JPH03289147A - Bonding device of semiconductor chip - Google Patents

Abstract

PURPOSE:To position a bonding part accurately by putting a pin in a pin hole intermittently in synchronization with pitch feeding of a lead frame by a pitch feeding means. CONSTITUTION:A means for correcting a feed position of a lead frame 2 is provided on a conveyance route of the lead frame 2 by a pitch feeding means. This feed position correcting means is constructed of a plurality of pins 21 which are provided in projection at pitches in the feed direction of the lead frame 2 and put in pin holes 22 opened at pitches in the lead frame 2, and of driving means 24 to 28 which move these pins 21 vertically so that these pins 21 be put in these pin holes 22 in synchronization with the pitch feeding, and the sizes of the pins on the downstream side are made larger than those of the pins on the upstream side. According to this constitution, it is possible to correct the feed position of the lead frame accurately and to position a bonding part of the lead frame in the position in which a bond is applied and in the position in which a semiconductor is mounted accurately.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a bonding device for semiconductor chimps, and more specifically, the present invention relates to a bonding apparatus for semiconductor chimps, and more specifically, bonding portions formed at pitches on a lead frame are fixed at bond application positions by a bond application means, The present invention relates to means for correcting the feeding position of a lead frame in order to accurately position a semiconductor chip at a mounting position by a mounting means.

(Prior art) A means for bonding a semiconductor chip to a lead frame is to provide a bond application means and a mounting means on the conveyance path of the lead frame, and to pinch-feed the lead frame while
Bond is applied to bonding portions formed at pitches on the lead frame, and a semiconductor chip is mounted on the applied bond.

In performing such a bonding operation, the bonding portion must be accurately positioned at the bond application position by the bond application means and at the semiconductor chip mounting position by the mounting means. For this purpose,
A lead frame feeding means disclosed in Japanese Patent No. 2-188328 has been proposed.

The lead frame is positioned in the transport direction so that the bonding part of the leading semiconductor chip on the lead frame is positioned upstream of the coating position and at a pinch feed start position that is an integral multiple of the pitch with respect to the mounting position. There is provided an adjustment means for adjusting the pitch feed start position of the lead frame.

(Problem B to be solved by the invention) However, in the above conventional means, since there are various errors such as dimensional errors of the lead frame, the lead frame is fed at a pitch that is an integral multiple of the pitch as described above. Accurate positioning at the starting position is actually extremely difficult, and even if it were possible to do so, various errors such as pitch feed errors will occur, so the required positional accuracy cannot be achieved. It is almost impossible to accurately position the bonding part at the bond application position or mounting position so as to satisfy the following.

Therefore, an object of the present invention is to provide a means for solving the problems of the conventional means described above.

(Means for Solving the Problems) For this purpose, the present invention provides a lead frame feed position correction means in the lead frame conveyance path by the pitch feed means in this kind of semiconductor chip bonding apparatus, and corrects the feed position. The means includes a plurality of pins protruding at pitches in the feed direction of the lead frame and fitted into pin holes drilled at pitches in the lead frame, and these pins are moved in synchronization with the pitch feed. , and a driving means for moving these pins up and down in order to fit them into the pin holes, and the size of the pins on the downstream side is made larger than the size of the pins on the upstream side.

(Function) According to the above configuration, the positional deviation of the lead frame in the feeding direction is corrected by intermittently fitting the pin into the pin hole in synchronization with the pinch feeding of the lead frame by the pinch feeding means. , the bonding part is accurately positioned at the bond application position and mounting position.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a front view of the bonding apparatus, with reference numeral 1 representing a main body table, and a magazine 3 for storing lead frames 2 stacked therein is provided at the front thereof. Further, on the top of the table 1, there are provided a pitch feeding means 4 for the lead frame 2, a bond applying means 5 such as a dispenser for applying a bond to the lead frame 2, and a mounting device for mounting a semiconductor chip 7 on the applied bond. Means 6 are arranged in parallel. Reference numeral 8 denotes a conveying means located above the magazine 3 for suctioning the lead frame 2 onto the pad 9 and conveying it to the pitch feeding means 4.

The pitch feed means 4 includes an upper claw 41 and a lower claw 42, and clamps the side edge of the lead frame 2 transported by the transport means 8 from above and below, and moves it toward the bond application means 5 and the mounting means 6. The pitch is sent intermittently. A plurality of bonding portions (generally called islands) for semiconductor chips 7 are formed on the lead frame 2 at intervals, and the feeding pitch of the pinch feeding means 4 is made to match the pitch of the bonding portions. Also, in synchronization with this pitch feeding, the gap T between the bond application means 5 and the mounting means 6 is set so that bond application and mounting of the semiconductor chip 7 can be performed.
is set to be an integral multiple of the above pitch.

In addition, if the pitch of the bonding part changes due to a change in the type of lead frame 2, the above-mentioned interval T can be adjusted by adjusting the feeding pitch of the pitch feeding means 4 and adjusting the position of the bond application means 5 in the feeding direction. It is adjustable.

FIG. 2 shows a means for correcting the feed position of the lead frame 2. As shown in FIG. Reference numeral 20 denotes a frame arranged in parallel with the upper claw 41 on the conveyance path of the lead frame 2, and a plurality of pins 21 (21a to 21e) are protruded at a pitch from the lower surface of the frame. Further, a pin hole 22 into which the pin 21 is inserted is bored in the side edge of the lead frame 2 with a pinch (see also FIG. 3). K is the above-mentioned bonding part, and a bond is applied to this bonding part K, and the semiconductor chimp 7 is mounted thereon.

The pins 218 to 21e are in the feeding direction N of the lead frame 2.
Its diameter gradually increases from the upstream side to the downstream side, and its tip has a tapered surface 23 so that it can be easily fitted into the pin hole 22.

As shown in FIG. 4, the frame 20 is supported by a rod 24, and a roller 2 is pivotally attached to the lower end of the rod 24.
5 is in contact with the cam 26. 27 is a front guide,
A coil spring 28 presses the roller 25 against the cam 26, and these members 24 to 28 constitute a driving means for moving the pin 21 up and down. Therefore, when the cam 26 is rotated by a motor or the like, the pin 21 moves up and down and fits into the pin hole 22. This fitting timing is opposite to the clamping timing of the lead frame 2 by the upper claw 41 and the lower claw 42, and when the upper claw 41 and the lower claw 42 are opened to release the clamped state, the pin 21 is lowered. pin hole 22
When the upper claw 41 and the lower claw 42 are clamped, the upper claw 41 and the lower claw 42 separate from the pin hole 22.

Here, as shown in the partially enlarged view of FIG. 2 (a) and FIG. 3 (a), when the first pin 21a descends and fits into the pin hole 22, there is a positional error in the , the tapered surface 23 of the pin 21a hits the inner edge of the pin hole 22, causing the lead frame 2 to move slightly (△) in the X2 direction.
t1) Move to correct this position error. Also the third
As shown in Figure (b), when the lead frame 2 is pitch-fed and the pin 21b fits into the pin hole 22,
Similarly, the position correction of Δt2 is performed. FIG. 3(c) and the partially enlarged view (b) of FIG. 2 show how the pin 21e with the largest diameter is inserted into the pin hole 22, and the position is corrected by a distance Δt5.

In this manner, as the lead frame 2 is pinch-fed downstream, the pins 21 whose pin diameters gradually become larger are fitted into the pin holes 22 in order.
As the lead frame 2 is pitch-fed, the position is gradually and strictly corrected in the feeding direction, and the bonding portion is accurately positioned at the bond application position by the bond application means 5 and the mounting position by the mounting means 6. becomes. In addition, FIG. 2 is a partially enlarged view (a).

As shown in (b), if the pin 21 is not inserted deeply into the pin hole 22 and only the tapered part at the tip is inserted, when the pin 21 rises and comes out of the pin hole 22, the pin 21 It is possible to prevent the lead frame 2 from being misaligned due to large sliding friction occurring between the outer circumferential surface of the lead frame 21 and the inner edge of the pin hole 22.

Further, as for the shape of the pin 21, as shown in FIG.
Any shape is sufficient as long as it can be smoothly fitted into the 2.

The present device has the above-described configuration, and the operation will now be explained with reference to FIG.

In FIG. 6(a), three lead frames 2a, 2
b and 2c are on the conveyance path, and the upper claw 41 and lower claw 42 are in an open and unclamped state. In the figure, lO is an NC table for moving the conveying means 8 in the feeding direction;
A sensor 11 detects the rear end of the lead frame 2.

In this state, the conveying means 8 descends and adsorbs the lead frames 2d stacked on the magazine 3, and the upper claws 41 and lower claws 42 close to clamp the lead frames 2 on the conveyance path (see FIG. b)).

Next, the pitch feeding means 4 pinch-feeds the clamped lead frame 2 forward, and the conveying means 8 conveys the lead frame 2d forward.
The front end of the front end is held at the standby value Wa ((C) in the same figure).

Next, the conveying means 8 descends and moves forward slightly to feed the lead frame 2d into the clamping position of the upper claw 41 and the lower claw 42, and the upper claw 41 and the lower claw 42 open and return to their original positions. (d)) Then, as the conveying means 8 rises, the upper claw 41 and the lower claw 42 clamp the leading end of the lead frame 2d (FIG. 2(e)), and pitch-feed the lead frame 2d forward.

Next, as shown in FIG. 3(f), the conveying means 8 returns above the magazine 3 to prepare for conveying the next lead frame 2e, and the upper claw 41 and the lower claw 42 move the lead frame 2 intermittently. Pitch forward while clamping the
The lead frame 2 has arrived just below the bond application means 5
A bond is applied to the bonding portion K by the bond coating means 5, and the semiconductor chip 7 is mounted on the bond at the bonding portion that has reached just below the mounting means 6.

By the way, as stated in the above-mentioned Japanese Patent Application Laid-open No. 62-188328, the position of the leading bonding portion of the lead frame 2 at the standby position a in FIG. 6(C) is as follows.
It is desirable to set the mounting position to a position that is an integral multiple of the pitch of the bonding part. However, as mentioned above, dimensional errors of the lead frame 2 and NC table 1
Due to various errors such as a stopping error of 0, it is actually difficult to accurately wait at such an integral multiple position.

Furthermore, even if this were possible, there would be an error in the pitch feed of the pinch feed means 4, and slippage would easily occur, especially when the upper claw 41 and the lower claw 42 clamp the lead frame 2 and pinch feed it. , a feeding error occurs, and it is almost impossible to accurately position the bonding part K at the bond application position by the bond application means 5 or at the mounting position of the semiconductor chip by the mounting means 6.

Therefore, the present means corrects the feed position of the lead frame 2 by moving the pin 21 up and down in synchronization with the pinch feed by the upper claw 41 and the lower claw 42, and intermittently fitting the pin 21 into the pin hole 22. However, the bonding part K can be accurately positioned and stopped at the bond application position or mounting position. Therefore, the standby position a does not need to be an integral multiple of the position described above, and the conveying means 8 only needs to roughly feed the lead frame 2 toward the pinch feeding means 4 side. The bonding part K can be accurately stopped at the bond application position or the mounting position while gradually and accurately correcting the position of the frame 2.

(Effects of the Invention) As described above, the present invention provides lead frame feed position correction means in the lead frame conveyance path by the pitch feed means, and adjusts the pitch in the feed direction of the lead frame by this feed position correction means. A plurality of pins protrude from the lead frame and fit into pin holes that are opened by pinching the lead frame. and a drive means for moving the pins up and down, and the size of the pins on the downstream side is larger than the size of the pins on the upstream side. It is possible to accurately correct the feed position of the lead frame and accurately position the bonding portion of the lead frame at the bond application position or the semiconductor chip mounting position.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention, in which Fig. 1 is a front view of the bonding device, Fig. 2 is a front view of the main part, and Fig. 3 (
a), (b), and (c) are plan views during feeding;
The figure is a front view of the vertical movement means, Figure 5 is a side view of another embodiment of the pin, Figures 6 (a), (b), (c),
(d), (e) and (f) are front views of the pitch feeding order. 2... Lead frame 4... Pitch feeding means 5... Bond application means 6... Mounting means 7... Semiconductor chip 8... Transport means 21... Pins 22... Pin holes 24 ~28...Driving means

Claims (1)

[Claims] A bond application means for applying a bond to a bonding portion of a lead frame, a mounting means for mounting a semiconductor chip on the applied bond, and a lead frame is intermittently connected to the bond application means and the mounting means. In a semiconductor chip bonding apparatus equipped with a pitch feeding means for feeding the lead frame in a fixed pitch manner, and a conveying means for conveying the lead frame to the pitch feeding means, the conveyance path of the lead frame by the pitch feeding means includes:
A feed position correcting means for the lead frame is provided, and the feed position correcting means includes a plurality of pin holes protruding at a pitch in the feed direction of the lead frame and fitted into pin holes opened at a pitch in the lead frame. and a driving means for moving these pins up and down in synchronization with the pitch feed to fit them into the pin holes, and the size of the pins on the downstream side is set to the size of the pins on the upstream side. A semiconductor chip bonding device characterized in that the size of the pin is larger than that of a semiconductor chip.