JPH0328742U - - Google Patents
Info
- Publication number
- JPH0328742U JPH0328742U JP1989089708U JP8970889U JPH0328742U JP H0328742 U JPH0328742 U JP H0328742U JP 1989089708 U JP1989089708 U JP 1989089708U JP 8970889 U JP8970889 U JP 8970889U JP H0328742 U JPH0328742 U JP H0328742U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit element
- resin
- resin frame
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089708U JPH0328742U (US20070167544A1-20070719-C00007.png) | 1989-07-28 | 1989-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089708U JPH0328742U (US20070167544A1-20070719-C00007.png) | 1989-07-28 | 1989-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328742U true JPH0328742U (US20070167544A1-20070719-C00007.png) | 1991-03-22 |
Family
ID=31639277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989089708U Pending JPH0328742U (US20070167544A1-20070719-C00007.png) | 1989-07-28 | 1989-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328742U (US20070167544A1-20070719-C00007.png) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0580230U (ja) * | 1992-04-07 | 1993-11-02 | セイレイ工業株式会社 | 脱穀装置 |
| JP2011044628A (ja) * | 2009-08-24 | 2011-03-03 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
| WO2011024820A1 (ja) * | 2009-08-24 | 2011-03-03 | 本田技研工業株式会社 | 電子装置、および、電子装置の製造方法 |
| JP2011159692A (ja) * | 2010-01-29 | 2011-08-18 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
| JPWO2014006699A1 (ja) * | 2012-07-04 | 2016-06-02 | 富士機械製造株式会社 | 半導体パッケージ及びその製造方法 |
-
1989
- 1989-07-28 JP JP1989089708U patent/JPH0328742U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0580230U (ja) * | 1992-04-07 | 1993-11-02 | セイレイ工業株式会社 | 脱穀装置 |
| JP2011044628A (ja) * | 2009-08-24 | 2011-03-03 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
| WO2011024820A1 (ja) * | 2009-08-24 | 2011-03-03 | 本田技研工業株式会社 | 電子装置、および、電子装置の製造方法 |
| CN102484102A (zh) * | 2009-08-24 | 2012-05-30 | 本田技研工业株式会社 | 电子器件以及电子器件的制造方法 |
| US8497166B2 (en) | 2009-08-24 | 2013-07-30 | Honda Motor Co., Ltd. | Electronic device and method of manufacturing electronic device |
| JP2011159692A (ja) * | 2010-01-29 | 2011-08-18 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
| JPWO2014006699A1 (ja) * | 2012-07-04 | 2016-06-02 | 富士機械製造株式会社 | 半導体パッケージ及びその製造方法 |
