JPH03288626A - Laminater - Google Patents

Abstract

PURPOSE:To decrease the contamination of chips produced during film cutting by providing chip suction means for suctioning film chips produced on the occasion of cutting the film in the proximity of the cutting position of the continuous film. CONSTITUTION:By releasing the lock of a positioning engagement knob 109 during the use period of the rotating blades of a rotary cutter and drawing out a rotating blade support material 16 this side, the distance between the fixed blade 15 and rotating blade 17 of the rotary cutter is spread widely. Next, the tip end side of a laminated film 1B in the supplying direction that is separated by a film separating material 3 is made disposing in front of a main vacuum plate 6, a tip end winding film support material 12, and the fixed blade 15, and thereby the film is left to be suction-held to the main vacuum plate 6 and tip end winding film support material 12. And, in the vicinity of the cutting position of the continuous laminated film 1B, a cut chip box 201 is provided that serves to suck and collect film chips produced on the occasion of cutting the film 1B and, onto the predetermined position of the cut chip box 201, a suction duct 202 secured to a suction device is joined.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a film attachment technique, and is particularly applicable to a film attachment technique in which a film corresponding to the length of a substrate is attached to a film attachment surface of a substrate. It is related to effective technology.

[Conventional technology]

2. Description of the Related Art In the manufacturing process of printed wiring boards used in electronic devices such as computers, there is a step of attaching a laminate to the surface of a printed wiring board.

The laminate is formed of a photosensitive resin layer (resist layer) and a transparent resin film. The photosensitive resin layer is directly adhered to the surface of the printed wiring board. A translucent resin film is formed on the surface of the photosensitive resin layer to protect it.

The pasting of the laminate to the printed wiring board is described in Japanese Patent Application Laid-Open No. 63-117487, which was previously filed by the applicant of the present application.
As described in the above publication, this is done using a laminator. In this laminator, the process of attaching the laminate to the printed wiring board is as described above.

First, the board transport mechanism transports the leading end of the printed wiring board in the transport direction to a film attachment position and stops it.

Next, the main vacuum plate (film supply member) sucks the leading end side of the continuous (elongated) laminate supplied from the film supply roller in the supply direction and the surface facing the transparent resin film. do. A film tacking member is provided at the tip of the main vacuum plate on the film sticking position side, and the most extreme side of the laminate in the supply direction is attracted to the film tacking member. As mentioned above, this film tacking member is provided with suction holes connected to the vacuum system that sucks the laminate, and also has a built-in heater for tacking the leading edge of the laminate. .

Next, the main vacuum plate and the film temporary attachment member are brought close to the film attachment position (the surface of the tip of the printed wiring board in the conveying direction).

Then, the leading edge side of the laminate in the supply direction is brought into contact with the surface (film attachment surface) of the tip end of the printed wiring board in the conveyance direction, and tacking is performed by thermocompression bonding with a film tacking member.

Next, the suction operation of the main vacuum plate and the film temporary attachment member is stopped, and these are separated from the film attachment position. At this time, since the most extreme side of the laminate in the supply direction is temporarily attached to the surface of the printed wiring board in the above-mentioned temporary attaching operation, it does not shift from the film attaching position.

Next, a rotating thermocompression roller is brought close to the film attachment position to press the temporarily attached portion of the laminate,
In this state, the thermocompression roller rotates to sequentially thermocompress and laminate the laminate onto the surface of the printed wiring board, and the printed wiring board is transported in the transport direction. By rotating the thermocompression roller and conveying the printed wiring board,
The laminate is automatically fed to the film application position.

Next, while the laminate is being laminated by thermocompression bonding on the surface of the printed wiring board, the rear end of the printed wiring board in the conveying direction is detected, and based on this detection signal, the continuous laminate is moved in the feeding direction. Cut the rear end side. That is, the length of the cut laminate is formed to a dimension corresponding to the length of the printed wiring board in the transport direction. To cut the laminate, the cutting position of the laminate (the rear end side in the feeding direction) is held by suction with a sub-vacuum plate placed in the laminate supply path, and the cutting cutter is moved crosswise to the laminate feeding direction. This is done by moving in the direction of

The cutting cutter is composed of a disc-shaped cutter.

Then, the rear end side of the cut laminate is held by suction with a vacuum bar (a film rear end suction member), and with an appropriate tension applied, the rear end side of the cut laminate is attached to the rear end in the feeding direction of the printed wiring board. be guided. The rear end side of the laminate in the feeding direction is thermocompression laminated onto the rear end surface of the printed wiring board in the conveyance direction using a thermocompression roller.

In this way, the printed wiring board to which the laminate is pasted using the laminator is transported to the next stage of exposure equipment.

This type of film pasting technique in which a part of the laminate is temporarily attached to the printed wiring board and then thermocompression bonded to the printed wiring board 4- is disclosed in, for example, West German Patent DE 3334009 G2, Special Public Service 1986
It is also described in JP-A-49169 and the like.

[Problem to be solved by the invention]

In the above-mentioned pasting process, a step of cutting the rear end side of the laminate in the feeding direction is incorporated into the thermocompression lamination. As described above, a cutting cutter is used to cut the laminate, but when the laminate is cut, chips from the laminate scatter and contaminate the surrounding area. The scattered chips adhere to the surface of the printed wiring board immediately before the thermocompression lamination, the surface of the laminate, etc. For this reason, the portions to which the chips have adhered often become defects, increasing the number of defective printed wiring boards, resulting in a problem of lowering the yield in the bonding process.

An object of the present invention is to provide a technique that can reduce contamination of chips generated when cutting a film in a film pasting technique.

Another object of the present invention is to provide a technique that can improve the yield in the film attachment process.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

In order to solve the above-mentioned problems, the present invention applies a continuous film sequentially from the film application surface at the leading end of the substrate in the transport direction to the film application surface at the rear end thereof, and In a laminator that cuts the continuous film into a size corresponding to the length of the substrate in the transport direction during film adhesion, the rotary cutter that cuts the continuous film is placed near the film cutting position on the continuous film supply path. A cutting holding member for holding the vicinity of the cutting position of the film provided in the cutting holding member, and a cutting holding member provided at a position opposite to each other with the film held by the cutting holding member interposed therebetween, in the vicinity of the cutting position of the continuous film,
The present invention is characterized in that a scrap suction means is provided for sucking scraps of the film generated when the film is cut.

[For production]

According to the above-mentioned means, since the film chips generated during film attachment are removed, the substrate surface,
Contamination of the space between the substrate and the film, the surface of the film, or the device body with chips can be reduced.

Moreover, as a result, the yield in the film attachment process can be improved.

Hereinafter, an embodiment of the present invention applied to a laminator that heat-presses and laminates a laminate film consisting of a photosensitive resin layer and a transparent resin film on a printed wiring board will be described.
This will be specifically explained using drawings.

In addition, in an attempt to explain the embodiments, parts having the same functions are given the same reference numerals, and repeated explanation thereof will be omitted.

[Embodiments of the invention]

FIG. 1 shows an example of a rotary rotary machine in which the present invention is applied to a laminator that heat-presses and laminates a laminate film consisting of a photosensitive resin layer and a transparent resin film on the front and back surfaces of a printed wiring board substrate. FIG. 2 is an explanatory diagram showing the schematic structure of the laminator of this embodiment; FIG. 3 is a front view of FIG. 1; FIGS. 4A and 4B are respectively These are views seen from the arrow L1 direction and L2 direction in FIG. 3, FIG. 4A is a view when the film is running, and FIG. 4B is a view when the film is set for the first time with the rotary blade moved toward you. .

Figure 5 is a view seen from the direction of arrow R in Figure 3, and Figure 6 is
FIG. 7 is an enlarged perspective view showing the detailed configuration of the main vacuum plate (film supply member), tip winding film holding member, and fixed blade portion of the rotary cutter in this embodiment. A diagram for explaining the positional relationship between the fixed blade and the rotary blade, FIG. 8 is a sectional view taken along line A-A in FIG. 1, and FIG. 9 is a diagram showing the substrate conveyance path 1.
FIG. 8 is a cross-sectional view of a portion corresponding to FIG. 8 on the lower side of -1.

As shown in FIG. 2, the laminator of this embodiment has a laminate film 1 having a three-layer structure of a translucent resin film, a photosensitive resin layer, and a translucent resin film, which is continuously wound around a supply roller 2. It's spinning. Laminate film 1 of supply roller 2
is a transparent resin film (protective film) with the film separation member 3.
LA and the laminate film IB each consisting of the photosensitive resin layer and the transparent resin film with the - side (adhesive side) exposed are separated.

The film separating member 3 has an effective length at least as long as the maximum width of the film used, and has a wedge-shaped cross section at its separating end.

Therefore, the separation resistance of the transparent resin film (protective film) LA is reduced, and the fluctuation of the film separation point is reduced, so that the separation of the transparent resin film (protective film) LA and the laminate film IB is reduced. be able to discuss smoothly.

One of the separated transparent resin films IA is configured to be wound up by a winding roller 4. The supply roller 2 and the take-up roller 4 are respectively provided above and below the substrate conveyance path II.

The other laminate film IB of the separated ones
The leading end side in the supply direction is supplied to the main vacuum plate (film supply member) 6 via the tension roller 5, as shown in FIG.

The main vacuum plate 6 is made of a magnetic material such as iron or alumina.

As shown in FIG. 6, the main vacuum plate 6 is provided with a suction groove 6G and a suction hole 6H connected to a vacuum system for suctioning the laminate film IB. Also,
A suction groove and a suction hole are similarly provided at the tip 6D of the main vacuum plate 6.

The main vacuum plate 6, as shown in FIG.
It is configured to approach the film application position and move away from it (move in the vertical direction).

That is, as shown in FIG. 6, the main vacuum plate 6 is slidably attached to a guide rail 7 attached to the main vacuum plate support plate 8. The main vacuum plate support plate 8 is attached to a mounting frame 6 attached to the main body of the device (laminator housing).
01 so as to be movable up and down via a rack gear and pinion gear 10.

The pinion gear 10 is meshed with a rack gear 602 provided on a vertically movable shaft 603 connected to the drive motor 11. This rack gear 602 has a presser roller 6 whose rotation axis is a shaft 604A attached to the mounting frame 601.
04 so that it can be moved up and down.

Further, the main vacuum plate support plate 8 includes:
A film holding member for winding the tip (a holding member for the cut portion) 12 is slidably provided on the front and rear guide rails 605.

As shown in FIG. 6, the tip winding film holding member 12 is provided with a suction groove 12G and a suction hole 12H connected to a vacuum system for suctioning the laminate film IB. Fixed blade 15A of the rotary cutter in the film holding member 12 for tip winding
No suction groove is provided in the side tip side region 12R, and the suction hole 12
Only H is provided. Thereby, the laminate film IB can be reliably held by the tip wrapping film holding member 12.

Here, when a suction groove is provided in the region 12R, the laminate film IB is cut with a rotary cutter, and the vicinity of the leading edge of the continuous film supplied from the film supply roller side is held by the leading edge wrapping film holding member 12. At this time, the vicinity of the leading edge of the film curls due to the suction groove, and the leading edge of the film tends to protrude outward, reducing the reliability of holding the laminate film IB by the leading edge wrapping film holding member 12.

The tip wrapping film holding member 12 is provided with a connecting notch member 606, and the connecting rod 13 is fitted into this connecting notch member 606.

This connecting rod 13 is attached to a fixed blade support member 14, as shown in FIGS. 1 and 6. Further, the fixed blade support member 14 supports a fixed blade 15.15A2.

The fixed blade support member 14 is a fixed blade support member sliding member 101.
is attached to. Fixed blade support member sliding member 101
is slidably attached to the rotary cutter support member 102. Then, the fixed blade support member sliding member 10
1 is moved back and forth by air cylinders 103A and 103B. Said air cylinder 1
A position adjustment member 104 for the fixed blade 15 is provided at a predetermined position on the piston support 03A. Further, a rotary blade support member sliding member 105 is slidably attached to the rotary cutter support member 102 and can be manually moved back and forth.

A rotary cutter angle adjuster (air cylinder) 106 is provided at one end of the rotary cutter support member 102 and is fixed to a mounting frame 100 of the apparatus main body. Further, near the rotary cutter angle adjuster (air cylinder) 106 of the rotary cutter support member 102, a rotary cutter horizontal or inclined position angle determining member 107 fixed to the mounting frame 100 of the main body of the apparatus is provided.
is provided. 107A is a rotary cutter angle adjustment pin for adjusting the angle of the rotary cutter to a horizontal or inclined position.

Further, a rotary blade support member 16 is attached to the rotary blade support member sliding member 105. Rotary blade support member 1
6 is rotatably provided with a rotary blade '17. The rotary blade 17 has a cutting edge 17A provided obliquely at a predetermined inclination angle. Furthermore, brake rings 17B of the fixed blade 15 are provided at both ends of the rotary blade 17.

As shown in FIG. 3, a servo motor 108 for rotating the rotary blade 17 by a predetermined angle is provided at one end of the rotary blade support member 16, and a gear 108A is mounted on the rotation axis of the servo motor 108. A gear 108B is attached to the rotating shaft of the rotary blade 17 of the rotary cutter.
It meshes with the. At both ends of the rotary blade support member 16, locking knobs 109 are provided for positioning the rotary cutter when the rotary cutter is in use and when it is not in use.

This positioning locking knob 109 serves to position and lock each rotary blade support member sliding member 105 when the rotary cutter is in use or not in use. Therefore, when using the rotary cutter, such as when passing the film between the fixed blade 15 and the rotary blade 17 for the first time, the positioning locking knob 109 must be manually pulled out and the rotary blade support member slide removed. By moving the movable member 105 forward, it is possible to widen the space between it and the fixed blade 15 of the rotary cutter. In addition, the rotary blade support member sliding member 105 can be positioned and locked by pushing the positioning locking knob 109 into the fitting hole on the side with the gap wide open. There is.

Additionally, air blowing pipes 19 and 2 are provided at the top and bottom of the rotary blade support member 16, respectively, for blowing air toward the film.
0 is set. That is, air blowing pipe 19.20
On the side facing the laminate film IB, a large number of air blowing holes are bored at a pitch of about 20 mm along the longitudinal direction of each of the air blowing tubes 19 and 20.

The air blowing pipes 19, 20, as shown in FIG.
Air cylinder 106A for rotary cutter angle adjustment
and 106B in the direction of the arrow to remove the laminate film I.
The rotary blade is supported so that when the fixed blade 17 of the rotary cutter is set at a predetermined inclination angle with respect to the supply direction of laminate film IB, the air blowing pipes 19 and 20 are located perpendicular to the supply direction of laminate film IB. It is fixed to a mounting member on member 16. Thereby, air can be uniformly blown onto the laminate film IB in the width direction of the film.

Further, the rotary cutter support member 102 is provided with a stopper 110 for positioning the rotary blade support member sliding member 105 when the rotary blade 17 is used. A positioning screw 111 that is stopped by a positioning stopper 110 is provided.

FIG. 7 shows the positional relationship between the fixed blade 15 and the rotary blade 17 of the rotary cutter. The fixed blade 15 is always biased by a spring (not shown) so that the blade edge 15A faces toward the substrate transport path.

In addition, as shown in FIGS. 1, 3, and 8, scraps of the film IB generated when the laminate film IB is cut are sucked into the vicinity of the cutting position of the continuous laminate film IB. A chip box 201 for collecting chips is provided. A suction slit 201A is provided on the side surface of the chip box 201 on the cutting position side of the laminate film IB. In addition, at a predetermined position of the chip box 201,
A suction duct 202 is connected which is connected to a suction device (not shown). The suction slit width is, for example, 5 to 6 mm. A filter (for example, synthetic fiber) for capturing chips of the laminate film IB is disposed in the suction duct 202.

The chip box 201 is supported by a support stand 203 fixed to the rotary blade support member 16.

Further, FIG. 9 shows the structure of the chip box 201 in the rotary cutter section below the substrate transport path 1-1.

In FIG. 2, 21 is a thermocompression roller, 22 is a printed wiring board substrate, 23A is a driving roller, 23B is a driven roller, 24 is a substrate holding member, and 25 is a vacuum bar. The substrate holding member 24 is a substrate holding roller 2.
4A and an air cylinder 24B for the substrate holding roller that moves it up and down.

When it is detected by a board tip position detection sensor (not shown) provided near the board transport path that the printed wiring board board 22 has been transported to the position where the film is temporarily attached to the printed wiring board board 22. , the rotation of the driving roller 23A is stopped by the detection signal. At the same time, the substrate holding roller 24A also stops. Printed wiring board substrate 22
Immediately after the tip of the board passes directly under the presser roller 24A, a detection signal activates the substrate presser roller air cylinder 24B which moves the substrate presser roller 24A so that the substrate presser member 24 presses the substrate.

This board holding roller 24A reliably stops the movement of the printed wiring board board 22, and even if the tip 6D of the main vacuum plate 6 comes into contact with the printed wiring board board 22, the printed wiring board board 22 will not move. , temporary attachment of the laminate film IB is reliably performed. The printed wiring board substrate 22 is held down by the substrate holding roller 24A until the thermocompression bonding roller 21 comes into contact with the printed wiring board substrate 22. The air cylinder 24B is released.

Next, the cutting operation of the laminate film IB in the film (thin film) sticking device of this embodiment will be briefly explained.

First, manually unlock the locking knob 109 for positioning when using the rotary blade of the rotary cutter shown in FIG. The space between the blade 17 and the blade 17 is widened.

Next, the leading end side of the laminate film 19 1B separated by the film separating member 3 by hand in the feeding direction is placed in front of the main vacuum plate 6, the leading end winding film holding member 12, and the fixed blade 15. , the film is held by suction on the main vacuum plate 6 and the film holding member 12 for winding the tip.

At this time, the laminate film IB is arranged so that the leading end of the laminate film IB is slightly protruded from the position of the film holding member 12 for winding the film toward the substrate transport path.

Note that when the width of the laminate film IB is narrower than the length of the suction groove 6G in the main vacuum plate 6 and also narrower than the length of the suction groove 12G in the film holding member 12 for tip wrapping, the laminate film IB is When the plate 6 and the film holding member 12 for winding the tip are suctioned (adsorbed) and held, a portion of the suction grooves 6G and 12G are exposed in the side edge region of the laminate film IB, and outside air flows from the exposed portion. It flows into the suction grooves 6G and 12G, and the suction force decreases. In order to prevent such a decrease in the suction force, it is preferable to cover and seal the suction grooves 6G and 12G exposed in the side end Q- area of the laminate film IB with adhesive tape.

Further, when the main vacuum plate 6 and the tip wrapping film holding member 12 are formed of a magnetic material such as iron, the exposed suction grooves 6G and 12G may be covered and sealed with magnetic tape.

Also, as in the case of suction grooves 6G and 12G, if the width of the laminate film IB is narrow and the suction holes are exposed,
It is advisable to cover and seal the exposed suction hole with adhesive tape or magnetic tape.

Next, the rotary blade support member 1610 is set to the position when the rotary blade is used, and the positioning locking knob 109 is locked.

Next, as shown in FIG.
6A and 106B in the direction of the arrow to cut the fixed blade 15 of the rotary cutter in the feeding direction of the laminate film IB.
and the rotary blade 17 is set at a right angle.

Next, in preparation for the first film pasting, operate the tip film cutting switch (not shown) of the laminate film IB to activate the rotary cutter, and move the tip wrapping film holding member from position 2. Also, cut off the leading end of the laminate film IB that slightly protrudes toward the substrate transport path. As a result, the leading end side of the laminate film IB is cut at right angles to the film supply direction. Next, as shown in FIG. 11, the rotary cutter angle adjusting air cylinders 106A and 106B are operated in the direction of the arrow to set the fixed blade 15 and rotary blade 17 of the rotary cutter in a predetermined position relative to the feeding direction of the laminate film IB. Set the angle of inclination to .

At this time, air is uniformly blown in the film width direction of the laminate film IB by the air blowing tubes 19 and 20.

Next, the continuous film cutting operation switch after the first time is operated to perform continuous film cutting. In this way, the laminated film IB is cut by rotating the rotary blade 17 and cutting the fixed blade 1.
By instantaneously sandwiching the laminate film IB with the laminate film IB, the laminate film IB can be cut reliably and quickly.

Furthermore, in positioning and cutting the tip of the laminate film IB before the start-up (preparation for first film attachment),
The rotary blade support member 16 can be easily pulled out to the front via the locking knob 109 for positioning when the rotary blade of the rotary cutter is used, and after being pulled out, it is only necessary to push it back. That is, the use position of the rotary blade 17 is easily set by the stopper 1102 positioning adjustment screw 111 and the locking knob 109 for positioning when the rotary blade of the rotary cutter is used.

Next, we will explain the automatic pasting process (thermocompression bonding lamination) using the above-mentioned film pasting device in Figures 12 to 2.
An embodiment of the film application method of the present invention will be described using FIG. 1 (a schematic diagram showing the main parts of each application step).

First, the leading edge of the continuous laminate film IB must be trimmed manually, so as shown in FIG. By pulling the rotary blade support member 16 forward, a large space is secured for the passage portion of the laminate film IB, and the laminate film IB is passed through.

Next, after the laminate film IB has passed, the rotary blade support member 16 is pushed into the position where the laminate film IB is cut, as shown in FIG.
05 is securely locked with a positioning locking knob 109. When the rotary blade 17 is set, the first film cutting operation switch is operated to operate the rotary cutter to cut the unnecessary portion of the laminate film IB and finish trimming the leading edge. At this time, the leading end side of the continuous laminate film IB is cut at right angles to the film supply direction. At this time, the fixed blade support member 14 and the rotary blade support member 16 of the rotary cutter remain in the horizontal position.

This state is shown in FIG.

The leading end side of the 4-laminate film IB in the supply direction, which has been trimmed manually by the aforementioned manual operation, is held by suction by the leading end winding film holding member 12, as shown in FIG. Rotary cutter fixed blade 1
It is placed on the front of 5.

When automatic film application is selected and the application starts, the fixed blade support member 14 and rotary blade support member 16 of the rotary cutter are moved perpendicularly to the film supply direction by the rotary cutter angle adjusting air cylinders 106A and 106B. tilted in the direction.

Next, the board transport mechanism detects that the printed wiring board substrate 22, which has been transported through the board transport path 1-1 by the driving roller 23A and the driven roller 23B, has arrived at a predetermined position on the board transport path. When detected by the substrate tip position detection sensor provided in the device, the fixed blade forward and backward movement air cylinders 103A and 103B (not shown in FIG. 1) shown in FIG.
2 and the fixed blade 15 in the diagonal direction (
The leading end side of the laminate film IB in the supply direction is moved to a position away from the supply path of the laminate film 1B, and is held by suction on the leading end portion 6D of the main vacuum plate 6. At this time, compressed air is blown in the direction of the arrow A from the air blowing pipes 19 and 20 to make it easier to adsorb and hold the main vacuum plate 6 at the tip 6D and to prevent wrinkles from forming on the laminate film IB.

Note that when the film pasting operation is automatically and continuously performed on each substrate 22 that is conveyed one after another, the leading end side of the laminate film IB cut by the rotary cutter in the feeding direction is on the main vacuum plate 6. It is held by suction on the tip portion 6D.

Next, the board transport mechanism stops the leading end in the transport direction of the printed wiring board substrate 22, which has been transported along the board transport path 1-1 by the driving roller 15A and the driven roller 23B, at the film application position.

This stop is performed by detecting the leading end of the printed wiring board substrate 22 in the conveying direction with a sensor provided in the substrate conveying device, and based on this detection signal, driving roller 23A of the substrate conveying mechanism.
This is done by stopping the .

Next, as shown in FIG. 17, the main vacuum plate is moved (in the direction of arrow C) toward the front end surface (film attachment surface) in the conveyance direction of the printed wiring board substrate 22 stopped at the film attachment position. 6 and its tip 6D are brought close to each other,
The leading end side of the laminate IB in the supply direction is supplied to the film application position.

Next, as shown in FIG. 17, the main vacuum plate is moved (in the direction of arrow C) toward the front end surface (film attachment surface) in the conveyance direction of the printed wiring board substrate 22 stopped at the film attachment position. 6 and its tip 6D are brought close to each other,
The leading end side of the laminate IB in the supply direction is supplied to the film application position.

Next, as shown in FIG. 18, the main vacuum plate 6 holding the laminate film IB by suction and its tip 6D are moved to the film attachment position, and the tip 6D is moved to the film attachment position.
is pressed against the film adhesion surface of the leading end of the printed wiring board substrate 22 in the conveyance direction to press the supply end of the laminate film IB to the board 22.

27 28 Next, as shown in FIG. 19, the adsorption and holding of the laminate film IB is released, and the main vacuum plate 6 and its tip 6D are separated from the film attachment position. When the separation of the main vacuum plate 6 reaches the position shown in FIG. 20, as shown in FIG. The main vacuum plate 6 and the tip wrapping film holding member 12 are further moved away from the printed wiring board substrate 22 by moving in a direction away from I-I. However, the fixed blade support member 14 remains in the same position.

The farthest position is the position shown in FIG. 20. When the separation operation of the main vacuum plate 6 is completed, the fixed blade support member 14 and the leading end winding film holding member 12 are made to approach the laminate film IB from the rear. Based on this operation, the thermocompression roller 21 starts moving from the retracted position to the film sticking position, that is, starts moving in the direction of the arrow.

Next, when the thermocompression roller 21 moves to the film sticking position, it comes into contact with the most extreme side of the laminate film IB in the supply direction with an appropriate pressing force. Then, by rotating the thermocompression roller 21 and restarting the rotation of the drive roller 23A of the substrate transport mechanism, the printed wiring board substrate 22 is conveyed in the direction of arrow E, and the pressure bonding of the laminate film IB to the substrate 22 is started. do.

Further, as shown in FIG. 20, while automatically supplying the laminate film IB by the rotation of the thermocompression roller 21, printing is performed from the front end to the back end of the printed wiring board substrate 22 in the conveyance direction. The laminate film IB is pasted by a predetermined distance on the film pasting surface of the wiring board substrate 22.

While the printed wiring board substrate 22 is being moved in the board conveyance direction while being attached to the printed wiring board substrate 22 by the thermocompression roller 21, the laminate film IB is removed from the supply roller 2 by the moving operation. drawn out.

When a sensor installed in the conveyance path detects that the rear end of the laminate film IB has reached a predetermined position on the substrate conveyance device, (a) the main vacuum plate 6 and the tip winding The film holding member 12 starts moving in the direction of the substrate transport path 1-I by the motor movement, reaches the same speed as the speed at which the laminate film IB is applied, and holds the laminate film IB by suction. At that point, the rotary blade 17 of the rotary cutter starts rotating from the initial position toward the traveling path side of the laminate film IB. Main vacuum plate 6
The tip wrapping film holding member 12 approaches the fixed blade support member 14 while adsorbing and holding the laminate film IB, and the distance between the tip wrapping film holding member 12 and the fixed blade support member 14 is at a predetermined pole. Cutting of the laminate film IB ends when the sandwiching interval is reached.

The film length from the position of the cutting edge of the fixed blade 15 to the boundary point between the main body portion of the film supply member 6 and the film leading end winding region at the time when the cutting of the laminate film IB is completed is equal to the length of the film leading end winding region. is set to match the length.

In addition, the length of the laminate film IB from the film pressing point of the thermocompression roller 21 to the rear end of the laminate film IB cut off by the rotary cutter is the length of the film-attached surface on the surface of the printed wiring board substrate 22. is set to be substantially equal to the length of .

The rear end side of the continuous laminate film IB shown in FIG. 21 in the feeding direction corresponds to the length of the printed wiring board substrate 22 in the feeding direction.

After the cutting operation, the main vacuum plate 6 and the tip winding film holding member 12 remain stationary while adsorbing and holding the laminate film IB.

Next, the rear end side of the cut laminate film IB in the feeding direction is attached to the film sticking surface of the printed wiring board substrate 22 at the rear end in the conveying direction using the thermocompression roller 21. In other words, the leading end side of the laminate film IB in the feeding direction is
Rotation of thermocompression roller 21 and printed wiring board substrate 22
, the printed wiring board substrate 22 is successively bonded and bonded by thermocompression from the front end to the rear end in the transport direction.

The rear end side 1 32 of the cut laminate film IB in the feeding direction receives air jet from the air blowing pipe 20 in the direction below the arrow shown in FIG. Since it passes through the surface of the printed wiring board 22 with friction, it applies appropriate tension to the laminate film IB before being thermocompression bonded, and prevents the laminate film IB thermocompression bonded to the printed wiring board 22 from generating wrinkles.

Next, the cut rear end side of the laminate film IB in the supply direction is thermocompression bonded to the film attachment surface of the rear end portion of the printed wiring board substrate 22 in the conveyance direction, and the thermocompression lamination is completed. Immediately before the end of thermocompression bonding, when the remaining length of the laminate film IB on the rear end side in the supply direction becomes short, the vacuum parser 25 heats it so as to approach the printed wiring board substrate 22. The pressure roller 21 is rotated around it, and the suction operation is performed until just before the thermocompression lamination is completed, thereby applying appropriate tension to the laminate film IB and preventing the occurrence of wrinkles and the like. The printed wiring board substrate 22 on which the thermocompression bonding process has been completed is conveyed to the next exposure apparatus by the substrate conveyance mechanism.

After that, the vacuum par 25 moves to the substrate transport path 1-I.
The thermocompression bonding roller 21 is rotated in a reverse direction in a direction away from the thermocompression bonding roller 21 to return to the original position. The thermocompression roller 21 also moves to the side in the conveyance direction of the printed wiring board substrate 22, and the upper and lower thermocompression rollers 21 are opened in the direction away from the substrate conveyance path 1-I.

Evacuate from the film application position.

As can be seen from the above description, according to this embodiment, the film scraps generated during film attachment are removed, so that the substrate surface and the space between the substrate and the film are
Contamination of the surface of the film or the main body of the device with chips can be reduced.

Moreover, as a result, the yield in the film attachment process can be improved.

Further, the leading end side of the first laminate film IB is cut at right angles to the supply direction, and the leading end of the laminate film IB is placed on the leading end 6D of the main vacuum plate (film supplying member) 6 to be adsorbed. The main vacuum plate 6 is brought close to the film sticking surface side of the leading end in the transport direction of the printed wiring board substrate 22 transported to the pasting position, and the leading end of the laminate film IB is supplied, and the laminate film is The tip 6D of the IB is attached to the film attachment position, the adsorption of the main vacuum plate 6 is released, the main vacuum plate 6 is separated from the film attachment surface side of the printed wiring board substrate 22, and the main vacuum plate 6 is bonded by thermocompression. While supplying the laminate film IB with the roller 21, the laminate film IB is sequentially pressed onto the printed wiring board substrate 22 from the tip thereof, and the feeding speed of the printed wiring board substrate 22 and the moving speed of the main vacuum plate 6 are adjusted. While synchronously sucking the laminate film IB,
The rear end side of the laminate film IB in the feeding direction is made to correspond to the length of the printed wiring board substrate 22 in the conveying direction, and the laminate film IB is cut at right angles to the film feeding direction with a rotary cutter without sagging. The rear end side of the cut laminate film IB in the supply direction is attached to the rear end of the printed wiring board substrate 22 in the transport direction by the thermocompression roller 21, so that the supplied laminate film A wide laminate film IB can be quickly cut perpendicular to the film supply direction and the cut film can be pasted without causing the IB to sag.

Further, since the first cutting of the leading end side of the laminate film IB is performed with a rotary cutter orthogonal to the film supply direction with the laminate film IB stationary,
The leading end side of the laminate film IB can be cut at right angles to the supply direction.

Further, since cutting of the rear end side of the laminate film IB in the feeding direction is performed using a rotary cutter obliquely set at a predetermined angle with respect to the film feeding direction depending on the film feeding speed and the rotation speed of the rotary cutter, the laminate film IB is body film I
The rear end side of the supply direction of B is connected to the printed wiring board substrate 22.
The supplied laminate film IB can be cut at an angle of 35 6 perpendicular to the film supply direction without sagging according to the length in the transport direction.

Further, the rotary blade 17 of the rotary cutter is supported by the rotary blade support member 16, and is attached to a rotary blade support member sliding member 105 that is movable back and forth from the front toward the laminate film IB.
Both ends of the rotary cutter are rotatably provided, and the fixed blade 15 is provided near the tip wrapping film holding member 12, so that when preparing to cut the laminate film IB for the first time, the fixed blade 15 of the rotary cutter Since the space between the fixed blade 15 and the rotary blade 17 can be opened, it is possible to easily pass the supplied laminate film IB between the fixed blade 15 and the rotary blade 17.

In addition, the laminate film IB supplied with the rotary cutter
Since the continuous laminate film IB
can be cut quickly and reliably, and can prevent impact to surrounding members of the cutter.

Although the present invention has been specifically described above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof.

〔Effect of the invention〕

As explained above, according to the present invention, the film scraps generated during film attachment are removed, so that the film chips are removed from the surface of the substrate, between the substrate and the film, the surface of the film, or the main body of the device. Contamination with chips can be reduced.

Moreover, as a result, the yield in the film attachment process can be improved.

[Brief explanation of drawings]

FIG. 1 shows the rotary cutter section of an embodiment in which the present invention is applied to a laminator that heat-presses and laminates a laminate film consisting of a photosensitive resin layer and a transparent resin film on the front and back surfaces of a printed wiring board substrate. FIG. 2 is an explanatory diagram showing the schematic structure of the laminator of this embodiment; FIG. 3 is a front view of FIG. 1; FIGS. 4A and 4B are the same as FIG. FIG. 4A is a view when the film is running, and FIG. 4B is a view when the rotary blade is moved to the front and the film is set for the first time. Figure 5 is a view seen from the direction of arrow R in Figure 3, and Figure 6 is
FIG. 7 is an enlarged perspective view showing the detailed configuration of the main vacuum plate (film supply member), tip winding film holding member, and fixed blade portion of the rotary cutter in this embodiment. A diagram for explaining the positional relationship between the fixed blade and the rotary blade, FIG. 8 is a sectional view taken along line A-A in FIG. 1, and FIG. 9 is a diagram showing the substrate conveyance path 1.
- A cross-sectional view of the lower part of 1 corresponding to FIG. 8; FIG. 10 is a diagram for explaining means for setting the fixed blade and rotary blade of the rotary cutter at right angles to the film supply direction; FIG. 11 is a diagram for explaining means for setting the fixed blade and rotary blade of the rotary cutter at a predetermined inclination angle with respect to the film supply direction. It is a figure for explaining the pasting operation of an example. In the figure, IB ・Laminated film, 6 ・Main vacuum plate, 12 ・Film holding member for winding the tip, 2
DESCRIPTION OF SYMBOLS 1...Thermocompression bonding roller, 15...Fixed blade of rotary cutter, 17.Rotary blade of rotary cutter, 22.Substrate for printed wiring board, 201...Chip box, 20
2 - Suction duct.

Claims (1)

[Claims] (1) A continuous film is sequentially pasted from the front end side in the feeding direction from the film pasting surface at the leading end in the conveying direction of the substrate to the film pasting surface at the rear end, and while pasting this film, the continuous film is In a laminator that cuts the continuous film into a size corresponding to the length of the substrate in the transport direction, a rotary cutter that cuts the continuous film is installed at a film cutting position provided near the film cutting position on the continuous film supply path. A cutting holding member that holds the cutting holding member and a film held by the cutting holding member are provided at positions facing each other, and the film generated when the film is cut is placed in the vicinity of the cutting position of the continuous film. A laminator characterized by being provided with a chip suction means for suctioning the cut shoulder of the laminator.