JPH03280059A - Alkaline development type photosensitive resin composition - Google Patents

Abstract

PURPOSE:To obtain a film which has a good adhesive property to an epoxy resin, high flexibility and excellent solder heat resistance, electroless gold plating resistance, acid resistance and water resistance, etc., by incorporating a specific polymer or oligomer, specific copolymer, and a specific compd. into the above compsn. CONSTITUTION:The ratio of a component B to 100prts.wt. of a component A is 5 to 100prts.wt. and the ratio of the component C is 5 to 100prts.wt. The ratio of a component D is 0.1 to 30prts.wt. The component A has a carboxyl group and vinyl group in the same molecule and is the polymer or ologomer soluble in an aq. alkaline soln. the component B is a polymer which is expressed by formula I and has a carboxyl group at the terminal. The component C is a compd. having at least one carboxyl group. The component D is a optical polymn. initiator or sensitizer. The protective mask having the excellent acid resistance, alkaline resistance, solvent resistance, solder heat resistance, electrical insulating characteristic, mechanical strength, surface hardness, etc., is obtd. when the film consisting of such compsn. is formed on a printed circuit board and is subjected to alkaline development after exposing.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to an alkali-developable photosensitive resin composition, and more specifically, to forming a film made of the alkali-developable photosensitive resin composition on a printed wiring board. This relates to an alkali-developable photosensitive resin composition that can be subjected to alkali development after exposure, and that the exposure-cured portion can be suitably used as a solder resist and an electroless shrinkage resist, as well as a permanent protective mask.

(Conventional technology) In recent years, as ICs and LSIs have become more highly integrated.

The printed wiring boards on which these devices are mounted are becoming increasingly dense, with narrower wiring spacing and surface mounting methods in which LSI components such as flat plastic packages (FPP) are mounted on the surface of the board.

By the way, when forming a solder resist on a printed wiring board, a thermosetting resist ink is printed by a screen printing method, and the transferred portion is thermoset. However, the reality is that this method cannot meet the demands for higher density, so a method of obtaining solder resist using the principles of photography has been developed, and along with this, the development of photoresist ink is being considered. has been done.

Regarding photoresist inks, from the viewpoint of working environment and processing cost, in place of the type that is developed with an organic solvent, one that can be developed with a weak alkaline aqueous solution such as a sodium carbonate aqueous solution has been proposed.

For example, JP-A No. 61-243.869 and JP-A No. 63-278.052 contain a resin component having a novolac type or bisphenol A type epoxy resin skeleton and can be developed with a slightly weak alkali aqueous solution. A photosensitive coating composition has been disclosed that provides a protective mask with excellent heat resistance, chemical resistance, etc.

Also, JP-A-62-158.710, JP-A-62-158.710,
No. 285゜903 and JP-A No. 63-11.930 disclose an alkali-developable type resin in which the base polymer is a copolymer of maleic anhydride and styrene with the open addition of hydroxyalkylene (meth)acrylate. Compositions are disclosed.

(Problem to be solved by the invention) However, using these photosensitive resin compositions.

When a solder resist is formed using a photographic method, it does not have sufficient soldering heat resistance, electroless gold plating resistance, acid resistance, or even alkali resistance, and the performance is satisfactory for use as a permanent protective mask for printed wiring boards. The problem was that it was not possible to obtain

Therefore, one object of the present invention is to provide an alkali-developable photosensitive resin composition free from such problems. That is, (1) it has good sensitivity to light and is easily photocured with a short exposure time; (2) It can be easily developed with a weak alkaline aqueous solution such as IJium carbonate. ■It hardens not only by light but also by heat. ■Good adhesion to epoxy resin after being cured by light and heat.

An object of the present invention is to provide an alkali-developable photosensitive resin composition that forms a film that is highly flexible and has excellent solder heat resistance, electroless gold plating resistance, acid resistance, water resistance, etc.

(Means for Solving the Problems) In order to solve the above problems, the present inventors have conducted intensive studies and found that a dilute alkali having a carboxyl group and a vinyl group in the same molecule is used as an active ingredient of one composition. It was discovered that the above object can be achieved by containing a polymer or oligomer that is soluble in an aqueous solution, a copolymer of butadiene and acrylonitrile having a terminal carboxyl group, and a compound having at least one epoxy group. Reached.

That is, the gist of the present invention is as follows.

Consisting of the following components (A), (B), (C) and (D),
The ratio of component (B) to 100 parts by weight of component (A) is 5 to 100 parts by weight, and the ratio of component (C) is 5 to 10 parts by weight.
0 parts by weight, and the proportion of component (D) is 0.1 to 30 parts by weight.

Component (A): A polymer or oligomer that has a carboxyl group and a vinyl group in the same molecule and is soluble in an alkaline aqueous solution.

(B) Component 2 A polymer represented by the following general formula [I'l and having a carboxyl group at the end (in the formula, x, y and 2 are integers of 10 to 200) (C) Component: Epoxy resin compound.

Component (D): photopolymerization initiator or sensitizer.

Below, the alkali-developable photosensitive resin composition of the present invention will be explained in detail.

Examples of polymers or oligomers that have a carboxyl group and a vinyl group in the same molecule as component (A) and are soluble in aqueous alkaline solutions include: (1) carboxyl group-containing epoxy acrylate obtained by adding an acid anhydride to the hydroxyl group of epoxy acrylate; , ■ a ring-opening addition of 2-hydroxyalkylene (meth)acrylate to a copolymer of maleic anhydride and an unsaturated hydrocarbon, ■ a part of a (meth)acrylate copolymer containing a carboxyl group. .

Examples include those substituted with a monomer having a vinyl group.

Specific examples of (1) include phenol novolac type epoxy resin, cresol novolac type epoxy resin, and bisphenol A type epoxy resin.

Bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin.

Examples include those obtained by reacting an acid anhydride with an epoxy (meth)acrylate obtained by adding (meth)acrylic acid to an epoxy resin such as an alicyclic epoxy resin.

As a specific example of (2), hydroxyalkylene (meth)acrylate represented by the following general formula [II] is added to a copolymer of maleic anhydride and an aromatic hydrocarbon having a vinyl group represented by styrene. The following can be mentioned.

[:H,=[nee C-0-(CH2), DH[■] (wherein, R represents a hydrogen atom or a methyl group, and n is 1 to 3
represents an integer. ) Furthermore, as a specific example of ■, it contains a carboxyl group such as acrylic acid or methacrylic acid (meth).
Examples include those obtained by reacting glycidyl methacrylate with a portion of the carboxyl groups of a polymer obtained by addition polymerization (including copolymerization) of acrylic monomers.

In addition, the following general formula [■] HOOC[
(CH,-C)I=CH-CH2), (Ct12-
CH) y]yoC0OHCN °[: I] (In the formula, x, y and 2 are integers from 10 to 200, and various values can be obtained depending on the purpose.) and has a carboxyl group at the end. Examples of polymers include 9, for example, IIYcARCT polymer (Good
-rich).

The compound having at least one epoxy group, which is the component (C), is blended for the purpose of heat curing the resin composition. , bisphenol S
Epoxy resins such as type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, 0-talesol novolac type epoxy resin, p-talesol novolac type epoxy resin, alicyclic epoxy resin,
Phenyl glycidyl ether, p-1-f-phenyl glycidyl ether, p-butylphenyl glycidyl ether, cresyl glycidyl ether, diglycidyl isocyanurate, triglycidyl isocyanurate, 3.3°, 5.5'-tetramethylbiphenyl -4,
Examples include compounds having an epoxy group such as 4°-diglycidyl ether, allyl glycidyl ether, and glycidyl methacrylate.

Component (D) is a photopolymerization initiator or sensitizer, such as acetophenone, 2,2-jethoxyacetophenone, p-dimethylacetophenone.

a7tophenones such as p-dimethylaminopropiophenone, dichloroacetophenone, trichloroacetophenone, ptert-butyltrichloroacetophenone;
Benzophenone, 2-chlorobenzophenone, p, p“
-Dichlorobenzophenone.

p, p”-bisdimethylaminobenzophenone (also referred to as Michler's ketone), p, p'-bisdiethylaminobenzophenone, benzophenones such as 3.3', 4.4°-tetra(tert-butylperoxycarbonyl)benzophenone, benzyl , benzoin, benzoin methyl ether, benzoin ethyl ether,
Benzoin isopropyl ether.

Benzoin ethers such as benzoin isobutyl ether and benzoin-n-butyl ether, benzyl dimethyl ketal, tetramethylthiuram monosulfide, tetramethylthiuram disulfide, thioxanthone,
Sulfur compounds such as 2-chlorothioxanthone, 2,4-diethylthioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, octamethylanthraquinone, l, Anthraquinones such as 2-benzanthraquinone and 2,3-diphenylanthraquinone, azobisisobutyronitrile.

Organic peroxides such as benzoyl peroxide, di-tart-butyl peroxide, and cumene peroxide.

2.4.5-) IJ arylimidazole dimer.

Riboflavin tetrabutyrate, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2
- Thiol compounds such as mercaptobenzothiazole, 2
．． Examples include organic halogen compounds such as 4,6-tris(trichloromethyl)-s-triazine, 2,2,2-tribromoethanol, and tribromomethylphenylsulfone.

These compounds can also be used in combination of one or more. It is also possible to add compounds that do not act as photopolymerization initiators by themselves, but can increase the ability of the photopolymerization initiators when used in combination with the above compounds. Such compounds include, for example, tertiary amines such as triethanolamine, which are effective when used in combination with benzophenone.

The resin composition of the present invention comprises component (A), component (B), as described above.
) component, (C) component, and (D) component, and the blending ratio of each component is 100 parts by weight of component (A), 5 to 100 parts by weight of component (B), and component (C). is 5-1
00 parts by weight, and component (D) is 0.1 to 30 parts by weight.

If the amount of component (B) is less than 5 parts by weight based on 100 parts by weight of component (A), the cured product will lack flexibility and, when used as a solder resist, will lack alkali resistance and electroless gold plating resistance, which is not preferable. On the other hand, if it exceeds 100 parts by weight, the photopolymerization rate slows down, resulting in decreased sensitivity and poor alkali developability after exposure. If the amount of component (C) is less than 5 parts by weight based on 100 parts by weight of component (A), curing of the resin composition by heating will decrease and the soldering heat resistance will be lacking, which is undesirable. If it exceeds 100 parts by weight, sensitivity may decrease. , the alkali developability after exposure decreases. (A>If the ratio of component (D) to 100 parts by weight of component is less than 0.1 part by weight, sufficient crosslinking cannot be achieved by light irradiation,
If it exceeds 0 parts by weight, it is difficult for light to reach the substrate, resulting in poor adhesion between the substrate and the resin, which is not preferable.

The alkali-developable photosensitive resin composition of the present invention is.

It can be suitably used as a solder resist for printed wiring boards as described below. For example, the photosensitive resin composition of the present invention may be dissolved in a solvent and applied to the surface of a printed wiring board, or a dry film made of the alkali-developable photosensitive resin composition of the present invention may be pasted on the surface of the printed wiring board. First, a film is formed by a method such as

A negative film was placed on the film thus obtained, and the exposed areas were cured by irradiation with actinic rays.

The unexposed areas are eluted using an alkaline aqueous solution and developed to form a solder resist. Also.

Further heating of the photo-curing part will progress the curing process and improve the properties.

Examples of solvents suitable for dissolving the alkali-developable photosensitive resin composition of the present invention include methyl ethyl ketone,
Examples include ketones such as methyl isobutyl ketone, and cellosolves such as methyl cellosolve, ethyl cellosolve, butyl cellosolve, and cellosolve acetate.

Methods for applying a solution containing the alkali-developable photosensitive resin composition of the present invention to a printed wiring board include a solution dipping method, a spray method, and a method using a roller coater or spinner coater. Yes, either method can be used. After coating to a thickness of, for example, 20 to 30 μm using these methods, a film is formed on the printed wiring board by removing the solvent.

Furthermore, a dry film can be prepared by applying a solution of the alkali-developable photosensitive resin composition of the present invention onto a flexible support such as a polyethylene terephthalate film and drying it. Note that the dry film may be covered with a polyethylene film or the like for protection.

Examples of light suitable for curing the alkali-developable photosensitive resin composition of the present invention include light emitted from lamps such as ultra-high pressure mercury lamps, high-pressure mercury lamps, and metal halide lamps.

Examples of developing solutions suitable for alkali development after exposure include aqueous solutions of alkali metal or alkaline earth metal carbonates, aqueous solutions of alkali metal hydroxides, and the like. Among these, a weakly alkaline aqueous solution containing 1 to 3% by weight of a carbonate such as sodium carbonate, potassium carbonate, or lithium carbonate can be used to precisely develop fine images.

Alkaline development is carried out at 10 to 50°C, preferably 20 to 40°C.
It can be carried out using a commercially available developer or ultrasonic cleaner at a temperature of .degree.

After alkaline development, heat treatment is applied to improve the corrosion resistance of the N-light cured area, which significantly improves durability against strong alkaline water, adhesion to metals such as copper, heat resistance durability 9 surface hardness, etc., and improves printed wiring. Various properties required for a plate protective mask are further improved.

The heat treatment conditions are preferably 8() to 200°C for 10 minutes to 2 hours.

In the alkali-developable photosensitive resin composition of the present invention.

In addition to components (A), (B), (C), and (D), photopolymerizable monomers and olicomers, epoxy group curing accelerators, bithermal polymerization inhibitors, fillers, dyes, pigments, plasticizers, and leveling agents , additives such as adhesion improvers, antifoaming agents, flame retardants, and organic solvents.

What are the types and amounts of such compounding agents and additives?

It can be appropriately selected within a range that does not impair the properties of the photosensitive resin composition of the present invention.

Photopolymerizable polymers and oligomers include 1, for example, 2
- Monomers having hydroxyl groups such as hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-ethylhexyl (meth)acrylate,
Ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, tetramethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane diacrylate, pentaerythritol diacrylate,
Acrylic acid esters such as pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, glycerol acrylate, and ethylene glycol dimethacrylate.

Diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, trimethylolethane trimethacrylate, pentaerythritol dimethacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol tetramethacrylate, di Esters of unsaturated carboxylic acids such as methacrylic esters such as pentaerythritol hexamethacrylate and glycerol methacrylate and aliphatic polyol compounds, diisocyanates and at least one
Examples include urethane acrylate compounds obtained by reaction with a monohydric alcohol having 1 acrylate group or methacrylate group. Moreover, these compounds can also be used in combination of 1 or more types.

These compounds act as viscosity modifiers or photocrosslinking agents.

Epoxy group curing accelerators include amine compounds, imidazole compounds, carboxylic acids, phenols, quaternary
Examples include class ammonium salts and methylol group-containing compounds. When a film obtained by using a small amount of these together is heated after heating, properties such as heat resistance, solvent resistance, acid resistance, plating resistance, adhesion, electrical properties, and hardness are improved. Therefore, it is particularly suitable for use as a solder resist, an electroless gold plating resist, and a permanent protective mask.

Thermal polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, and pyrogallol.

Examples include tert-butylcatechol and phenothiazine.

Fillers include white alumina, clay, talc, finely powdered silica, barium sulfate, and barium carbonate.

Examples include magnesium oxide and titanium oxide.

Phthalocyanine green is used as a dye and pigment.

Examples include Phthalocyanine Blue, Phthalocyanine Yellow, Benzidine Yellow, Permanent Red R, and Brilliant Carmine 6B.

Examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, tricresyl, and the like.

Silicone-based antifoaming and leveling agents.

Examples include fluorine-based and acrylic-based compounds.

Examples of flame retardants include aluminum hydroxide.

Examples include inorganic flame retardants such as zinc borate, and organic flame retardants such as halogen-containing phosphates such as tris-(β-chloroethyl)-phosphate and pentachlorophenol methacrylate.

(Examples) The present invention will be specifically described below using nine examples. In addition, in the following, "parts" indicate "parts by weight."

Examples 1-6. Comparative examples 1 to 4 (A) component, (B) component, (C) component, (D) component.

Fillers, dyes and pigments, thermosetting agents, polymerization inhibitors, and organic solvents were blended as described below and kneaded using a three-roll mill for testing to prepare resist inks. Next, these resist inks are applied onto the copper-clad laminate that has been degreased and cleaned, and after drying, a negative film is attached, and! ! After exposure, develop.

Heat treatment was performed. At this time, as will be detailed later, drying properties of the coating film, photosensitivity, developability with respect to alkaline solutions, coating film hardness, and adhesion between the coating film and the substrate are determined.

The solder heat resistance, electroless gold plating resistance of the coating film, chemical resistance, and insulation resistance were evaluated. The results are shown in Table 1.

The drying properties of the coating film were tested using resist ink applied to a thickness of 17 to 25 μm on a copper-clad laminate with a thickness of 1.6 mm. A coating film obtained by drying at 70° C. for 30 minutes was tested.

In addition, the adhesion with the substrate, soldering heat resistance, electroless gold plating resistance, chemical resistance, solvent resistance, and insulation resistance were determined after exposure and development as described above.

After heating at 145° C. for 50 minutes and completely curing, the coating film as a solder resist was tested.

[Resist ink composition ratio]

■Examples 1 to 3. Blend ratio of Comparative Examples 1 and 2 (^) Carboxyl group-containing epoxy acrylate obtained by adding succinic anhydride to the hydroxyl group of bisphenol A type epoxy acrylate (see Table 1) (B) HYCARCTBN 1
300x31 (manufactured by Goodrich) (see Table 1) (C) Triglycidyl isocyanurate 10 1 (
D) Benzophenone 4.5 parts Diethylaminobenzophenone 0.5 parts Other ingredients Dipentaerythritol hexaacrylate 5 parts Barium sulfate 15 parts Phthalocyanine green 0.5N dicyandiamide 1.0 parts Hydroquinone 1,000 parts Methyl ether 0.05 parts Cellosolve acetate)
23.45 parts■ Examples 4-6. Blending ratio of Comparative Examples 3 to 4 (A) Alternating copolymer of styrene and maleic anhydride (AR [manufactured by '0 Chemical Co., Ltd., SMA Resin 1000]
Carboxyl group-containing polymer obtained by adding hydroxyethyl acrylate to (see Table 1) (B) HYCARC TBN 1300X 8 (
(manufactured by Goodrich) (see Table 1) (C) 3.3°, 5.5'-tetramethylbiphenyl-4,4°-diglycidyl ether 10 parts (D) Benzophenone 4.5 parts Diethylthioxanthone 0 .5 parts Other ingredients Pentaerythritol triacrylate 5 parts Barium sulfate 15 parts Fine powder silica 3 parts Phthalocyanine green 0.5R dicyandiamide
1.5 parts hydroquinone
0.1 part carpitol acetate 21
．． 4 parts [Evaluation method] (1) Drying property of coating film Tested according to JIS K-5400. The evaluation ranks are as follows.

○: No tack observed at all △: Slight tack observed X: Significant tack observed (2) Exposure sensitivity Kodak Step Tablet Nα2 (manufactured by Eastman Kodak Company, optical density step 0.15. A negative film with 21 steps) was adhered to the paint film, and an IKW ultra-high pressure mercury lamp [■
Wavelength 365 using new oak manufactured HMW-6-N]
Ultraviolet light around nm for 100 seconds at an illuminance of 5 mw/cm2 (
The sample was irradiated with light of 500 mJ/cm" and processed in the same manner as the developability test for a weak alkaline aqueous solution described in (3) below.

The number of step tablets remaining on the copper foil was investigated.

In this evaluation method, the higher the sensitivity, the greater the number of remaining stages.

(3) Developability in a weak alkaline aqueous solution For those exposed as described in (2) above.

Using a 1% by weight aqueous sodium carbonate solution, a developing machine (
Manufactured by Furuya Shokai ■, YCE-85), 2.1kg /
Development was carried out at 30° C. for 80 seconds under a pressure of CD.

After development, it was observed under 30x magnification, and the remaining resin was visually evaluated.

The evaluation ranks are as follows.

○: Good developability (no resist remains on the copper surface) ×: Poor developability (some resist remains on the copper surface) (4) Coating film hardness (2) and After exposure and development as in (3).

The hardness of the coating film heated at 145℃ for 50 minutes is determined by JISK.
When a load of 1 kg was applied using a pencil hardness tester according to the test method of -5400, the highest hardness without scratching the coating was displayed. The pencil used was "Mitsubishi Hi-Uni" S (manufactured by Mitsubishi Pencil Co., Ltd.).

(5) Adhesion to the substrate After exposure and development as described in (2) and (3) above.

The coating heated at 145°C for 50 minutes has a
Insert crosscuts to obtain individual base marks.

Next, a peeling test was conducted using an adhesive tape, and the state of peeling of the base grains was visually evaluated.

The evaluation ranks are as follows.

○: No peeling was observed at all measurement points △: Peeling was observed at 1 to 20 of 100 measurement points X: Peeling was observed at 21 or more points out of 100 measurement points (6) Solder heat resistance After exposure and development as described in (2) and (3) above.

For coating films heated at 145°C for 50 minutes, JIS D
-0202, it was immersed in a 260°C solder bath for 20 seconds, and the state of the coating film after immersion was evaluated. The evaluation ranks are as follows.

○: There is no abnormality in the appearance of the coating film.

The patterned substrate was heated at 145° C. for 50 minutes, degreased and cleaned, subjected to catalyst activation treatment, and treated at 90° C. for 15 minutes using a commercially available electroless nickel plating solution (PH=6).

Furthermore, electroless gold plating solution [P)l=6. KAu (
CN) 3g/l] at 90°C for 90 minutes to adhere gold to a thickness of 2μm, conduct a peeling test using adhesive tape, and visually evaluate the state of peeling on the copper circuit. did. The evaluation ranks are as follows.

○: No peeling was observed on the copper circuit △: 1 to 2
Items with peeling observed in some places X: Items with peeling in 3 or more areas (8) Chemical resistance Exposure and development as described in (2) and (3) above.
The coating film heated at 5° C. for 50 minutes was immersed in each of the following chemicals at 25° C. for 1 hour, and the appearance and adhesion after immersion were evaluated.

■Acid resistance 10% by weight H (l aqueous solution ■Alkali resistance 10% by weight NaOH aqueous solution ■Solvent resistance trichloroethane methylene chloride Isopropyl alcohol The evaluation ranks are as follows.

○: No abnormality X: Dissolution or swelling (9) Insulation resistance Exposure and development as in (2) and (3) above.
JIS Z-319 on the coating film heated at 5℃ for 50 minutes.
A circular electrode was prepared according to 7, normal condition and 55°C, 95%
RH, insulation after 100 hours, manufactured by Toa Denpa ■, 5up
er MegohmeterModel SM-5
It was measured using h.

As is clear from Table 1, it can be seen that the coating film made of the resin composition of the present invention has excellent resistance to electroless gold plating as well as other properties.

(Effects of the Invention) Since the present invention is configured as described above, 1) a film made of the alkali-developable photosensitive resin composition of the present invention is formed on a printed wiring board; ! After light and alkaline development,
Acid resistance, alkali resistance, solvent resistance, soldering heat resistance, electrical insulation 1 Mechanical strength.

A protective mask with excellent surface hardness etc. can be obtained. moreover,!
! These properties are further improved by thermosetting the light part. Furthermore, since it has resistance to electroless plating, electroless gold plating can be applied thereon, and wasteful use of expensive gold can be avoided.

Because it has such properties, the alkali-developable photosensitive resin composition of the present invention can be used not only in resist inks as described above, but also in etching resists related to printed wiring boards, interlayer insulating materials, and photosensitive adhesives.

28 editions as paints, plastic reliefs, plastic hard coats, and offset printing plates.

It can be used as a photosensitive liquid for screen printing.

Can be used in a wide range of fields.

Claims (1)

[Claims] (1) Consisting of the following components (A), (B), (C) and (D), the ratio of component (B) to 100 parts by weight of component (A) is 5 to 100 parts by weight, and component (C) The percentage of
100 parts by weight, and the proportion of component (D) is 0.1 to 30
Parts by weight of an alkali-developable photosensitive resin composition. Component (A): A polymer or oligomer that has a carboxyl group and a vinyl group in the same molecule and is soluble in an alkaline aqueous solution. Component (B): A polymer represented by the following general formula [I] and having a carboxyl group at the end. ▲There are mathematical formulas, chemical formulas, tables, etc.▼ [I] (In the formula, x, y and z are integers from 10 to 200) (C) component: A compound having at least one epoxy group. Component (D): photopolymerization initiator or sensitizer.