JPH03290463A - Electrically conductive resin composition - Google Patents

Abstract

PURPOSE:To obtain the title composition having excellent conductivity, antistatic property, heat resistance and moldability by blending a polyphenylene ether resin with a specific copolymer, conductive carbon and N-lauryl-DL-aspartic acid-beta-lauryl ester at specific amounts. CONSTITUTION:The aimed composition obtained by blending 100 pts.wt. total of (A) 50-95wt.%, preferably 70-90wt.% polyphenylene ether resin [e.g. poly(2,6- dimethyl-1,4-phenylene) ether] and (B) 50-5wt.%, preferably 30-10wt.% copolymer of 30-95wt.% styrene compound and 70-5wt.% imide compound (e.g. maleic imide) of,-unsaturated dicarboxylic acid with (C) 5-30 pts.wt., preferably 8-20 pts.wt. conductive carbon (e.g. acetylene black) and (B) 0.1-20 pts.wt., preferably 3-15 pts.wt. N-lauryl-DL-aspartic acid-O-laulyl ester.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention has electrical conductivity and antistatic properties, and has excellent acid processability as represented by melt flow index and heat resistance as represented by heat distortion temperature. This invention relates to an excellent conductive resin composition.

[Conventional technology]

2. Description of the Related Art As electronic devices become more densely packaged, IC components are mounted on through-hole boards and the like in order to further increase the density. However, if the IC component absorbs moisture, water vapor will be generated inside the IC when the flow solder is heated, causing blisters or cranks, and damaging the IC component. It was necessary to set up a process to dry IC components at a temperature of over 30°C to remove moisture. Conventionally, the IC component drying process involves drying IC components from conductive vinyl chloride resin or polystyrene resin trays to an aluminum tray. After being transferred to a die-cast tray and dried, it was transferred again to the tray and shipped, which required a complicated process.Therefore, as a simplification of the process and an alternative to the expensive aluminum die-cast tray, we developed a 120°
The use of resin-made heat-resistant trays for ICs that do not warp even in the IC drying process of C or higher and have excellent dimensional stability is being considered. In addition, IC magazine cases, racks into which printed circuit boards are inserted, etc. are required to be heat resistant to temperatures of 120°C or higher, and resin cases and resin racks are being considered.

Heat-resistant resin compositions include, for example, boria resins, polyester resins, and the like containing glass fibers, but since they are all crystalline resins, they have large mold shrinkage rates and poor dimensional stability. Additionally, there are non-grade resins such as polycarbonate containing glass fibers, but the inclusion of glass fibers causes the molded products to warp and lack dimensional stability. Examples of highly heat-resistant non-grade resins include polyether sulfone, polyarylate, polyetherimide, etc., but these have poor moldability and are difficult to put to practical use.

[Problem to be solved by the invention]

The present invention provides a conductive resin composite acid having conductivity, antistatic properties, heat resistance of 120° C. or higher, and excellent moldability.

(Means for solving !III!I) The present inventors
As a result of intensive studies to solve the above problems, we found polyphenylene ether resin, a copolymer of a styrene compound and an imide compound of α,β unsaturated dicarboxylic acid, conductive carbon, and N-lauryl-DL-aspartic acid-β-lauryl. We have discovered that a resin composition obtained by blending esters in a specific ratio and melt-kneading can achieve the above objectives,
We have arrived at the present invention.

That is, in the present invention, (A) polyphenylene ether resin is 50 to 95% by weight.
, (B) 50 to 5% by weight of a copolymer of a styrene compound and an imide compound of α,β unsaturated dicarboxylic acid (C) conductive carbon based on 100 parts by weight of the above (A) + (B) is 5 to 3 parts (D) and 0.61 to 20 parts by weight of N-lauryl-DL-aspartic acid β-lauryl ester based on 100 parts by weight of the above (A) + (B). Conductive resin &11 of the present invention that provides a composite acid
fi, the polyphenylene ether resin that makes up the product,
The following general formula (wherein R, R, R3 and R4 are each independently composed of a hydrogen atom, a halogen atom, a hydrocarbon group, a halohydrocarbon group, a hydrocarbonoxy group and a halohydrocarbonoxy group) It is a homopolymer or copolymer containing one or more units selected from the group, n represents the total number of monomer units (an integer of 20 or more).

The method for producing polyphenylene ether resin is not particularly limited, but US Pat. No. 3,306,874 and US Pat.
No. 75, No. 3257357 and No. 3257358
It can be produced by the reaction of phenols according to the method described in No. These phenols include 2,6-dimethylphenol, 2.6-dinitylphenol, 2.6-dibutylphenol, 2.6-dilaurylphenol, 2.
6-dipropylphenol, 2,6-diphenylphenol, 2-methyl-6-nitylphenol, 2-methyl-6-cyclohexylphenol, 2-methyl-6-medoxyphenol, 2-methyl-6-butylphenol,
Examples include, but are not limited to, 2.6-simethoxyphenol, 2,3.6-dolimethylphenol, 2.3,5.6-titramethylphenol and 2,6-siethoxyphenol. . In the present invention,
A preferred polyphenylene ether resin is poly(2,6-
dimethyl-L4-phenylene) ether.

Styrene compounds forming a copolymer of a styrene compound and an imide compound of an α,β unsaturated dicarboxylic acid used in the present invention include styrene, α-methylstyrene, 0-methylstyrene, p-methylstyrene, etc. can be given.

The imide compound of α,β unsaturated dicarboxylic acid is represented by the following formula (wherein R+, Rt and R1 represent a hydrogen atom, an alkyl group, an alkenyl group, a cycloalkyl group, a phenyl group, a phenylene group, or an alkylene group). sell. Specifically, maleimide, N-methylmaleimide, N
-Cyclohexy0 lumaleimide, N-phenylmaleimide, N-
(p-hydroxyphenyl)maleimide, N-benzylmaleimide, etc. In the copolymer of the styrenic compound of the present invention and an imide compound of an α,β unsaturated dicarboxylic acid, the styrenic compound and an α,β unsaturated The proportion of dicarboxylic acid compound is 30% of styrene compound.
~95% by weight, and 70~5% by weight of the imide compound of α,β unsaturated dicarboxylic acid, and preferably has a number average molecular weight of 10,000 or less based on standard polystyrene using Gelber knee chromatography method (GPC). .

The ratio of the polyphenylene ether resin of the present invention to the copolymer of a styrene compound and an imide compound of α, β unsaturated dicarboxylic acid is 50 to 9.
5% by weight, 50-5% by weight of a copolymer of a styrene compound and an imide compound of α,β-unsaturated dicarboxylic acid, the preferred range being 70-90% by weight of polyphenylene ether resin,
It is a copolymer of a styrene compound and an imide compound of α,β unsaturated dicarboxylic acid in an amount of 30 to 10% by weight. If the polyphenylene ether resin is less than 50% by weight, the heat resistance will be insufficient, and if it exceeds 95% by weight, the fluidity will be poor and a good molded product will not be obtained.

In the present invention, the conductive carbon is one that imparts high conductivity and significantly lowers the surface resistance of the resin by filling it into #l resin, and acetylene black, furnace black, etc. are preferably used. Specifically, the furnace black is Ketchen Black EC (
Commercially available products include Asahi H3-500 (trade name of Asahi Carbon Co., Ltd.), Palcan XC72 (trade name of CABOT Co., Ltd., USA), etc.

The amount of conductive carbon contained is 5 to 30 parts by weight, preferably 8 to 20 parts by weight, per 100 parts by weight of (A) + (B). If it is less than 5 parts by weight, the conductivity will be insufficient, and if it exceeds 30 parts by weight, fluidity and mechanical strength will decrease, making it difficult to obtain a good molded product.

In the present invention, N-lauryl-DL-aspartic acid-β-lauryl ester is commercially available and (
A) + (B) 0.1 to 20 per 100 parts by weight of labor
Parts by weight, preferably 3 to 15 parts by weight. If it is less than 0.1 part by weight, fluidity will be poor and it will be difficult to obtain a good molded product. If it exceeds 20 parts by weight, heat resistance will decrease.

In the present invention, it is also possible to add high impact polystyrene and various elastomers. Examples of various nitrogen distomers include styrene-butadiene rubber, styrene-butadiene-steref ternary block copolymer elastomer and its butadiene portion hydrogenated, ethylene-propylene rubber, and ethylene-propylene-diene ternary copolymer elastomer. , methyl methacrylate ethyl acrylate core-shell type elastomer, and the like. (A) + (B) It is preferable to add 1 to 20 parts by weight of high impact polystyrene or various elastomers per 100 parts by weight of tc.

There are no particular limitations on the method for producing the conductive resin composition of the present invention, and generally known methods can be employed. That is, a polyphenylene ether resin, a copolymer of a styrene compound and an imide compound of α,β unsaturated dicarboxylic acid, conductive carbon, and N-lauryl-DL-aspartic acid-β-lauryl ester are mixed using a high-speed stirrer or the like. After uniformly mixing, the mixture is melt-kneaded and pelletized using a single-screw or multi-screw extruder with sufficient mixing capacity. In addition, pigments, dyes, glass fibers, metal fibers,
Reinforcing agents such as carbon fiber, fillers such as talc and calcium carbonate, antioxidants, ultraviolet absorbers, lubricants, flame retardants, antistatic agents, and the like can be added.

〔Example〕

The present invention will be explained in more detail with reference to Examples below. The characteristics of the resin compositions described in Examples and Comparative Examples were evaluated according to the following method: (1) Melt flow index (molding processability): load 10 kg, temperature 300
Measured according to J 1347210 at .

(2) Heat deformation temperature (heat resistance) JIS-720 at bending stress of 18.56 kg/cd
Measured according to 7.

(3) Surface resistance of molded products A flat plate of 100 mm square and 11 mm thick was molded by injection molding, and measured using a surface resistance meter (manufactured by Mitsubishi Yuka Co., Ltd., trade name: Resistand).

Examples 1 to 3 Polyphenylene ether resin (02M Polymer Co., Ltd.)
Intrinsic viscosity 0.5 in chloroform at 25°C
], copolymer of α, β unsaturated dicarboxylic acid with imide compound (80% by weight of styrene, 20% by weight of N-methylmaleimide), Ketchen Black EC (manufactured by Niakshi, Netherlands) as conductive carbon, elastomer Hydrogenated (styrene-butadiene-styrene) block copolymer [manufactured by Shell Chemical Co., Ltd., trade name Fleton G-16]
50)), N-lauryl-DL-aspartic acid-β-
Lauryl ester (manufactured by Ajinomoto Co., Inc.) was blended in the proportions shown in Table 1, kneaded at a temperature of 270 to 300°C, and pelletized. Test pieces were molded from these pellets by injection molding, and the evaluation results are shown in Table 1.

Examples 4 to 5 In Examples 1 to 3, 90% by weight of styrene,
The procedure was the same as in Examples 1 to 3 except that N-phenylmale 4741110% by weight was used and ethylene-propylene rubber (manufactured by JSR Corporation, trade name EP 02 P) was used as the elastomer. It is shown in Table 1.

Example 6 In Examples 4 to 5, 75% by weight of styrene was used as a copolymer of α, β unsaturated dicarboxylic acid with an imide compound;
The same procedure was used except that 25% by weight of N-cyclohexylmaleimide was used, and the results are shown in Table 1.

Comparative Examples 1 to 5 Examples 1 to 6 were carried out in the same manner as in Examples 1 to 6 except that the blending ratio was changed. Either resistance is significantly reduced and it does not have sufficient practical value.

〔Effect of the invention〕

The conductive resin composition of the present invention has excellent moldability, thermal properties, and conductivity, and has great practical value.

Endurance

Claims (1)

[Scope of Claims] 1) (A) 50 to 95% by weight of polyphenylene ether resin, (B) 50 to 5% by weight of copolymer of styrene compound and imide compound of α,β unsaturated dicarboxylic acid ( C) 5 to 30 parts by weight of conductive carbon (D) per 100 parts by weight of (A) + (B), and N-lauryl- per 100 parts by weight of (A) + (B). A conductive resin composition containing 0.1 to 20 parts by weight of DL-aspartic acid-β-lauryl ester.