JPH03281170A - Dressing method for grinding stone for cutting - Google Patents
Dressing method for grinding stone for cuttingInfo
- Publication number
- JPH03281170A JPH03281170A JP7710790A JP7710790A JPH03281170A JP H03281170 A JPH03281170 A JP H03281170A JP 7710790 A JP7710790 A JP 7710790A JP 7710790 A JP7710790 A JP 7710790A JP H03281170 A JPH03281170 A JP H03281170A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- dressing
- ceramic plate
- cut
- ceramics sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000004575 stone Substances 0.000 title abstract description 4
- 239000000919 ceramic Substances 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000002173 cutting fluid Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
セラミックス板の切断に関し、より詳しくは、セラミッ
クス板切断用の砥石(カッティングホイール)のドレッ
シング方法に関し、
セラミックス板の切断を行う際に、切断用砥石のドレッ
シングを効率的に行う方法を提供することを目的とし
ベース板に接着したセラミックス板を切断する(1)
回転砥石をドレッシングする方法において、切断ライン
上にてセラミックス板近くでドレス材をベース板に固定
配置し、セラミックス板の切断工程で該ドレス材をも切
断するように構成する。[Detailed Description of the Invention] [Summary] Regarding cutting a ceramic plate, more specifically, regarding a dressing method for a cutting wheel for cutting a ceramic plate, the present invention relates to a method for dressing a cutting wheel when cutting a ceramic plate. Cutting a ceramic plate bonded to a base plate with the aim of providing an efficient method (1) In the method of dressing a rotary grindstone, the dressing material is fixed to the base plate near the ceramic plate on the cutting line. However, the dressing material is also cut in the process of cutting the ceramic plate.
本発明は、セラミックス板の切断に関し、より詳しくは
、セラミックス板切断用の砥石(カッティングホイール
)のドレッシング方法に関する。TECHNICAL FIELD The present invention relates to cutting ceramic plates, and more particularly to a method for dressing a grindstone (cutting wheel) for cutting ceramic plates.
セラミック板は各種用途に、例えば、集積回路の基板に
採用されており、焼成後に所定寸法に切断される。Ceramic plates are used for various purposes, for example, as substrates for integrated circuits, and are cut into predetermined dimensions after firing.
セラミックスは硬脆材料であり、ダイヤモンド砥石(ホ
イール)によって切削液をかけながら切断される(例え
ば、最新切断技術総覧編集委員会編:[最新切断技術総
覧、6章セラミックスの切断法」、■産業技術サービス
センター、昭和60年、630〜636頁参照)。Ceramics are hard and brittle materials, and are cut using a diamond grindstone (wheel) while applying cutting fluid (for example, edited by the Latest Cutting Technology Overview Editorial Committee: [Latest Cutting Technology Overview, Chapter 6 Ceramics Cutting Methods'', ■Industry) (See Technical Service Center, 1985, pp. 630-636).
(2)
セラミックス板を切断する際には、板裏面の切断箇所に
欠け(チッピング)が発生し易い。このような欠けを防
止するために、セラミックス板をベース板(例えば、ガ
ラス板)に接着剤(例えば、蝋を主成分としたイエロー
ワックス〔日化精工■の商品名〕)で接着しておいて、
セラミックス板の切断と同時にその下のベース板の一部
を切削するようにしている。(2) When cutting a ceramic plate, chipping is likely to occur at the cut location on the back of the plate. In order to prevent such chipping, the ceramic plate is bonded to the base plate (e.g. glass plate) with an adhesive (e.g. yellow wax [trade name of Nikka Seiko ■] whose main ingredient is wax). There,
At the same time as cutting the ceramic plate, a part of the base plate underneath it is cut.
ベース板の切削を伴うセラミックス板の切断を行うと、
切断時間が長くなるにつれて切断用(ダイヤモンド)砥
石に接着剤に起因した目つまりが発生する。そのために
、定期的にドレス材を切断することによって、目つまり
の原因となるものを除去して、(ダイヤモンド)砥石の
砥粒(刃)の再生(ドレッシング)を行わなければなら
ない。When cutting a ceramic plate that involves cutting the base plate,
As the cutting time increases, the cutting (diamond) grindstone becomes clogged due to the adhesive. To this end, it is necessary to periodically cut the dressing material to remove anything that causes clogging, and to regenerate (dress) the abrasive grains (blade) of the (diamond) grindstone.
なお、このような場合のドレス材は、アルミナ焼結晶(
例えば、WA220の焼結体)や炭化珪素(GC)焼結
晶である。In addition, the dressing material in such cases is alumina sintered crystal (
For example, it is a sintered body of WA220) or a sintered crystal of silicon carbide (GC).
(3)
本発明の目的は、セラミックス板の切断を行う際に、切
断用砥石のドレッシングを効率的に行う方法を提供する
ことである。(3) An object of the present invention is to provide a method for efficiently dressing a cutting wheel when cutting a ceramic plate.
上述の目的が、ベース板に接着したセラミックス板を切
断する回転砥石をドレッシングする方法において、切断
ライン上にて前記セラミックス板近くでドレス材を前記
ベース板に固定配置し、前記セラミックス板の切断工程
で該ドレス材をも切断することを特徴とする切断用砥石
のドレッシング方法によって達成される。The above-mentioned object is a method of dressing a rotary grindstone for cutting a ceramic plate bonded to a base plate, in which a dressing material is fixedly arranged on the base plate near the ceramic plate on the cutting line, and the cutting process of the ceramic plate is performed. This is achieved by a method for dressing a cutting wheel, which is characterized in that the dressing material is also cut with a cutting wheel.
ドレス材はセラミックス板の切断開始直前の位置または
直後の位置に配置され、これら両方の位置に配置されて
も良い。The dressing material is placed at a position immediately before or after the start of cutting the ceramic plate, or may be placed at both of these positions.
〔作用]
ドレス材を切断ライン上でセラミックス板に隣接して配
置しであるので、セラミックス板を切断する直前(また
は、直後ないし両方)に切断用紙(4)
石は一回の切断作業工程のなかでドレス材切断によるド
レッシングが施される。[Function] Since the dressing material is placed adjacent to the ceramic board on the cutting line, the cutting paper (4) is cut immediately before (or immediately after or both) the ceramic board is cut. Dressing is performed by cutting the dressing material.
以下、添付図面を参照して、本発明の実施態様例によっ
て本発明の詳細な説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail by way of embodiments with reference to the accompanying drawings.
先ず、所定寸法に切断するセラミックス板(例えば、半
導体素子搭載用の多層回路基板)■、該セラミックス板
よりも大きいガラスのベース板2、接着剤(イエローワ
ックス)3およびドレス材(アルミナ焼結角棒)4を用
意する。第1図に示すように、ベース板2の上にドレス
材4を枠状に別の接着剤で固定して配置する。この接着
剤には瞬間接着剤を用い、切断ラインの箇所には接着剤
が存在しないようにする。ドレス材を接着剤で固定する
場合、ドレッシング効果を確保するため、切断ラインを
避けて適用することが肝要である。First, a ceramic plate (for example, a multilayer circuit board for mounting semiconductor elements) to be cut to a predetermined size, a glass base plate 2 larger than the ceramic plate, an adhesive (yellow wax) 3, and a dressing material (alumina sintered angle) are prepared. Prepare bar) 4. As shown in FIG. 1, a dress material 4 is placed on the base plate 2 in a frame shape and fixed with another adhesive. An instant adhesive is used for this adhesive, and no adhesive is present at the cutting line. When fixing the dressing material with adhesive, it is important to avoid the cutting line and apply it to ensure the dressing effect.
次に、液状にした接着剤3をベース板2上に垂らして広
げ、流動状態にあるうちにセラミックス板lを載せて押
し付ける。この状態で放置すれば、(5)
接着剤3は冷却されて固化し、セラミックス板1をベー
ス板2に接着する。Next, the liquefied adhesive 3 is spread on the base plate 2, and while it is in a fluid state, the ceramic plate 1 is placed and pressed. If left in this state, (5) the adhesive 3 will be cooled and solidified, and the ceramic plate 1 will be bonded to the base plate 2.
次に、第2図に示すように、ダイヤモンド砥粒層5を有
する砥石(ダイヤモンドホイール)6を回転させた状態
で所定の切断ラインに沿って移動させる(矢印A方向)
。砥石6はドレス材4を切断し、続いてセラミックス板
1を切断し、もう−度ドレス材4を切断し、これら一連
の切断を一回の切断工程で行う。この時、ベース板2の
一部を同時に切削している。また、切断中は切削液(図
示せず)を注いでいる。この場合には、2回置石6をド
レッシングしている。さらに、ドレス材4を枠状に配置
しているので、接着剤2を垂らした時に余計の広がりを
防止できる。Next, as shown in FIG. 2, a grindstone (diamond wheel) 6 having a diamond abrasive layer 5 is rotated and moved along a predetermined cutting line (in the direction of arrow A).
. The grindstone 6 cuts the dressing material 4, then the ceramic plate 1, and cuts the dressing material 4 again, performing a series of these cuts in one cutting process. At this time, a part of the base plate 2 is being cut at the same time. Additionally, cutting fluid (not shown) is poured during cutting. In this case, the stone 6 is dressed twice. Furthermore, since the dressing material 4 is arranged in a frame shape, it is possible to prevent the adhesive 2 from spreading unnecessarily when dripping.
上述の実施例では、ドレス材(角棒)を枠状に配置した
が、ひとつ(1本)のドレス材を切断ライン上に接着配
置しただけでもよい。In the above-mentioned embodiment, the dressing material (square rod) is arranged in a frame shape, but it is also possible to just arrange one (one) dressing material on the cutting line with adhesive.
上述したように、本発明によれば、切断用砥石(6)
のドレッシングがセラミックス板の切断毎に簡単かつ容
易に出来て、切断精度および切断効率をも向上させるこ
とができる。As described above, according to the present invention, dressing of the cutting whetstone (6) can be done simply and easily every time a ceramic plate is cut, and cutting accuracy and cutting efficiency can also be improved.
第1図は、セラミックス板およびドレス材の配置を示す
斜視図であり、
第2図は、砥石で切断している状態を示す斜視図である
。
■・・・セラミックス板 2・・・ベース板3・・・接
着剤 4・・・ドレス材6・・・砥石
(7)FIG. 1 is a perspective view showing the arrangement of the ceramic plate and the dressing material, and FIG. 2 is a perspective view showing the state in which the ceramic plate is cut with a grindstone. ■...Ceramics board 2...Base plate 3...Adhesive 4...Dress material 6...Whetstone (7)
Claims (1)
砥石をドレッシングする方法において、切断ライン上に
て前記セラミックス板(1)近くでドレス材(4)を前
記ベース板(2)に固定配置し、前記セラミックス板(
1)の切断工程で該ドレス材(4)をも切断することを
特徴とする切断用砥石のドレッシング方法。1. In a method of dressing a rotary grindstone for cutting a ceramic plate bonded to a base plate, a dressing material (4) is fixedly arranged on the base plate (2) near the ceramic plate (1) on the cutting line; The ceramic plate (
A method for dressing a cutting whetstone, characterized in that the dressing material (4) is also cut in the cutting step of 1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7710790A JPH03281170A (en) | 1990-03-28 | 1990-03-28 | Dressing method for grinding stone for cutting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7710790A JPH03281170A (en) | 1990-03-28 | 1990-03-28 | Dressing method for grinding stone for cutting |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03281170A true JPH03281170A (en) | 1991-12-11 |
Family
ID=13624560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7710790A Pending JPH03281170A (en) | 1990-03-28 | 1990-03-28 | Dressing method for grinding stone for cutting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03281170A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5680702A (en) * | 1994-09-19 | 1997-10-28 | Fuji Xerox Co., Ltd. | Method for manufacturing ink jet heads |
JP2014024135A (en) * | 2012-07-25 | 2014-02-06 | Disco Abrasive Syst Ltd | Dressing board and cutting method |
JP2017205810A (en) * | 2016-05-16 | 2017-11-24 | 株式会社ディスコ | Cutting device |
CN113102998A (en) * | 2020-01-09 | 2021-07-13 | 株式会社迪思科 | Method for processing workpiece |
-
1990
- 1990-03-28 JP JP7710790A patent/JPH03281170A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5680702A (en) * | 1994-09-19 | 1997-10-28 | Fuji Xerox Co., Ltd. | Method for manufacturing ink jet heads |
JP2014024135A (en) * | 2012-07-25 | 2014-02-06 | Disco Abrasive Syst Ltd | Dressing board and cutting method |
JP2017205810A (en) * | 2016-05-16 | 2017-11-24 | 株式会社ディスコ | Cutting device |
CN113102998A (en) * | 2020-01-09 | 2021-07-13 | 株式会社迪思科 | Method for processing workpiece |
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