JPH03279680A - Vacuum processing device - Google Patents
Vacuum processing deviceInfo
- Publication number
- JPH03279680A JPH03279680A JP7809790A JP7809790A JPH03279680A JP H03279680 A JPH03279680 A JP H03279680A JP 7809790 A JP7809790 A JP 7809790A JP 7809790 A JP7809790 A JP 7809790A JP H03279680 A JPH03279680 A JP H03279680A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum
- gas
- leak
- pressure
- solenoid valves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 claims abstract description 17
- 238000005507 spraying Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 23
- 238000007664 blowing Methods 0.000 abstract 1
- 238000004092 self-diagnosis Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004868 gas analysis Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は真空処理装置に関し、特にリークの有無の自己
診断機能を有する真空処理装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a vacuum processing apparatus, and more particularly to a vacuum processing apparatus having a self-diagnosis function for the presence or absence of leaks.
現在、半導体産業をはじめとする数多くの分野で真空処
理装置が用いられている。真空処理装置には、基板等の
表面に薄膜を形成するための蒸着装置、スパッタリング
装置、ＣＶＤ装置、また逆に、基板表面をエツチングす
るドライエツチング装置や、さらには、イオン注入装置
等多くの種類がある。Vacuum processing equipment is currently used in many fields including the semiconductor industry. There are many types of vacuum processing equipment, including evaporation equipment, sputtering equipment, CVD equipment for forming thin films on the surface of substrates, dry etching equipment for etching the substrate surface, and ion implantation equipment. There is.
これら真空処理装置では、真空ポンプにより排気された
真空容器内で処理が行われるが、真空容器内の真空をい
かに保つかが重要なかぎであり、このためには、リーク
の有無を適確に、かつ、迅速に判断しなければならない
。In these vacuum processing equipment, processing is performed inside a vacuum container that is evacuated by a vacuum pump, but the key is how to maintain the vacuum inside the vacuum container, and for this purpose, it is necessary to accurately check for leaks. , and must make decisions quickly.
真空容器のリークテスト方法には周知の通り種々の方法
があるが、人手を介さずに、装置が自動でリークの有無
を判断する自己診断方法には、以下に述べる２つの方法
がある。As is well known, there are various methods for testing leaks in vacuum containers, but there are two methods described below as self-diagnosis methods in which the device automatically determines whether there is a leak without human intervention.
まず、第１の方法は真空ポンプにより真空容器内を十分
に排気した後排気を停止し、真空容器内の圧力上昇を真
空計を用いてモニタすることによりリークの有無を判断
する方法で、封止圧力上昇法、または、ビルドアップ法
と呼ばれている。排気を停止した後の真空容器内の圧力
上昇は、真空容器内からのガス放出による圧力上昇とリ
ークによる圧力−上昇との和である。このなめ、あらか
じめリークが無い時の真空容器内からのガス放出による
圧力上昇速度を調べておき、リークテスト時の圧力上昇
速度と比較することにより、リークの有無を判断するこ
とができる。リークが有る場合には警報を出し人に知ら
せる。First, the first method is to sufficiently evacuate the inside of the vacuum container using a vacuum pump, then stop the evacuation, and then monitor the pressure rise inside the vacuum container using a vacuum gauge to determine whether there is a leak. This is called the stop pressure increase method or build-up method. The pressure increase within the vacuum vessel after the evacuation is stopped is the sum of the pressure increase due to gas discharge from the vacuum vessel and the pressure rise due to leakage. For this reason, the presence or absence of a leak can be determined by checking in advance the rate of pressure increase due to gas release from the vacuum container when there is no leak, and comparing it with the rate of pressure increase during a leak test. If there is a leak, an alarm will be issued and the person will be notified.
また、第２の方法は、残留カス分析法と呼はれる方法で
真空容器内の残留カス成分を分析するための分析計を備
え、これによりリークの有無を判断する方法である。リ
ークが無い時の残留ガススペクトルをメモリしておき、
大気中の成分であるＮ （ｍ／ｅ＝１４．ｍ／ｅ＝２８
）、０２ （ｍ／ｅ＝３２＞のピークがリークの無い
場合に比べて高い場合には、リークが発生しているもの
と判断し警報を出力する。The second method is a method called a residual residue analysis method, which includes an analyzer for analyzing residual residue components in the vacuum container, and thereby determines whether there is a leak. Memorize the residual gas spectrum when there is no leak,
N, a component in the atmosphere (m/e=14.m/e=28
), 02 (If the peak of m/e=32> is higher than when there is no leak, it is determined that a leak has occurred and an alarm is output.
〔発明が解決しようとする課題〕
上述した従来の封止圧力上昇法や残留カス分析法を用い
た真空処理装置のリーク自己診断方法では、大きなリー
クしか検知できず、微少リークまで発見できないという
欠点がある。この理由は以下の通りである。[Problem to be solved by the invention] The conventional leak self-diagnosis method for vacuum processing equipment using the conventional sealing pressure increase method and residual residue analysis method described above has the disadvantage that only large leaks can be detected and even minute leaks cannot be detected. There is. The reason for this is as follows.
封止圧力上昇法を用いた場合は、真空容器の枯れ具合、
すなわち、脱カスの度合いによって、排気停止後の真空
容器内からのガス放出による圧力上昇速度にばらつきが
生しる。When using the sealing pressure increase method, the condition of the vacuum container,
That is, depending on the degree of slag removal, the rate of pressure rise due to gas release from the vacuum container after the evacuation is stopped varies.
また、一方、残留カス分析法を用いた場合でも同様に真
空容器の枯れ具合や、真空ポンプの排気性能の経時変化
等の要因により残留ガススペクトルに差異が生じる。On the other hand, even when using the residual gas analysis method, differences occur in the residual gas spectra due to factors such as how dry the vacuum container is and the evacuation performance of the vacuum pump changes over time.
このように、両方法とも、リークの有無を判断する際の
基準値か種々の要因でふらつくため、あいまいであり大
まかな判断しかできない。このため、大きなリークを発
見することはできても微小のリークまでは発見できない
のである。In this way, in both methods, the reference value for determining the presence or absence of a leak fluctuates due to various factors, so it is ambiguous and only a rough judgment can be made. For this reason, even if large leaks can be detected, minute leaks cannot be detected.
本発明の目的は、高感度でリークテス１へに良く用いら
れているプローブ法を用いて人手を介さずにリークの有
無を自己診断する真空処理装置を、掃供することにある
。SUMMARY OF THE INVENTION An object of the present invention is to provide a vacuum processing apparatus that self-diagnoses the presence or absence of leaks without human intervention using a highly sensitive probe method that is often used in leak test 1.
なお、周知の通りプローブ法とは、真空容器の内部を真
空にしておいて外側より試験ガス（プローブガスとも呼
ぶ）を吹き付けながら真空容器内の試験ガスの圧力変化
を測定してリークの有無を判断する方法である。As is well known, the probe method is a method in which the inside of a vacuum container is evacuated and a test gas (also called probe gas) is sprayed from the outside while measuring the pressure change of the test gas inside the vacuum container to check for leaks. It is a method of judgment.
本□発明は、真空容器と、該真空容器に真空シール部分
を有する真空処理装置において、前記真空シール部分の
周囲に配置され前記真空シール部分に試験ガスの吹き付
けを行う複数のガス吹き出し口と、該ガス吹き出し口の
それぞれに順次前記真空シール部分を回転するように前
記試験ガスを供給する電磁弁と、前記真空容器に接続し
該真空容器内の前記試験ガスの圧力変化を検出する測定
器とを備えている。The present invention provides a vacuum processing apparatus having a vacuum container and a vacuum seal portion in the vacuum container, including a plurality of gas blow-off ports disposed around the vacuum seal portion for spraying a test gas onto the vacuum seal portion; a solenoid valve that sequentially supplies the test gas to each of the gas outlets so as to rotate the vacuum seal portion; and a measuring device that is connected to the vacuum container and detects pressure changes of the test gas within the vacuum container. It is equipped with
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
通常、真空処理装置ではメンテナンス等で頻繁に開閉す
る扉等の真空シール部分からリークか発生する場合が多
い。このため本実施例ては、真空容器と扉の間の真空シ
ール部分からのリークの有無をテストする方法について
説明する。なお、試験ガスには、一般に良く用いられる
Ｈ ｅカスを使用する。Normally, in vacuum processing equipment, leaks often occur from vacuum seals such as doors that are frequently opened and closed for maintenance and the like. Therefore, in this embodiment, a method of testing whether there is a leak from the vacuum seal between the vacuum container and the door will be described. Note that He dregs, which is commonly used, is used as the test gas.
第１図は本発明の一実施例の概略構成図である。FIG. 1 is a schematic diagram of an embodiment of the present invention.
第１図に示すように、真空容器１は、主弁２を介して接
続された真空ポンプ３により排気される。また、四重極
質量分析計４は、カットバルブ５を介して真空容器１と
接続されている。As shown in FIG. 1, a vacuum container 1 is evacuated by a vacuum pump 3 connected via a main valve 2. As shown in FIG. Further, the quadrupole mass spectrometer 4 is connected to the vacuum vessel 1 via a cut valve 5.
また、第２図は本発明の一実施例の配管図である。Moreover, FIG. 2 is a piping diagram of one embodiment of the present invention.
第２図に示すように、扉（図示せず）と真空容器１は、
Ｏリング６により真空シールされる。真空容器１の周囲
には、Ｈｅガスボンベ７、減圧弁８、マスフローコント
ローラ９に接続されたＨｅガス配管１０が設置されてい
る。また、Ｈｅガス配管１０にはＯリング６へ向って複
数個のＨｅガス吹き出し口１．１−ａ、 １．１−ｂ、
１１−ｃｌｌ−ｄ、１１−ｅ、１１−ｆ、１１−ｇ、
１１ｈが取り付けられており、これらのうちの任意の場
所からＨｅガスが出るようコントロールするため、電磁
弁１．２−ａ、１２−ｂ、１２−ｃ。As shown in FIG. 2, the door (not shown) and the vacuum container 1 are
A vacuum seal is provided by an O-ring 6. A He gas pipe 10 connected to a He gas cylinder 7, a pressure reducing valve 8, and a mass flow controller 9 is installed around the vacuum container 1. In addition, the He gas pipe 10 has a plurality of He gas outlet ports 1.1-a, 1.1-b, facing the O-ring 6.
11-cll-d, 11-e, 11-f, 11-g,
11h, and solenoid valves 1.2-a, 12-b, and 12-c are installed to control He gas to be emitted from any location among these.
１２−ｄ、１２−ｅ、１２−ｆ、１２−ｇ、１２ｈを有
している。12-d, 12-e, 12-f, 12-g, and 12h.
以下に、本発明の真空処理装置のリーク自己診断方法に
ついて順を追って述べる。The leak self-diagnosis method for a vacuum processing apparatus according to the present invention will be described step by step below.
まず、主弁２を開けて真空容器１の内部を真空ポンプ３
により排気する。真空度が四重様質量分析計４の動作可
能圧力である１０−’ Ｔｏｒｒ以下になったときに
カットバルブ５を開は四重様質量分析計４を動作させる
。First, open the main valve 2 and remove the inside of the vacuum container 1 from the vacuum pump 3.
Exhaust by. When the degree of vacuum becomes less than 10-' Torr, which is the operating pressure of the quadruple-like mass spectrometer 4, the cut valve 5 is opened and the quadruple-like mass spectrometer 4 is operated.
次に、この状態で電磁弁１２−ａを開け、他の電磁弁を
閉めることによりＨｅガス吹き出し口１１−ａよりＨｅ
ガスを真空シール部分に対して吹き付け、２〜３秒経過
後電磁弁１２−ａを閉める。このとき、四重様質量分析
計４でＨｅの圧力をモニタし、Ｈｅの圧力が上あがって
いく場合にはリーク有りと判断する。なお、Ｈｅガスの
吹き付は量は真空容器１内部のＨｅガスの分圧に応じて
適当にマスフローコントローラ９により調節することが
できる。Next, in this state, by opening the solenoid valve 12-a and closing the other solenoid valves, He gas is released from the He gas outlet 11-a.
Gas is sprayed onto the vacuum sealed portion, and after 2 to 3 seconds, the solenoid valve 12-a is closed. At this time, the pressure of He is monitored by the quadruple-like mass spectrometer 4, and if the pressure of He increases, it is determined that there is a leak. Note that the amount of He gas sprayed can be appropriately adjusted by the mass flow controller 9 depending on the partial pressure of He gas inside the vacuum container 1.
次に、電磁弁１２−１）を開け、他の電磁弁を閉めるこ
とによりＨｅガス吹き出し口１１−ｂよりＨｅガスを真
空シール部分に吹き付ける。同様の方法でリークの有無
をチエツクする。Next, by opening the solenoid valve 12-1) and closing the other solenoid valves, He gas is blown from the He gas outlet 11-b onto the vacuum sealed portion. Check for leaks in the same way.
このようにして、１１−ａ、１１−ｂ、１１ｃ、１１−
ｄ、１１−ｅ、１１−ｆ、１１−ｇ。In this way, 11-a, 11-b, 11c, 11-
d, 11-e, 11-f, 11-g.
１１−ｈの順にＩ−Ｔ ｅガス吹き出し口より真空シー
ル部分に対してＨｅガスを吹き付はリークの有無をチエ
ツクしていく。Ｈｅガスは軽いのでリークの場所を確認
しないよう、上から順に下へと吹き付けている。In the order of 11-h, He gas is sprayed from the I-Te gas outlet to the vacuum sealed portion to check for leaks. Since He gas is light, it is sprayed from top to bottom to avoid checking the location of the leak.
以上のリークテストでリークが検知された場合は、本真
空処理装置はブザーを鳴らして警報を出し、さらに、Ｃ
ＲＴ等によりリークの検知された領域を表示する。If a leak is detected in the above leak test, this vacuum processing equipment will sound a buzzer to issue an alarm, and also
Displays the area where a leak has been detected by RT or the like.
以上説明したように本発明の真空処理装置は、プローブ
法を用いてリークテストを行うため、従来の封Ｉヒ圧力
上昇法や残留ガス分析法を用いたリークの自己診断方法
に比べて、はるかに高感度にリークチエツクを行うこと
ができ、１Ｏ−１０Ｔ ｏ ｒ ｒ −（１／ ｓ ｅ
ｃといった微少のリークも検知することが可能である
。また、従来不可能であったリーク箇所の特定について
も、その領域をある程度限定することができるのでリー
ク修理を容易にすることができるという効果がある。As explained above, since the vacuum processing apparatus of the present invention performs a leak test using the probe method, it is far more effective than the conventional leak self-diagnosis method using the seal pressure increase method or residual gas analysis method. Leak checks can be performed with high sensitivity in
It is also possible to detect minute leaks such as c. Furthermore, since the area of the leak can be limited to a certain extent in identifying the leak point, which has been impossible in the past, there is an effect that leak repair can be facilitated.
【図面の簡単な説明】
第１図は本発明の一実施例の概略構成図、第２図は本発
明の一実施例の配管図である。
１・・真空容器、２・・・主弁、３・・真空ポンプ、４
・・・四重様質量分析計、５・・・カットバルブ、６・
・・Ｏリング、７・・・Ｈｅガスボンベ、８・・・減圧
弁、９・・マスフローコントローラ、１０・・・Ｈｅガ
ス配管、ａ〜ｈ・・・Ｈｅガス吹き出し口、
・・電磁弁。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of an embodiment of the present invention, and FIG. 2 is a piping diagram of an embodiment of the present invention. 1...Vacuum container, 2...Main valve, 3...Vacuum pump, 4
... Quadruple-like mass spectrometer, 5... Cut valve, 6.
...O ring, 7...He gas cylinder, 8...pressure reducing valve, 9...mass flow controller, 10...He gas piping, a-h...He gas outlet, ...electromagnetic valve.
Claims (1)
処理装置において、前記真空シール部分の周囲に配置さ
れ前記真空シール部分に試験ガスの吹き付けを行う複数
のガス吹き出し口と、該ガス吹き出し口のそれぞれに順
次前記真空シール部分を回転するように前記試験ガスを
供給する電磁弁と、前記真空容器に接続し該真空容器内
の前記試験ガスの圧力変化を検出する測定器とを備えた
ことを特徴とする真空処理装置。In a vacuum processing apparatus having a vacuum container and a vacuum seal portion in the vacuum container, a plurality of gas blow-off ports arranged around the vacuum seal portion and for spraying a test gas onto the vacuum seal portion; Each of the vacuum seals is equipped with an electromagnetic valve that sequentially supplies the test gas so as to rotate the vacuum seal portion, and a measuring device that is connected to the vacuum container and detects a change in the pressure of the test gas in the vacuum container. Features of vacuum processing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7809790A JPH03279680A (en) | 1990-03-27 | 1990-03-27 | Vacuum processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7809790A JPH03279680A (en) | 1990-03-27 | 1990-03-27 | Vacuum processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03279680A true JPH03279680A (en) | 1991-12-10 |
Family
ID=13652364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7809790A Pending JPH03279680A (en) | 1990-03-27 | 1990-03-27 | Vacuum processing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03279680A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006295099A (en) * | 2005-03-16 | 2006-10-26 | Tokyo Electron Ltd | Vacuum equipment, method for measuring its leak rate, program and storage medium used for measuring leak rate |
| JP2015052409A (en) * | 2013-09-06 | 2015-03-19 | 株式会社サムソン | Vacuum cooling device |
| JP2016069747A (en) * | 2014-09-30 | 2016-05-09 | 株式会社ニデック | Dyeing equipment |
-
1990
- 1990-03-27 JP JP7809790A patent/JPH03279680A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006295099A (en) * | 2005-03-16 | 2006-10-26 | Tokyo Electron Ltd | Vacuum equipment, method for measuring its leak rate, program and storage medium used for measuring leak rate |
| JP2015052409A (en) * | 2013-09-06 | 2015-03-19 | 株式会社サムソン | Vacuum cooling device |
| JP2016069747A (en) * | 2014-09-30 | 2016-05-09 | 株式会社ニデック | Dyeing equipment |
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