冷媒凝縮室8における気相冷媒の凝縮熱伝
達並びに冷却室9内の伝熱フイン13における対
流熱伝達により外気中に放出されて前記電気機器
6の冷却が行われる。その際前記冷却装置の冷却
能力並びに長期間にわたる信頼性を確保するため
に前記冷却装置内部における冷媒の気液両相から
なる冷却系に対する気密保持が重要な条件とな
り、通常前記冷却装置の気密度は前記密閉容器の
各部を溶接あるいはろう付けなどにより接合して
その漏れ量が10-7atm.cc/sec以下になる如くに保
持される。
In the boiling refrigerant cooling device configured as described above, there is a portion where the loss heat of the electrical equipment 6 comes into contact with the electrical equipment 6 when the boiling refrigerant 7 that undergoes a gas-liquid phase change is circulated in the closed container. The electrical equipment 6 is cooled by being released into the outside air by boiling heat transfer in the refrigerant condensing chamber 8, condensation heat transfer of the gaseous refrigerant in the refrigerant condensing chamber 8, and convective heat transfer in the heat transfer fins 13 in the cooling chamber 9. At that time, in order to ensure the cooling capacity and long-term reliability of the cooling device, it is important to maintain airtightness of the cooling system consisting of both gas and liquid phases of the refrigerant inside the cooling device, and usually the airtightness of the cooling device is The parts of the hermetic container are joined together by welding or brazing to maintain the leakage amount to 10 -7 atm.cc/sec or less.

前述の如き気密保持を目的として第7図の冷媒
凝縮部2の本体2aにまず上部ヘツダ4及び下部
ヘツダ3をそれぞれ溶接した後その全体を冷媒沸
騰部1に溶接する。また冷媒沸騰部1の内部の電
気機器6のリード線を外部に引き出すための気密
端子5も冷媒沸騰部1の適宜の個所に配置溶接さ
れる。その際冷媒凝縮部2の上部ヘツダ4の内側
に形成される空気だめ室10は、第7図に示す如
く冷却室9により複数個の溝状の室に分割された
冷媒凝縮室8のそれぞれに連絡していて前記密閉
容器内部の圧力を均一化するとともに、前記冷却
装置の長期間使用中に不可避的に前記密閉容器内
に侵入する微量の外気を貯留して冷媒凝縮部2に
おける凝縮性能の低下を防止する役目を果たす。
For the purpose of maintaining airtightness as described above, an upper header 4 and a lower header 3 are first welded to the main body 2a of the refrigerant condensing section 2 shown in FIG. 7, respectively, and then the whole is welded to the refrigerant boiling section 1. Further, an airtight terminal 5 for drawing out a lead wire of an electric device 6 inside the refrigerant boiling section 1 to the outside is also placed and welded at an appropriate location in the refrigerant boiling section 1. At this time, the air reservoir chamber 10 formed inside the upper header 4 of the refrigerant condensing section 2 is connected to each of the refrigerant condensing chambers 8 divided into a plurality of groove-shaped chambers by the cooling chamber 9, as shown in FIG. In addition to equalizing the pressure inside the hermetic container, it also improves the condensing performance in the refrigerant condensing section 2 by storing a small amount of outside air that inevitably enters the hermetic container during long-term use of the cooling device. It plays a role in preventing deterioration.

一方冷媒凝縮部2の内部における冷媒凝縮室8
と冷却室9との構成は、例えば第8図に示す如く
その内部に水平方向に通気し得る伝熱フイン13
を有し両側面が外気に開口する溝状の冷却室9と
内部に垂直方向に気相冷媒の通路を形成する伝熱
フイン15を内蔵する溝状の冷媒凝縮室8とが水
平方向に交互に配置される如くに隔板11によつ
て相互に区切られるとともに、冷却室9はその上
辺と下辺とを、また冷媒凝縮室8はその前面と背
面とを適宜の閉鎖材12及び14により閉鎖され
それぞれが一方向にのみ貫通する如くにされる。
On the other hand, a refrigerant condensing chamber 8 inside the refrigerant condensing section 2
The structure of the cooling chamber 9 is, for example, as shown in FIG.
A groove-shaped cooling chamber 9 with both sides open to the outside air and a groove-shaped refrigerant condensing chamber 8 having built-in heat transfer fins 15 that form vertical passages for vapor phase refrigerant therein alternate horizontally. The cooling chamber 9 is closed at its upper and lower sides, and the refrigerant condensing chamber 8 is closed at its front and rear sides by appropriate closing members 12 and 14. and each of them is made to penetrate only in one direction.

その際前記冷却装置全体の軽量化と冷媒凝縮室
8と冷却室9とにおける伝熱特性の向上とを目的
として前記伝熱フイン13及び15、隔板11並
びに閉鎖材12及び14などにはアルミニウム材
が使用されるが、更に製品の品質管理の向上を図
ることをも考慮して、アルミニウムの心材に接合
用ろうの被覆された所謂ブレーシング材を素材と
する隔板11を用いて、冷媒凝縮室8並びに冷却
室9を第8図の如くに構成した後、該構成体を塩
浴槽あるいは炉の中で所定の条件に従つて加熱並
びに冷却することにより前記各部材相互の接合部
の一斉ろう付けをおこなつている。
In this case, for the purpose of reducing the weight of the entire cooling device and improving heat transfer characteristics in the refrigerant condensing chamber 8 and the cooling chamber 9, the heat transfer fins 13 and 15, the partition plate 11, the closing members 12 and 14, etc. are made of aluminum. However, in consideration of improving the quality control of the product, the partition plate 11 is made of so-called bracing material, which has an aluminum core coated with a bonding wax. After configuring the condensing chamber 8 and the cooling chamber 9 as shown in FIG. 8, the components are heated and cooled in a salt bath or furnace according to predetermined conditions, so that the joints between the respective members are heated and cooled at the same time. Brazing is being performed.

前記の如く構成された沸騰冷却装置の密閉容器
においては冷媒凝縮室8並びに冷却室9は一斉ろ
う付けが行われるが、その他の冷媒沸騰部1の形
成、あるいは冷媒凝縮部2における本体2aとヘ
ツダ3及び4の接合、もしくは冷媒沸騰部1と冷
媒凝縮部2との相互の接合などは全て通常の溶接
作業を必要とするから、作業的に労力と熟練とを
要する人為的な要素が残存しかつ溶接ひずみや気
泡にもとずく気密に対する信頼性の低下、あるい
は作業中の異物の密閉容器内への侵入など品質管
理上に多くの懸念材料を伴う結果折角の前述の各
部材の一斉ろう付けの効果化が著しく減殺される
うえに、特に同一製品を量産する如き場合に経済
的に不利になることを免れない。
In the closed container of the boiling cooling device configured as described above, the refrigerant condensing chamber 8 and the cooling chamber 9 are brazed all at once, but the formation of the other refrigerant boiling section 1 or the main body 2a and the header in the refrigerant condensing section 2 are performed. Since the joining of parts 3 and 4, or the mutual joining of the refrigerant boiling part 1 and the refrigerant condensing part 2, all require normal welding work, there remains an artificial element that requires labor and skill. Moreover, there are many concerns regarding quality control, such as a decrease in the reliability of airtightness due to welding distortion and air bubbles, and the intrusion of foreign matter into the sealed container during work, resulting in the simultaneous brazing of each of the above-mentioned parts. Not only does this significantly reduce the effectiveness of the process, but it also inevitably becomes economically disadvantageous, especially when mass-producing the same product.

〔発明の目的〕[Purpose of the invention]

本発明は従来の沸騰冷媒式冷却装置が有する前
述の如き欠点に鑑み、接合ろう材の被覆された素
材から予め所定の形状に形成された全ての各部材
を安定した条件のもとで一斉に気密接合して沸騰
冷媒式冷却装置の密閉容器を構成する如くするこ
とにより、製作に際し特に量産の場合、品質管理
が容易で高い信頼性を有しかつ工数の節減したが
つてまたコストの低減された沸騰冷媒式冷却装置
を提供することを目的とする。〔発明の要点〕 前記の目的を達成するために本発明では首記の
冷却装置において、適宜の板材からなる隔板の一
方の面に閉環状の1個の枠体を、また他方の面の
上部と下部とに2個の閉環状の枠体をそれぞれ配
置し、前記1個の枠体の内部に垂直方向に通気し
得る如く伝熱フインを、また前記上下に配置され
た2個の枠体相互の間に水平方向に通気し得る如
くに伝熱フインをそれぞれ配置してなる単位構成
体を別の前記隔板を介在させて所定の個数積層
し、前記垂直方向に通気し得る如くに配置された
伝熱フインの部分に密閉された冷媒凝縮室を、ま
た前記水平方向に通気し得る如くに配置された伝
熱フインの部分に両側面で外気に開口する冷却室
を交互に位置する如くにそれぞれ形成し、前記積
層体の両端を適宜の板材からなる端板により挾持
し、前記各隔板の上部に形成された穴と前記1個
の枠体内部の前記伝熱フインの上方の空間並びに
前記2個の枠体のうち上方に配置される枠体内部
の空間とにより空気だめ室を、また前記各隔板の
下部に形成された穴と前記1個の枠体内部の前記
伝熱フインの下方の空間並びに前記2個の枠体の
うち下方に配置される枠体内部の空間とにより冷
媒沸騰室をそれぞれ前記積層体を積層方向に貫通
する如くに形成し、かつ前記各部材の内の少なく
とも隔板、枠体の部材が接合ろう材により被覆さ
れた素材からなり、前記各部材からなる構成体が
適宜のろう付設備内で所定の条件に従つて部材相
互間の一斉ろう付けの行われる如くするととも
に、前記両端板に形成され前記冷媒沸騰室に通ず
る口出用穴に前記冷媒沸騰室内の沸騰冷媒中に適
宜の手段により固定保持された前記被冷却電気機
器のリード線の引出用気密端子を接合して密閉す
ることにより、溶接の如く人為的要素を含む作業
が一切不要の完全密閉容器からなる沸騰冷媒式冷
却装置を構成するものである。
In view of the above-mentioned drawbacks of conventional boiling refrigerant type cooling devices, the present invention has been developed to simultaneously process all members pre-formed into predetermined shapes from materials coated with a joining brazing material under stable conditions. By airtightly connecting the sealed container of the boiling refrigerant type cooling device, quality control is easy and high reliability is achieved, especially in the case of mass production. The purpose of the present invention is to provide a boiling refrigerant type cooling device. [Summary of the Invention] In order to achieve the above object, the present invention provides the above-mentioned cooling device, in which a closed ring-shaped frame is provided on one side of the partition plate made of a suitable plate material, and a closed ring-shaped frame is provided on the other side of the partition plate. Two closed annular frames are arranged in the upper and lower parts, heat transfer fins are provided inside the one frame so as to allow ventilation in the vertical direction, and the two frames arranged above and below each other. A predetermined number of unit structures each having heat transfer fins arranged between the bodies so as to allow ventilation in the horizontal direction are stacked with another partition plate interposed therebetween, and the unit structure is stacked so as to allow ventilation in the vertical direction. Sealed refrigerant condensing chambers are alternately located in the portions of the heat transfer fins that are arranged, and cooling chambers that are open to the outside air on both sides are placed alternately in the portions of the heat transfer fins that are arranged to allow ventilation in the horizontal direction. Both ends of the laminate are sandwiched between end plates made of appropriate plate materials, and holes formed in the upper part of each partition plate and above the heat transfer fins inside the one frame body are formed. The space and the space inside the upper frame of the two frames form an air reservoir, and the holes formed at the bottom of each partition plate and the air flow inside the one frame form an air reservoir. A refrigerant boiling chamber is formed by the space below the heat fin and the space inside the frame disposed below of the two frames so as to penetrate through the stack in the stack direction, and each of the members At least the diaphragm and frame members are made of a material covered with a joining brazing material, and the structure consisting of each of the above members is simultaneously brazed between the members in accordance with predetermined conditions in an appropriate brazing equipment. At the same time, a lead wire of the electrical equipment to be cooled is fixedly held in the boiling refrigerant in the refrigerant boiling chamber by an appropriate means in an outlet hole formed in the both end plates and communicating with the refrigerant boiling chamber. By joining and sealing the airtight terminals for extraction, a boiling refrigerant type cooling device consisting of a completely sealed container that does not require any manual work such as welding is constructed.

〔発明の実施例〕[Embodiments of the invention]

次に図面に表された実施例にもとづいて本発明
の詳細を説明する。
Next, details of the present invention will be explained based on embodiments shown in the drawings.

第1図及び第2図において板状の隔板21の一
方の面に棒材からなる1個の枠体22を、また他
方の面に同様に棒材からなる2個の枠体23及び
24を枠体23が下方に枠体24が上方に位置す
る如くにそれぞれ配置し、枠体22の内部には垂
直方向に通気し得る如くにされた薄板材からなる
波形の伝熱フイン15を、また枠体23と枠24
との間には水平方向に通気し得る如くにされた同
様に薄板材からなる波形の伝熱フイン13をそれ
ぞれ配置する。この様にして隔板21、枠体2
2,23および24並びに伝熱フイン13及び1
5から構成された単位構成体を第2図に示す如く
相互の間に別の隔板21を介在させて所定の個数
積層しかつ該積層体の両端を板状の端板20によ
つて挾持し、伝熱フイン15の位置する部分には
枠体22によつて密閉された冷媒凝縮室8を、ま
た伝熱フイン13の位置する部分にはその両側方
が外気に開口する溝状の冷却室9をそれらが交互
に位置する如くに形成する。
In FIGS. 1 and 2, one frame 22 made of a bar is placed on one side of a plate-shaped partition 21, and two frames 23 and 24 made of a bar are placed on the other side. are arranged so that the frame body 23 is located at the bottom and the frame body 24 is located at the top, and inside the frame body 22, corrugated heat transfer fins 15 made of a thin plate material are arranged to allow ventilation in the vertical direction. Also, the frame body 23 and the frame 24
A corrugated heat transfer fin 13 made of a thin plate material and designed to allow ventilation in the horizontal direction is arranged between the two. In this way, the partition plate 21, the frame body 2
2, 23 and 24 and heat transfer fins 13 and 1
As shown in FIG. 2, a predetermined number of unit structures composed of 5 are laminated with another partition plate 21 interposed between them, and both ends of the laminate are sandwiched by plate-shaped end plates 20. In the part where the heat transfer fins 15 are located, there is a refrigerant condensing chamber 8 sealed by a frame 22, and in the part where the heat transfer fins 13 are located, there is a groove-shaped cooling groove that opens to the outside air on both sides. The chambers 9 are formed such that they are located alternately.

その際前記の各構成部材の内少なくとも隔板2
1、枠体22,23及び24は何れもアルミニウ
ムを心材として表面に接合用ろう材が予め被覆さ
れた素材所謂ブレージング材をもつて形成し、端
板20によつて挾持された前記各部材の積層体を
例えば真空ろう付け炉の如き適宜ののう付け設備
内で所定の条件に従い加熱並びに冷却して前記各
部材相互の一斉ろう付けを行なう。その結果隔板
21の上部の穴28と枠体22の内部の前記伝熱
フイン15の上方の空間並びに枠体24の内部空
間とにより前記積層体を積層方向に貫通する空気
だめ室10が、また隔板21の下部と穴27と枠
体22の内部の前記伝熱フイン15の下方の空間
並びに枠体23の内部空間とにより前記積層体を
積層方向に貫通する冷媒沸騰部1の内室がそれぞ
れ形成される。更に前記積層体の両端の端板20
の下部には前記冷媒沸騰部1の内室に通ずる穴2
6が設けられかつ該穴26に口出部25、この場
合はパイプからなる口出部が接合される。この口
出部25の接合は、積層体が一斉ろう付けされる
前に、例えば第1図に示すようなブレージング材
またはろう材から円環板25aを間に挾んで口出
部25を端板20に当接しておくことにより、積
層体の一斉ろう付けと同時に行なうことができ
る。そして口出部25を介して前記内室の内部に
適宜の手段により固定保持された被冷却電気機器
(図示せず)のリード線を外部に引き出し、冷媒
沸騰部1の内室に所定量のフロン113の如き冷
媒を充填するとともに気密端子(図示せず)によ
り前記口出部25を気密に封鎖して前記電気機器
の沸騰冷媒式冷却装置が構成される。
In this case, at least the partition plate 2 of the above-mentioned constituent members
1. The frames 22, 23, and 24 are all made of a so-called brazing material with aluminum as the core material and the surface coated with a bonding brazing material in advance. The laminate is heated and cooled according to predetermined conditions in a suitable soldering equipment such as a vacuum brazing furnace to simultaneously braze each of the members. As a result, an air reservoir chamber 10 is formed which penetrates the stacked body in the stacking direction by the hole 28 in the upper part of the partition plate 21, the space above the heat transfer fins 15 inside the frame body 22, and the internal space of the frame body 24. In addition, an inner space of the refrigerant boiling section 1 that penetrates the stacked body in the stacking direction is formed by the lower part of the partition plate 21, the hole 27, the space below the heat transfer fins 15 inside the frame body 22, and the inner space of the frame body 23. are formed respectively. Furthermore, end plates 20 at both ends of the laminate
A hole 2 communicating with the inner chamber of the refrigerant boiling section 1 is provided at the bottom of the .
6 is provided and an outlet 25, in this case consisting of a pipe, is joined to the hole 26. To join the outlet portion 25, before the laminate is brazed all at once, the outlet portion 25 is connected to the end plate by inserting an annular plate 25a between brazing material or brazing material as shown in FIG. 20, it is possible to perform simultaneous brazing of the laminate at the same time. Then, the lead wires of the electrical equipment to be cooled (not shown) fixedly held inside the inner chamber by appropriate means are pulled out through the outlet portion 25, and a predetermined amount of the coolant is poured into the inner chamber of the refrigerant boiling section 1. A boiling refrigerant type cooling device for the electrical equipment is constructed by filling a refrigerant such as Freon 113 and hermetically sealing the outlet 25 with an airtight terminal (not shown).

前記の如くにして構成された沸騰冷媒式冷却装
置においては冷媒沸騰部1の内室に固定保持され
た前記電気機器の損失熱が前記沸騰冷媒の気液の
相変化を伴う前記密閉容器内の循環により、冷媒
が前記電気機器に接触する部分における沸騰熱伝
達、冷媒凝縮室8の内部における気相冷媒の凝縮
熱伝達並びに冷却室9の伝熱フイン13における
対流熱伝達により外気中に放出され前記電気機器
の冷却が行われる。ところで枠体22,23およ
び24は閉環状にする必要があるが、断面形状が
各枠体の平面形状をした引抜き加工または押出加
工等により形成された管材から所望厚さに切出こ
とにより継ぎ目なしの閉環状の枠体を形成でき
る。
In the boiling refrigerant type cooling device configured as described above, the heat loss of the electric equipment fixedly held in the inner chamber of the refrigerant boiling section 1 is caused by the gas-liquid phase change of the boiling refrigerant in the closed container. Due to the circulation, the refrigerant is released into the outside air due to boiling heat transfer at the part where it contacts the electrical equipment, condensation heat transfer of the vapor phase refrigerant inside the refrigerant condensing chamber 8, and convective heat transfer at the heat transfer fins 13 of the cooling chamber 9. Cooling of the electrical equipment is performed. Incidentally, the frames 22, 23, and 24 need to be formed into a closed ring shape, but the joints can be made by cutting to a desired thickness from a tube material formed by drawing or extrusion, whose cross-sectional shape is the planar shape of each frame. It is possible to form a closed annular frame without any.

これらの枠体22,23および24を棒材30
により形成する場合は、それぞれ第3図、第4図
および第5図に示す如く、棒材30を適当に閉環
状に折曲して棒材30の両端部を突き合わせ、こ
の突き合わせ部をろう付け等に結合する。棒材3
0を直角に折曲する際に、この折曲部に図示する
ように予め切込みを施すことによつて作業を容易
にかつ安全にすることができる。
These frames 22, 23 and 24 are attached to a bar 30.
When forming the rod 30, as shown in FIGS. 3, 4, and 5, the bar 30 is appropriately bent into a closed ring shape, both ends of the bar 30 are butted together, and the abutted portions are brazed. etc. Bar material 3
When bending the 0 at right angles, the work can be made easier and safer by making a cut in the bent portion in advance as shown in the figure.

各枠体の突き合わせ部の接合は第3図a、第4
図aおよび第5図aに示すように突き合わせ部3
5に望ましくは隔板21と同一のブレージング材
よりなる接合片32を挾んでろう付けすることに
より行なうことも、また第3図b、第4図bおよ
び第5図bに示すように、棒材30の両端部を所
定長さ、内側に直角に折曲し、この折曲部33,
33を相互に突き合わせてこの突き合わせ部36
をろう付けすることにより行なうことも可能であ
る。
The joints of the butt parts of each frame are shown in Figures 3a and 4.
As shown in Figure a and Figure 5a, the abutting portion 3
5, it is also possible to sandwich and braze a joining piece 32 preferably made of the same brazing material as the partition plate 21, or as shown in FIGS. 3b, 4b, and 5b. Both ends of the material 30 are bent inward at right angles to a predetermined length, and the bent portions 33,
33 to each other and this abutting portion 36
It is also possible to do this by brazing.

更に第6図aおよびbに示す如く前記枠体2
2,23および24並びに隔板21が双方ともに
ブレージング材からなる結果枠体の切込み31あ
るいは突合わせ部35または36に空隙が僅かり
残つていても前記ろう付け作業中に前記枠体およ
び隔板の双方からろうが供給されて空隙が埋めら
れるのでこれらの個所のろう付けも確実にするこ
とができる利点がある。
Furthermore, as shown in FIGS. 6a and 6b, the frame 2
2, 23 and 24 and the partition plate 21 are both made of brazing material. Even if there is a slight gap left in the notch 31 of the frame body or the abutment part 35 or 36, the frame body and the partition plate 21 are made of brazing material during the brazing operation. Since solder is supplied from both sides of the plate to fill the voids, there is an advantage that brazing at these locations can be ensured.

前記積層体から構成される密閉容器において冷
媒沸騰部1の内室は前記被冷却電気機器を収納し
かつ前記電気機器と前記内室の壁との間に必要な
絶縁距離を保つて沸騰冷媒中に浸すに足る容積を
有しているため、前記内室の内圧が増大した場合
前記枠体23に生ずる応力が著しく高くなる虞れ
があるから、第4図に示す如く特に枠体23の切
込み31の存在する部分の応力を緩和しかつ補強
し得る如くに隔板21の穴27の形状、寸法並び
に隅角半径が選定される。
In the airtight container made of the laminate, the inner chamber of the refrigerant boiling section 1 accommodates the electrical equipment to be cooled and maintains a necessary insulation distance between the electrical equipment and the wall of the inner chamber to accommodate the boiling refrigerant. Since the frame body 23 has a sufficient volume to be immersed in water, there is a risk that the stress generated in the frame body 23 will increase significantly when the internal pressure of the interior chamber increases. The shape, size, and corner radius of the hole 27 in the partition plate 21 are selected so as to relieve stress and reinforce the portion where the hole 31 is present.

更に前記枠体22,23並びに24の素材とし
てろう材の被覆された薄板材からなる溝形棒材を
使用する場合はむくの棒材を使用する場合に比較
して前記各枠体の成形時の断面変形が小で、した
がつて前記各枠体の前記積層体における相互積層
のろう付面の平面度の崩れが少なくろう付けのた
めの相互の重ね代が減少する虞がない上に、同様
にブージング材からなる隔板21あるいは端板2
0ともなじみ易く多少の寸法誤差があつてもこれ
を吸収することができるから、本発明の如く比較
的に複雑な形状を備えた部材を多数組合めて密閉
容器を構成する場合には著しく有利である。
Furthermore, when using groove-shaped bars made of thin plates coated with brazing material as the material for the frames 22, 23, and 24, the molding time of each frame is faster than when using solid bars. The cross-sectional deformation of is small, and therefore the flatness of the brazing surfaces of mutually laminated layers in the laminated body of each frame body is less likely to collapse, and there is no risk of reducing mutual overlapping allowance for brazing, and Partition plate 21 or end plate 2 similarly made of bousing material
0 and can absorb some dimensional errors, so it is extremely advantageous when constructing a sealed container by combining a large number of members with relatively complex shapes as in the present invention. It is.

〔発明の効果〕〔Effect of the invention〕

本発明は以上に説明した如く半導体スタツクの
如き電気機器を密閉容器の沸騰冷媒中に浸し、該
冷媒の気液の相変化を伴う循環を利用して前記電
気機器の冷却を行う沸騰冷媒式冷却装置におい
て、適宜の板材からなる隔板の一方の面に適宜の
棒材からなる1個の枠体を、また他方の面の上部
と下部とに同様に適宜の棒材からなる2個の枠体
をそれぞれ配置し、前記1個の枠体の内部に垂直
方向に通気し得る如く伝熱フインを、また前記上
下に配置された2個の枠体相互の間に水平方向に
通気し得る如くに伝熱フインをそれぞれ配置して
なる単位構成体を別の前記隔板を介在させて所定
の個数積層し、前記垂直方向に通気し得る如くに
配置された伝熱フインの部分に密閉された冷媒凝
縮室を、また前記水平方向に通気しうる如くに配
置された伝熱フインの部分に両側面で外気に開口
する冷却室を交互に位置する如くにそれぞれ形成
し、前記積層体の両端を適宜の板材からなる端板
により挾持し、前記各隔板の上部に形成された穴
と前記1個の枠体の内部の前記伝熱フインの上方
の空間並びに前記2個の枠体のうち上方に配置さ
れる枠体の内部空間とにより空気だめ室を、また
前記各隔板の下部に形成された穴と前記1個の枠
体の内部の前記伝熱フインの下方の空間並びに前
記2個の枠体のうち下方に配置される枠体の内部
空間とにより冷媒沸騰室をそれぞれ前記積層体を
積層方向に貫通する如くに形成し、かつ少なくと
も前記隔板、枠板が接合用ろう材により被覆され
た素材からなり、前記部材からなる構成体が適宜
のろう付け設備内で所定の条件に従つて部材相互
間の一斉ろう付けの行われる如くするとともに、
前記両端板に形成され前記冷媒沸騰室に通ずる口
出用穴に前記冷媒沸騰室内の沸騰冷媒中に適宜の
手段により固定保持された前記被冷却電気機器の
リード線の引出用気密端子を接合して密閉するこ
とにより、沸騰冷媒式冷却装置の密閉容器を入手
容易なブレージング材からなる枠体と板状体とか
ら構成し簡単な組立と各部材の一斉ろう付けとに
より装置全体の軽量化を容易にするとともに、煩
雑で工数を要求する溶接作業を排して気密接合部
の品質の均一化を図り、かつ溶接時のスパツタや
現物合せ時の粉の如き異物が密閉容器内に侵入す
るのを防止して製品の信頼性の向上と製造コスト
の低減とを図り得る効果がある。そして口出部2
5を他の部材のろう付けが行なわれるとき同時に
ろう付けを行なうようにすれば人為的要素を含む
作業をさらに少なくすることができる。
As described above, the present invention provides a boiling refrigerant type cooling method in which an electrical device such as a semiconductor stack is immersed in a boiling refrigerant in a closed container, and the electrical device is cooled by utilizing circulation accompanied by a gas-liquid phase change of the refrigerant. In the device, one frame made of a suitable bar is placed on one side of a partition plate made of a suitable plate, and two frames made of a suitable bar are placed on the upper and lower parts of the other side. heat transfer fins are placed inside the one frame body so as to allow ventilation in the vertical direction, and between the two frame bodies arranged above and below so as to allow ventilation in the horizontal direction. A predetermined number of unit structures each having heat transfer fins arranged on the fins are laminated with another partition plate interposed therebetween, and the heat transfer fins are sealed in the portions of the heat transfer fins arranged so as to allow ventilation in the vertical direction. Refrigerant condensing chambers and cooling chambers open to the outside air on both sides are formed alternately in the portions of the heat transfer fins arranged to allow ventilation in the horizontal direction, and both ends of the laminate are formed. It is sandwiched by end plates made of appropriate plate materials, and is connected to the holes formed in the upper part of each of the partition plates, the space above the heat transfer fin inside the one frame body, and the upper part of the two frame bodies. An air reservoir is defined by the internal space of the frame body disposed in A refrigerant boiling chamber is formed by the inner space of the frame body disposed below among the frame bodies, respectively, so as to penetrate the laminated body in the lamination direction, and at least the partition plate and the frame plate are made of a bonding brazing material. The structure is made of a coated material, and the members are simultaneously brazed in accordance with predetermined conditions in an appropriate brazing equipment, and
Connecting airtight terminals for drawing out lead wires of the electrical equipment to be cooled, which are fixedly held in the boiling refrigerant in the refrigerant boiling chamber by appropriate means, to outlet holes formed in the both end plates and communicating with the refrigerant boiling chamber. The airtight container of the boiling refrigerant cooling system is constructed from a frame body and plate-shaped body made of easily available brazing material, and the weight of the entire system is reduced by simple assembly and simultaneous brazing of all parts. In addition, it eliminates complicated and man-hour-intensive welding work to ensure uniform quality of airtight joints, and prevents foreign matter such as spatter during welding and powder from joining the parts from entering the sealed container. This has the effect of improving product reliability and reducing manufacturing costs by preventing this. And exit part 2
If 5 is brazed at the same time as other members are brazed, the work involving human elements can be further reduced.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の沸騰冷媒式冷却装置の構成部
材を示す概略斜視図、第2図は前記部材より構成
された本発明の前記冷却装置の概略縦断面図、第
3図a,b、第4図a,b及び第5図a,bは前
記部材のうち棒材から形成される各枠体の概略正
面図、第6図a,bは前記枠体と板状体との接合
部を示す部分的な横断面図、第7図は従来装置を
示す縦断面図、第8図は従来装置の凝縮部の概略
をしめす斜視図である。 1……冷媒沸騰部、8
……冷媒凝縮室、9……冷却室、10……空気だ
め室、2……端板、21……隔板、22,23及
び24……枠体、25……口出部、26……端板
に形成された穴、27及び28……隔板に形成さ
れた穴、30……枠体の素材。
FIG. 1 is a schematic perspective view showing the constituent members of the boiling refrigerant type cooling device of the present invention, FIG. 2 is a schematic vertical cross-sectional view of the cooling device of the present invention constructed from the above-mentioned members, and FIGS. 3 a, b, Figures 4a, b and 5a, b are schematic front views of each frame formed from a bar among the members, and Figures 6a, b are the joints between the frame and the plate-shaped body. 7 is a longitudinal sectional view showing a conventional device, and FIG. 8 is a perspective view schematically showing a condensing section of the conventional device. 1...refrigerant boiling section, 8
... Refrigerant condensing chamber, 9 ... Cooling chamber, 10 ... Air reservoir chamber, 2 ... End plate, 21 ... Partition plate, 22, 23 and 24 ... Frame, 25 ... Outlet, 26 ... ... Holes formed in the end plate, 27 and 28 ... Holes formed in the partition plate, 30 ... Material of the frame.

Claims (1)

【特許請求の範囲】 1 半導体スタツクの如き電気機器を密閉容器内
の沸騰冷媒中に浸し、該冷媒の気液の相変化を伴
う循環を利用して前記電気機器の冷却を行う沸騰
冷媒式冷却装置において、適宜の板材からなる隔
板の一方の面に閉環状の1個の枠体を、また他方
の面の上部と下部とに同様に閉環状の2個の枠体
をそれぞれ配置し、前記1個の枠体の内部に垂直
方向に通気し得る如く伝熱フインを、また前記上
下に配置された2個の枠体相互の間に水平方向に
通気し得る如くに伝熱フインをそれぞれ配置して
なる単位構成体を別の前記隔板を介在させて所定
の個数積層し、前記垂直方向に通気し得る如くに
配置された伝熱フインの部分に密閉された冷媒凝
縮室を、また前記水平方向に通気しうる如くに配
置された伝熱フインの部分に両側面で外気に開口
する冷却室を交互に位置する如くにそれぞれ形成
し、前記積層体の両端を適宜の板材からなる端板
により挾持し、前記各隔板の上部に形成された穴
と前記1個の枠体の内部の前記伝熱フインの上方
の空間並びに前記2個の枠体のうち上方に配置さ
れる枠体の内部空間とにより空気だめ室を、また
前記各隔板の下部に形成された穴と前記1個の枠
体の内部の前記伝熱フインの下方の空間並びに前
記2個の枠体のうち下方に配置される枠体の内部
空間とにより冷媒沸騰室をそれぞれ前記積層体を
積層方向に貫通する如くに形成してなることを特
徴とする沸騰冷媒式冷却装置。 2 特許請求の範囲第1項に記載の装置におい
て、前記各枠体が溝形棒材から形成されてなるこ
とを特徴とする沸騰冷媒式冷却装置。 3 特許請求の範囲第1項並びに第2項の何れか
に記載の装置において、前記隔板の一方の面の上
部と下部とに配置される前記枠体のうち少なくと
も下部に配置される枠体に生ずる応力を緩和しか
つ該枠体を補強する如く、前記隔板の下部に形成
される穴の形状、寸法並びに隅角半径を選定して
なることを特徴とする沸騰冷媒式冷却装置。 4 特許請求の範囲第1項ないし第3項の何れか
に記載の装置において、前記隔板、枠体、伝熱フ
イン、端板等の各部材をろう付けにより一体に結
合したことを特徴とする沸騰冷媒式冷却装置。
[Scope of Claims] 1. Boiling refrigerant type cooling in which an electrical device such as a semiconductor stack is immersed in a boiling refrigerant in a closed container, and the electrical device is cooled by utilizing circulation accompanied by a gas-liquid phase change of the refrigerant. In the device, one closed ring-shaped frame is arranged on one side of a partition plate made of a suitable plate material, and two similarly closed ring-shaped frames are arranged on the upper and lower parts of the other side, respectively, Heat transfer fins are provided inside the one frame body to allow ventilation in the vertical direction, and heat transfer fins are provided between the two frames arranged above and below to allow ventilation in the horizontal direction. A predetermined number of unit structures are stacked with another partition plate interposed therebetween, and a refrigerant condensation chamber sealed in a portion of the heat transfer fins arranged to allow ventilation in the vertical direction is provided. Cooling chambers that are open to the outside air on both sides are formed alternately in the portions of the heat transfer fins arranged to allow ventilation in the horizontal direction, and both ends of the laminate are formed with ends made of appropriate plate materials. A frame body which is sandwiched between the plates and is disposed above the hole formed in the upper part of each of the partition plates, the space above the heat transfer fin inside the one frame body, and the frame body disposed above the two frame bodies. An air reservoir chamber is defined by an internal space, and an air reservoir is defined by a hole formed in the lower part of each of the partition plates, a space below the heat transfer fin inside the one frame body, and a lower part of the two frame bodies. 1. A boiling refrigerant type cooling device, characterized in that a refrigerant boiling chamber is formed by an internal space of a frame disposed in the laminate so as to penetrate through the laminate in the laminate direction. 2. A boiling refrigerant type cooling device according to claim 1, wherein each of the frames is formed from a groove-shaped rod. 3. In the device according to any one of claims 1 and 2, a frame body disposed at least at a lower part of the frame bodies disposed at an upper part and a lower part of one surface of the partition plate. A boiling refrigerant type cooling device characterized in that the shape, size, and corner radius of the hole formed in the lower part of the partition plate are selected so as to relieve the stress generated in the frame and to reinforce the frame. 4. The device according to any one of claims 1 to 3, characterized in that each member such as the diaphragm, the frame, the heat transfer fins, and the end plate is integrally joined by brazing. A boiling refrigerant type cooling device.
JP12101884A 1984-06-13 1984-06-13 Vapor coolant type cooler Granted JPS611041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12101884A JPS611041A (en) 1984-06-13 1984-06-13 Vapor coolant type cooler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12101884A JPS611041A (en) 1984-06-13 1984-06-13 Vapor coolant type cooler

Publications (2)

Publication Number Publication Date
JPS611041A JPS611041A (en) 1986-01-07
JPH0329181B2 true JPH0329181B2 (en) 1991-04-23

Family

ID=14800765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12101884A Granted JPS611041A (en) 1984-06-13 1984-06-13 Vapor coolant type cooler

Country Status (1)

Country Link
JP (1) JPS611041A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559366A (en) * 1994-08-04 1996-09-24 Micron Technology, Inc. Lead finger tread for a semiconductor lead package system
US6076596A (en) * 1996-03-14 2000-06-20 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US6148905A (en) * 1999-04-30 2000-11-21 Motorola, Inc. Two-phase thermosyphon including air feed through slots
WO2020057306A1 (en) * 2018-09-21 2020-03-26 浙江嘉熙科技有限公司 High-power thermal superconducting plate-fin combined radiator

Also Published As

Publication number Publication date
JPS611041A (en) 1986-01-07

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