JPH0328764U - - Google Patents
Info
- Publication number
- JPH0328764U JPH0328764U JP1989088611U JP8861189U JPH0328764U JP H0328764 U JPH0328764 U JP H0328764U JP 1989088611 U JP1989088611 U JP 1989088611U JP 8861189 U JP8861189 U JP 8861189U JP H0328764 U JPH0328764 U JP H0328764U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting element
- reflective surface
- light emitting
- lead portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989088611U JPH0755008Y2 (ja) | 1989-07-28 | 1989-07-28 | 発光ダイオード |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989088611U JPH0755008Y2 (ja) | 1989-07-28 | 1989-07-28 | 発光ダイオード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0328764U true JPH0328764U (un) | 1991-03-22 |
| JPH0755008Y2 JPH0755008Y2 (ja) | 1995-12-18 |
Family
ID=31638213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989088611U Expired - Lifetime JPH0755008Y2 (ja) | 1989-07-28 | 1989-07-28 | 発光ダイオード |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0755008Y2 (un) |
-
1989
- 1989-07-28 JP JP1989088611U patent/JPH0755008Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0755008Y2 (ja) | 1995-12-18 |