JPH03284322A - Waste gas treatment apparatus - Google Patents
Waste gas treatment apparatusInfo
- Publication number
- JPH03284322A JPH03284322A JP2082761A JP8276190A JPH03284322A JP H03284322 A JPH03284322 A JP H03284322A JP 2082761 A JP2082761 A JP 2082761A JP 8276190 A JP8276190 A JP 8276190A JP H03284322 A JPH03284322 A JP H03284322A
- Authority
- JP
- Japan
- Prior art keywords
- waste gas
- gas treatment
- load cell
- controller
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002912 waste gas Substances 0.000 title claims abstract description 41
- 238000001312 dry etching Methods 0.000 claims abstract description 12
- 238000001179 sorption measurement Methods 0.000 claims abstract description 7
- 239000004065 semiconductor Substances 0.000 claims abstract description 4
- 239000007789 gas Substances 0.000 claims description 11
- 239000003463 adsorbent Substances 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 12
- 238000005530 etching Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 2
- 229910015844 BCl3 Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
Landscapes
- Treating Waste Gases (AREA)
- Separation Of Gases By Adsorption (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野」
本発明は、半導体ウェーハの処理に用いられるドライエ
ツチング装置から発生する廃ガスの処理装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for treating waste gas generated from a dry etching apparatus used for processing semiconductor wafers.
［従来の技術］
半導体装置の製造工程の一環であるドライエツチング処
理工程では、反応性ガスとして三塩化ホウ素ＩＢｃｌ−
１、四塩化炭素ｆｃｃＬ）、塩素（Ｃβ２）などを使用
し、グロー放電プラズマ中でウェーハをエツチング処理
する。従来、これらの反応性ガスを使用するドライエツ
チング装置の廃ガス処理には、第４図に示す構成の廃ガ
ス処理装置が使用されている。[Prior Art] In the dry etching process that is part of the manufacturing process of semiconductor devices, boron trichloride IBcl- is used as a reactive gas.
1. Etching the wafer in glow discharge plasma using carbon tetrachloride (fccL), chlorine (Cβ2), etc. Conventionally, a waste gas treatment apparatus having the configuration shown in FIG. 4 has been used to treat the waste gas of a dry etching apparatus that uses these reactive gases.
図に示すように、ドライエツチング装置は、エツチング
チャンバ１内で、上部電極２と下部電極３との間にＲＦ
電源４から電圧を印加してプラズマ放電をおこさせる。As shown in the figure, the dry etching apparatus includes an RF etching device between an upper electrode 2 and a lower electrode 3 in an etching chamber 1.
A voltage is applied from the power source 4 to cause plasma discharge.
このとき生ずるエツチングチャンバ１内の反応性ガスは
、メカニカルブースタ５とロータリポンプ６とで排気し
、廃ガス処理装置２０で処理される。廃ガス処理装Ｎ２
０は、中に吸着剤１３を有する廃ガス処理筒７と、吸着
剤１３に吸着されずに排出される反応性ガスの検出（以
下破過検出という）を行なうインジケータ１４とから構
成されていた。The reactive gas generated in the etching chamber 1 at this time is exhausted by a mechanical booster 5 and a rotary pump 6, and then treated by an exhaust gas treatment device 20. Waste gas treatment equipment N2
0 was composed of a waste gas treatment cylinder 7 having an adsorbent 13 therein, and an indicator 14 for detecting reactive gas discharged without being adsorbed by the adsorbent 13 (hereinafter referred to as breakthrough detection). .
また、破過検出のためには廃ガス処理筒７上部における
温度変化を温度センサ１８を用いて検出し表示計８で表
示し、さらに回転表示灯９で表示することも行なわれて
いた。Furthermore, in order to detect a breakthrough, a temperature change in the upper part of the waste gas treatment tube 7 was detected using a temperature sensor 18 and displayed on an indicator 8, and further displayed on a rotating indicator light 9.
Ｌ発明が解決しようとする課題１
上述した従来の廃ガス処理装置は、破過検出をインジケ
ータ１４で行なう場合は、その色相変化を目視チエツク
によって行なっていた。インジケータ１４の色相変化は
不鮮明で破過発見が遅れるという欠点があった。Problem 1 to be Solved by the Invention In the conventional waste gas treatment apparatus described above, when a breakthrough is detected using the indicator 14, the hue change is visually checked. There was a drawback that the hue change of the indicator 14 was unclear and breakthrough detection was delayed.
破過検出部分の吸着熱又は反応熱を温度センサ１８によ
り検出するものでは、使用する反応性ガスの流量等の変
動によっては、検出温度にばらつきが発生し、正確な破
過検出ができなかった。また、廃ガス処理筒７は下の方
から順次吸着して行くので、この吸着帯（アクティブに
動作し吸着作用を行なうゾーン）が温度検出部分を通り
過ぎた場合は、吸着熱等による検出は不可能となり、破
過状態のままエツチングガスが排出されるという欠点が
あった。In the case where the temperature sensor 18 detects the heat of adsorption or reaction heat in the breakthrough detection part, the detected temperature varies depending on the flow rate of the reactive gas used, and accurate breakthrough detection cannot be performed. . In addition, since the waste gas treatment cylinder 7 adsorbs sequentially from the bottom, if this adsorption zone (zone that actively operates and performs adsorption action) passes the temperature detection part, detection due to adsorption heat etc. will not be possible. However, there was a drawback that the etching gas was discharged in the breakthrough state.
未反応のエツチングガス、特にＢｃｌ ｇが排気ダクト
に吸引されると、他の排気ダクトより吸引された酸、有
機溶剤及び大気等と一緒に排気処理される時に、特に大
気中に含まれる水分とＢＣｌ３が反応して、多量の粉状
のホウ酸が発生する。このため、メインの排気ダクトの
詰まり及び工場の廃ガス洗浄塔の詰まりを起こす原因と
なる。この詰まり防止のため定期的に交換又は洗浄を行
なうので設備の停止による稼働率の低下、廃ガス処理の
経費等種々の欠点があった。When unreacted etching gas, especially Bclg, is sucked into the exhaust duct, when it is exhausted together with acids, organic solvents, air, etc. sucked in from other exhaust ducts, it is mixed with the moisture contained in the air. BCl3 reacts to generate a large amount of powdered boric acid. This causes clogging of the main exhaust duct and clogging of the waste gas cleaning tower in the factory. In order to prevent this clogging, replacement or cleaning is performed periodically, which has various disadvantages such as a reduction in operating rate due to equipment stoppage and the expense of waste gas treatment.
本発明の目的は、破過検出を正確に行ないつるようにし
て、上記欠点を除去した廃ガス処理装置を提供すること
にある。SUMMARY OF THE INVENTION An object of the present invention is to provide a waste gas treatment apparatus that eliminates the above-mentioned drawbacks by accurately performing breakthrough detection.
［課題を解決するための手段］
本発明の廃ガス処理装置は、廃ガス処理筒の底部に接し
てその重量を検知するロードセルと、このロードセルか
らの信号を受け、検知した重量が一定の設定値を超えた
ときに警報手段を作動させるコントローラとを有するも
のである。[Means for Solving the Problems] The waste gas treatment device of the present invention includes a load cell that comes into contact with the bottom of the waste gas treatment cylinder to detect its weight, and a setting that receives a signal from the load cell so that the detected weight is constant. and a controller that activates an alarm means when the value is exceeded.
廃ガス処理筒に入れである吸着剤の分量は特定している
から、許容ガス吸着量を一定に定めておくことができる
。そしてこのガス吸着量に相応する重量増加を検出する
ことで破過検出が確実にできる。したがって、コントロ
ーラは警報手段を作動させるので、正しく吸着剤の交換
等を行なうことができる。Since the amount of adsorbent to be placed in the waste gas treatment cylinder is specified, the allowable amount of gas adsorption can be set constant. By detecting the weight increase corresponding to the amount of gas adsorbed, breakthrough detection can be ensured. Therefore, since the controller activates the alarm means, it is possible to correctly replace the adsorbent.
【実施例Ｊ
以下本発明の第１実施例を図面を用いて説明する。第１
図はドライエツチング装置に実施例装置を組込んだ図、
第２図は実施例装置の概略図を示している。[Embodiment J] A first embodiment of the present invention will be described below with reference to the drawings. 1st
The figure shows the example device incorporated into a dry etching device.
FIG. 2 shows a schematic diagram of the embodiment device.
第１図に示すドライエツチング装置は前述したようにＲ
Ｆ電源４と、上部及び下部電極２゜３を有するエツチン
グチェンバ１と、メカニカルブースタ５およびロータリ
ポンプ６とから構成されている。そして廃ガス処理装置
２０は、このドライエツチング装置のロータリポンプ６
に接続されている。The dry etching apparatus shown in FIG.
It consists of an F power source 4, an etching chamber 1 having upper and lower electrodes 2.3, a mechanical booster 5, and a rotary pump 6. The waste gas treatment device 20 includes a rotary pump 6 of this dry etching device.
It is connected to the.
廃ガス処理装置２０は、廃ガス処理筒７と、コントロー
ラ８と、回転表示灯９と、廃ガス処理筒７の重量を検知
するためのロードセルＩ２と、前記廃ガス処理筒７をロ
ードセル１２にセットするための位置調整部１０とから
構成されている。The waste gas treatment device 20 includes a waste gas treatment tube 7 , a controller 8 , a rotating indicator light 9 , a load cell I2 for detecting the weight of the waste gas treatment tube 7 , and a load cell 12 that connects the waste gas treatment tube 7 to the load cell 12 . It is composed of a position adjustment section 10 for setting.
ロータリポンプ６に接続したのち廃ガス処理装置２０は
、位置調整部１０の固定ナツト１０Ｂをゆるめ、廃ガス
処理筒７の底部がロードセル１２に十分のるように、ア
ジャストボルト１０Ａを調整する。そして、廃ガス処理
筒７の破過検出重量をコントローラ８にあらかじめセッ
トしておくことにより、廃ガス処理筒７の重量がセット
された重量になるとコントローラ８からの出力信号によ
り回転表示灯９が点灯する。これにより破過検出が自動
的に行なわれる。After connecting to the rotary pump 6, the waste gas treatment device 20 loosens the fixing nut 10B of the position adjustment unit 10, and adjusts the adjustment bolt 10A so that the bottom of the waste gas treatment cylinder 7 is sufficiently placed on the load cell 12. By setting the breakthrough detection weight of the waste gas treatment tube 7 in the controller 8 in advance, when the weight of the waste gas treatment tube 7 reaches the set weight, the rotation indicator light 9 is activated by an output signal from the controller 8. Light. As a result, breakthrough detection is automatically performed.
次に、第２実施例につき説明する。第３図がその概略図
であって、廃ガス処理筒７の入口側の配管部に圧力計１
５と、コントローラ８の任意の設定電圧で動作するバイ
パスバルブ１６と、バイパス配管１７とから構成される
装置この実施例では、破過検出ができると同時に、リー
ク等による廃ガス処理筒７内部の詰まりを圧力計１５に
て検知でき、コントローラ８の任意の設定圧にてバイパ
スバルブＩ６が動作し、バイパス配管１７より廃ガスを
一時的に逃がす構造となっているので、異常圧によるロ
ータリポンプの故障や、配管シール部よりの廃ガスの漏
れ等を防止できるなど、より安全な構成となっている。Next, a second embodiment will be explained. FIG. 3 is a schematic diagram of the system, in which a pressure gauge is installed on the piping section on the inlet side of the waste gas treatment cylinder 7.
5, a bypass valve 16 that operates at an arbitrary set voltage of the controller 8, and a bypass pipe 17. In this embodiment, it is possible to detect a breakthrough, and at the same time, it is possible to detect the inside of the waste gas treatment cylinder 7 due to leakage, etc. The blockage can be detected by the pressure gauge 15, and the bypass valve I6 operates at an arbitrary set pressure of the controller 8, and the structure is such that the waste gas is temporarily released from the bypass piping 17. It has a safer configuration that prevents malfunctions and leaks of waste gas from piping seals.
〔発明の効果１
以上説明したように、本発明によればドライエツチング
処理時に排出された廃ガスを吸着剤にて吸着処理し、か
つ自動的に破過検出が行なわれるため廃ガス処理筒の交
換時期が容易に判断できる。このため排気ダクトの詰ま
りゃそれに伴なう排気能力の低下等の危険性も防止でき
、又排気処理に対する経費も大幅に節約することができ
る。[Effect of the invention 1 As explained above, according to the present invention, the waste gas discharged during dry etching treatment is adsorbed with an adsorbent, and breakthrough detection is automatically performed, so that the waste gas treatment cylinder is You can easily determine when to replace it. Therefore, it is possible to prevent the risk of a reduction in exhaust capacity due to clogging of the exhaust duct, and it is also possible to significantly save costs for exhaust treatment.
第１図はドライエツチング装置に本発明の第１実施例を
組込んだ図、第２図は第１実施例装置の概略図、第３図
は本発明の第２実施例装置の概略図、第４図は従来のド
ライエツチング装置用済ガス処理装置のブロック図であ
る。
ｌ・・−エツチングチェンバ、
５・・・メカニカルブースタ、
６・・−ロータリポンプ、 ７−・−廃ガス処理筒、
８・・・コントローラ、 ９・・・回転表示灯、ｌ
Ｏ・−・位置調整部、 １２−・・ロードセル、２
０・・−廃ガス処理装置。FIG. 1 is a diagram of a dry etching device incorporating the first embodiment of the present invention, FIG. 2 is a schematic diagram of the first embodiment of the device, and FIG. 3 is a schematic diagram of the second embodiment of the device of the present invention. FIG. 4 is a block diagram of a conventional dry etching apparatus used for processing waste gas. l...-etching chamber, 5...-mechanical booster, 6...-rotary pump, 7--waste gas processing cylinder,
8...Controller, 9...Rotation indicator light, l
O.--Position adjustment section, 12-.Load cell, 2
0...-Waste gas treatment equipment.
Claims (1)
廃ガスを導き、吸着剤で吸着処理する廃ガス処理装置に
おいて、廃ガス処理筒の底部に接してその重量を検知す
るロードセルと、このロードセルからの信号を受け、検
知した重量値が一定の設定値を超えたときに警報手段を
作動させるコントローラとを有することを特徴とする廃
ガス処理装置。In waste gas processing equipment that guides waste gas generated from dry etching equipment for semiconductor wafers and processes it by adsorption with an adsorbent, there is a load cell that touches the bottom of the waste gas processing cylinder to detect its weight, and a load cell that receives signals from the load cell. An exhaust gas treatment device comprising: a controller that activates an alarm means when a detected weight value exceeds a certain set value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2082761A JPH03284322A (en) | 1990-03-29 | 1990-03-29 | Waste gas treatment apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2082761A JPH03284322A (en) | 1990-03-29 | 1990-03-29 | Waste gas treatment apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03284322A true JPH03284322A (en) | 1991-12-16 |
Family
ID=13783429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2082761A Pending JPH03284322A (en) | 1990-03-29 | 1990-03-29 | Waste gas treatment apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03284322A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0639534A2 (en) * | 1993-08-16 | 1995-02-22 | Ebara Corporation | Waste treatment system in a polishing apparatus |
-
1990
- 1990-03-29 JP JP2082761A patent/JPH03284322A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0639534A2 (en) * | 1993-08-16 | 1995-02-22 | Ebara Corporation | Waste treatment system in a polishing apparatus |
| EP0639534A3 (en) * | 1993-08-16 | 1995-05-10 | Ebara Corp | Waste treatment system in a polishing apparatus. |
| EP0928777A1 (en) * | 1993-08-16 | 1999-07-14 | Ebara Corporation | Waste treatment system in a polishing apparatus |
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