JPH03277441A - Microdisplacement mechanism, support member and reduction projection exposure device thereof - Google Patents

Abstract

PURPOSE:To make them in a simple structure, to enable the microdisplacement adjustment in a high accuracy and to realize the cost reduction and life extension, by supporting the body to be displaced with a flexible supporting member centering around an intermediate point and equipping a variable control means together with the bestowal of a necessory force for the flexible action at the support membere intermediate point. CONSTITUTION:The gap in the vertical direction of a reticle 6 and the wafer 4 located on a wafer holding base 3 is found by a detector and input to a controller 18 by an electric signal. The controller 18 then operates a corrected displacement quantity based on the deviation of the both, in the case of there being the difference more than allowance between the gap detection quantity between the reticle 6 and wafer 4 and a target gap quantity. A motor 19 is then rotated according to a command signal, when the displacement command signal necessary for correction is transmitted to the motor 19 of the screw driving mechanism 14 of each support member 12 and a necessary force F is imparted to the intermediate point of the support member 12 by the screw mechanism 14. So, the intermediate point of the support member 12 is primarily displaced and also the wafer holding base 3 is microdisplaced secondarily and the wafer 4 face is corrected so as to locate at the depth of focus uniformly for the reticle 6.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention utilizes a micro-displacement mechanism that performs linear or angular position Fi adjustment, a support member used therefor, and the micro-displacement mechanism as a wafer leveling mechanism. The present invention relates to a projection exposure apparatus.

[Conventional technology]

For example, reduction projection exposure, which is one of the semiconductor manufacturing processes, is performed by focusing a reticle original screen on a wafer placed on a stage (wafer holder) via a reduction lens, as is well known.

This focusing uses a wafer leveling mechanism (fine displacement mechanism) to adjust the focus up and down to adjust the focus between the original reticle screen and the wafer surface for each chip in response to warpage, uneven thickness, and deformation of the wafer itself. , to fine-tune the tilt displacement.

As a conventional example of such a wafer leveling mechanism,
For example, as disclosed in Japanese Patent Publication No. 63-30781, a method of controlling the displacement of a wafer holder using a piezo element is widely used.

In addition, as an application example of this type of displacement control, for example, as disclosed in Japanese Patent Application Laid-Open No. 117118/1982, in an observation device such as a photomask, in order to eliminate the effect of warping of the mask during observation, Techniques have been proposed for adjusting minute displacements of the stage using piezo elements or changes in fluid pressure.

[Problem to be solved by the invention]

Incidentally, as semiconductor manufacturing equipment becomes increasingly finer, has a higher throughput, and becomes more mass-produced, reduction projection exposure apparatuses are also being improved in performance. In particular, reduction lenses are being made to have a high NA in order to achieve finer resolution. Due to this high NA, the depth of focus becomes shallow, and minute warpage, thickness unevenness, tilt, etc. of the wafer surface, which is allowed to be moved back and forth, affect the defocus.

Therefore, it is necessary to appropriately correct the position of the wafer by very minute displacement adjustment (displacement amount on the submicron level) in response to the warpage, thickness unevenness, inclination, and the like.

The displacement adjustment mechanism using piezo elements, etc., described above is used for such purposes, but piezo elements have variations in characteristics, making it difficult to make minute displacement adjustments, and the voltage control equipment that applies piezo elements is expensive. They required large number of components and tended to have short lifespans.

The present invention has been made in view of the above points, and its purpose is to enable highly accurate minute displacement adjustment with a simple configuration, and which is advantageous in terms of cost and service life. The goal is to provide equipment.

[Means to solve the problem]

The present invention proposes the following basic means for solving the above problems.

That is, in a mechanism that displaces an object to be displaced angularly or linearly.

means for supporting the object to be displaced by a support member capable of bending and stretching operations around an intermediate point; and applying a force necessary for the bending and stretching operations to the intermediate point of the support member;

and means for variably controlling the force applied to the intermediate point.

In this basic problem-solving means, linearly displacing the displaced body means, for example, to quote the reference numerals of the embodiment in FIG. In the position adjustment mechanism, two of the ends of the movable body 3
There is a mode in which positions at equal intervals in the circumferential direction are supported by support members 12 having flexibility.

Further, as a mechanism for angularly displacing the object to be displaced, for example, referring to the reference numeral of the embodiment shown in FIG. There is one in which at least one end of the rotating body 30 is supported by a support member 12 that can bend and extend around an intermediate point.

Furthermore, we propose the following support member for use in the minute displacement mechanism. Referring to the reference numerals in FIG. 7, the link element A in the middle and the link elements B located on both sides thereof,
It is composed of an elastic rod-shaped member 12 that is integrally molded with C, and in this elastic rod-shaped member 12, notches 13a are provided between link elements A and B and between link elements A and C, and cuts are also provided at both ends of the rod-shaped member. 13b is provided.

Furthermore, as an example of applying a minute displacement mechanism to a reduction projection exposure apparatus, we propose a first-order mechanism to realize a highly accurate wafer leveling mechanism.

Referring to the reference numerals of the embodiment shown in FIG. 1, this includes a wafer holding table 3 on which a wafer 4 is placed, and an optical system disposed above the wafer holding table to reduce and project the circuit pattern of the reticle. In projection exposure equipment.

As a mechanism for moving the wafer holder 3 in the vertical direction, a space 3A is formed at the center of the lower surface of the wafer holder 3, and an elastic plate 8 is attached to the lower surface of the wafer holder 3 to cover this space 3A. , a strut 10 whose upper end is connected to an elastic plate 8 to support the wafer holding table 3; and two or more flexible columns arranged around the strut 10 to support the ends of the wafer holding table 3 at equal intervals in the circumferential direction. The support member 12 has a support member 12 and the like.

The support member 12 is an elastic rod-shaped member integrally formed with an intermediate link element A and link elements B and C located on both sides thereof. A notch 13a is provided in the support member 12, and a notch 13b is also provided at both ends of the rod-shaped member near the connection portion with the other members 3, 2, and the force necessary for bending and stretching is applied to the midpoint of the support member 12. Mechanism 14.

a spring mechanism 15 that applies a return force to the midpoint of the support member 12;
and.

A detector that detects the vertical distance between the reticle and the wafer 4, and a control section that variably controls the force applied to the midpoint of the support member 12 based on the deviation between the detected distance between the reticle and the wafer and the target distance. 18 is proposed.

[Effect]

When a force is applied to the intermediate point of a support member having flexibility and extensibility, the intermediate point undergoes a primary displacement, and the support member performs a bending and stretching operation in accordance with the amount of the -order displacement. As a result, a linear or angular displacement (secondary displacement) occurs in the displaced object.

Since the force required for bending and stretching the support member (-dimensional displacement amount) is variably controlled, the secondary displacement amount can also be arbitrarily controlled.

According to the present invention, the amount of displacement of the object to be displaced is controlled through the primary displacement and secondary displacement of the support member having flexibility, so that extremely small displacement control is possible based on the first-order principle.

FIG. 5 shows the operating principle of the present invention.

In FIG. 5, a is the midpoint of the flexible support member, b, c
indicates both ends. Incidentally, one of both ends (a) and (c) of the support member is normally fixed to a base or the like, but here, for convenience of explanation, both ends are left free.

Due to the control instruction amount X acting on intermediate point a, point a becomes point a'
The link elements (arms) B and C of the support member perform a bending and stretching operation accordingly, and the points C and C supported by d and e respectively undergo a secondary displacement to the position of point b'C'. do.

Due to this, the distance from surfaces d and e is the displacement △b, △
C is subtracted, and surfaces d and e are d' and e', respectively.
It is possible to adjust the position by one position.

Figure 6 shows the above primary and secondary displacements captured only on the half side of the support member, and each side of the right triangle Q,
fl''=x''+y2 holds true for x and y. here,
When Q is constant, when a negative displacement amount ΔX is applied to side X, an extremely small displacement Δy, which is much smaller than that, occurs on the other side y.

Expressing this as a formula, 11"=x"+y'y"=Q"-x" y=BTtsu? Δy=Q-y=Q-fiτtsu2 For example, the length Q of the link element B on the - side = 30■, -order displacement Δx = o, lam, then the secondary displacement is 83.
=0.167 μm.

Further, when Q=30 nm and the negative-order displacement amount Δx=0.01, the secondary displacement amount becomes Δy=0.042 μm. −
For example, by using a high-precision screw mechanism similar to that used in a micrometer as the mechanism for providing the secondary displacement, it is possible to obtain a minute displacement of about 0.01 μm as the amount of secondary displacement.

Note that the above equation expresses the amount of displacement on the half side of the support member, and the total amount of secondary displacement is 2×Δy.

As shown in FIG. 1, when two or more end portions of the movable body 3 are supported by support members 12 at equal intervals in the circumferential direction, the amount of bending and stretching (secondary displacement amount) Δy of each support member 12 If , the movable body 3 moves in parallel in the vertical direction, and if the secondary displacement amount Δy of each support member 12 is different, then the movable body 3 moves in parallel in the vertical direction.
is made to tilt diagonally.

Furthermore, if at least one end of the rotating body 30 is supported by the support member 12 as shown in FIG. 8, the rotating body can be moved in a minute angle in accordance with the amount of bending and stretching of the supporting member.

Various types of flexible support members are possible. For example, it is conceivable to connect two separately molded link elements with a pin, etc., but in this case, the gap between the pin connections tends to appear as a secondary displacement error, so submicron When performing unit displacement control, higher precision is required. A supporting member corresponding to this is provided with a cut 1 in the elastic rod-shaped member 12 as shown in FIG.
3a and 13b are included.

In other words, if the intermediate link element A and the link elements B and C on both sides are integrally molded, it is possible to eliminate pin connections between the link elements, which creates gaps that cause play (control errors) at the joints. do not.

Also, between link elements A and B, between A and C, and between support member 1
By making cuts 13a at both ends of the support member 2, the supporting member can be displaced as shown by the dashed line 12', and as shown in FIG. It can be replaced by a triangle connecting c', and a consistent displacement amount can be obtained, and the relationship between the primary displacement amount and the secondary displacement amount can be easily obtained as a calculated value.

Furthermore, due to the presence of the notches 13b at both ends of the support member 12,
The support member smoothly bends and stretches without applying excessive force to other connecting members connected to both ends of the support member.

It should be noted that the operation of the reduction projection exposure apparatus proposed in the problem solving means has been described in detail in the embodiment section, so a description thereof will be omitted here.

〔Example〕

An embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an example in which the minute displacement mechanism of the present invention is applied as a wafer leveling mechanism of a reduction projection exposure apparatus, and FIG. 2 is an overall configuration diagram of the reduction projection exposure apparatus to which the present invention is applied.

As shown in FIG. 2, in the reduction projection exposure apparatus, a wafer stage 2 is placed on a base 1. A holding table 3 for holding a wafer 4 is mounted on the wafer stage 2.

Therefore, the reticle original image 6 illuminated by the illumination system 5
The pattern is reduced by the reduction lens 7, and the pattern is
The image is transferred onto the four surfaces of the wafer placed on the wafer.

At this time, the distance between the wafer surface 4 and the reticle original image 6 surface is not constant due to warping of the wafer itself, uneven thickness, foreign matter, etc., and therefore correction is required.

Therefore, each time the stage 2 moves one step at a time, the pattern of the original reticle 6 is transferred to the wafer 4.
The distance correction must be performed every time the stage 2 moves, and each time the distance must be controlled to maintain a uniform distance within the depth of focus for the four wafer surfaces.

Here, leveling of the wafer 4 with respect to the reticle original image 6 in this embodiment will be explained.

A circular space 3A is formed at the center of the lower surface of the wafer holder 3, and an elastic plate 8 is attached to the lower surface of the holder 3 with screws 9 so as to cover the space 3A.

The elastic plate 8 is made of a material such as phosphor bronze.

A support 10 is installed vertically on the stage 2, and its upper end is connected to a screw 1.
The wafer holder 3 is coupled to the elastic plate 8 via the support 1, and in this way, the wafer holder 3 is supported by the support 10. The areas of the space 3A and the elastic plate 8 are larger than the area of the upper end of the support column 10.

Reference numeral 12 denotes a support member for supporting the wafer holding table 3, which is composed of a rod-shaped elastic member that performs bending and stretching operations around an intermediate point. In this embodiment, three supporting members 12 are arranged around the pillar 10 at intervals of 120 degrees, and one end is connected to the lower end of the wafer holding table 3.

The other end is connected to the top surface of the stage 2.

As shown in FIG. 7, the support member 12 includes an intermediate link element A and link elements B located on both sides thereof.

C is integrally molded, and cutouts 13a are provided between link elements A and B and between A and C, and are molded from a material such as phosphor bronze. Further, notches 13b are formed at both ends of the support member 12.

At a position crossing the midpoint of each support member 12.

An electric screw mechanism 14 is disposed at one position of the intermediate point to apply the force necessary for bending and stretching the support member 12, and a spring mechanism is placed at the other position to apply a return force to the support member 12. IS is placed.

The screw mechanism 14 has a function of horizontally screwing a screw rod 17 supported by a ball bearing 16, and has a driving accuracy of about a micrometer.
The controller 18 controls the rotation of the motor 19 to control the required amount of movement. The tip of the rod 17 is in point contact with the ball 12A provided at the midpoint of the support member 12, so as to apply a pressing force accurately to the midpoint.

The return spring mechanism 15 is shown in FIG. 4 (FIG. 4 is I-1 in FIG.
As shown in FIG. 1), it is composed of a ring-shaped elastic member, and is interposed between the support member 12 and the spring holder 20 while being held by the spring holder 20. When the intermediate point is at the origin position o, the supporting member 12 is compressed into a somewhat elliptical shape as shown in FIG. spring force is accumulated. That is, by applying preload, the screw mechanism 14 can be moved when the intermediate point of the support member 12 is at the origin Q.
Even if the rod 17 moves backward (leftward in FIG. 4), it is possible to apply a returning force to the support member 12 in the +X range.

The support member 12 supports the reciprocating movement of the screw mechanism 14 and the return mechanism 1.
5, the intermediate point is set to undergo a primary displacement within a range of ±X (approximately several I) around the origin O.

In the above configuration, the amount of movement of the wafer holding table 3 in the biaxial directions is controlled by controlling the amount of bending and stretching of each support member 12. Movement amount control in the X-axis and Y-axis directions is performed by moving the stage 2.

FIG. 3(a) shows a case where the amount of each support member 12 is equally larger than before, and in this case, the elastic plate 8 is evenly lowered around the support column due to the existence of the space 3A. As a result, the entire wafer holding table 3 is translated downward by Δ2 (corresponding to twice Δy in FIG. 6). This parallel movement is performed when aligning the entire wafer 4 with respect to the reticle 6 in the vertical direction.

FIG. 3(b) shows a case where, for example, the amount of only one of the supporting members 12 is made larger than the other supporting members 12, and in this case, the downward deflection of a part of the elastic plate 8 As the amount increases, the wafer holding table 3 is tilted and displaced by θ. This tilt displacement control is used to correct when the distance of the wafer 4 to the reticle 6 is not uniform due to factors such as warping of the wafer 4, uneven thickness, or contamination of foreign matter.

The displacement control system operates as follows.

When adjusting the position of the wafer 4 with respect to the reticle 6 during reduction projection exposure, first the vertical distance between the reticle 6 and the wafer 4 on the wafer holder 3 is determined using a detector (not shown).

The reticle-to-wafer measurement value determined by the detector is input to the controller 18 as an electrical signal.

If there is a difference greater than permissible between the detected distance between the reticle and the wafer and the target distance, the controller 18 calculates a displacement amount to correct the difference based on the deviation between the two, and corrects it. A necessary displacement command signal is sent to the motor 19 of the screw drive mechanism 14 of each support member 12. The motor 19 is driven to rotate in response to a command signal, and the screw mechanism 14 rotates the support member 12.
The required force F is given at the midpoint of .

As a result, the intermediate point of the support member 12 is firstly displaced, and the wafer holding table 3 is secondarily displaced (minor displacement) by the operating mechanism explained in FIG. Fixed to be located at depth.

According to this embodiment, the following effects are achieved.

■The support member 12 used for position adjustment is a flexible support member as explained in the section 1. Function of the invention, and by using a high-precision screw mechanism 14, minute displacement of submicron order can be achieved. I was able to get it. In addition, the link elements A, B, and C are integrally connected, and notches 13 are made in them to enable stable bending and stretching, and the support column 10 and the wafer holding table 3 are also connected via the elastic plate 8. There is no play in these joints, unlike in pin joints, and it is possible to prevent a decrease in the accuracy of the minute displacement control in submicron units.

Figure 10 shows an example of actual measurement of minute displacement in this example, with 0
．． A minute displacement amount of up to 0.4 μm was confirmed. Furthermore, the actual measured value of the minute displacement mechanism is almost the same as the calculated displacement value.

The error here is considered to be an error in the analog reading of the micrometer. Note that in this actual measurement example, minute displacements were measured using measurement equipment available to the inventor, and it is possible to confirm minute displacements of about 0.01 μm using more accurate measurement equipment. be.

Moreover, although the wafer holding table 3 is displaced in the vertical direction by the bending action of the elastic plate 8, since the elastic plate 8 is fixed to both the support column 10 and the wafer holding table 3, it is forcibly held in the horizontal direction and is Displacement is performed exclusively in the direction (vertical direction) and not in the lateral direction.

Therefore, the synergistic effect described above makes it possible to improve the precision of wafer leveling adjustment for reduction projection.

(2) Furthermore, as mentioned in (2), since it is possible to perform vertical displacement only with the elastic plate 8, there is no need for a guide mechanism to prevent lateral displacement.

The mechanism can be simplified.

Note that instead of the elastic plate 8, the support 10 itself may be made to be able to rise and fall; however, in this case, the gap created between the lifting rod of the support 10 and the cylindrical body that accommodates it will become loose, causing the horizontal This tends to cause minute displacements in the direction. Therefore, if a method of raising and lowering the support column 10 itself is used to perform high-precision minute displacement as in a wafer leveling mechanism, it is necessary to arrange a guide or the like around the outer circumference of the displaced object 3 to restrict lateral movement. be.

■Furthermore, in terms of efficiency, due to the mechanical operation, output displacement occurs realistically with respect to the control instruction amount, and furthermore, the support member 1
A preloaded ring-shaped spring is used as the spring mechanism 15 that applies a return force to the intermediate point of 2, but since this spring mechanism accumulates sufficient return force even for minute displacements,
Good response compared to springs etc. Therefore, highly responsive minute displacement control is possible.

■As mentioned above, the wafer leveling mechanism of this embodiment eliminates the need for a guide mechanism that restricts the lateral movement of the wafer holding table 3, and also eliminates the need for a voltage application control circuit such as a piezo element, reducing the number of parts. This makes it possible to reduce the cost of the device.

As a result of the above-mentioned various effects, a wafer leveling function that can sufficiently cope with the deepening of the depth of focus accompanying the increase in the NA of the reduction lens in reduction projection exposure equipment has been obtained, and high integration and high throughput of the 16M level have been achieved. , high reliability, and enable highly efficient mass production of wafers.

FIG. 8 shows another example (second embodiment) of the present invention. This embodiment is an angular displacement mechanism for displacing one rotation angle, and uses a support member 12 having flexibility similar to the first embodiment. One end of the support member 12 is coupled to a fixed base 32, and the other end is coupled to a point of action of a rotating body 30 rotating around a shaft 31.

Although not shown in this embodiment, the support member 1
A force F necessary for bending and stretching is applied to the center point of the body 2 by a tensioning mechanism similar to the first embodiment, and a returning force is applied to the other end by a spring mechanism.

According to such a configuration, the angular displacement of the rotating body 30 can be adjusted by variable control of the force F applied to the intermediate point.

FIG. 9 shows a modification (third embodiment) of FIG. 8, in which the rotating body 3
The supported parts 34 of the rotating body are arranged at equal intervals in the circumferential direction on the outer periphery of the rotating body 3.
In this example, the three points of action are set to 12 points.
The support members 12 having flexibility and extensibility are also provided in the same number as the points of action 34 (spaced apart by stripes of 0 degrees), and these points of action are supported by each support member 12.

In this embodiment as well, the force F necessary for bending and stretching is applied to the center point of the support member 12 by a screw mechanism or the like, and the return force is applied to the other end by a spring mechanism. The forces F applied to each support member 12 are all uniform, and the rotating body 33 is thereby angularly displaced.

According to this embodiment, the supported portion 34 of the rotating body 33
By setting a plurality of at equal intervals on the outer circumference of the rotating body and supporting these with a plurality of supporting members 12, the rotating body 3 relative to the shaft 31 can be
3 is performed, the rotating body 33 is prevented from rotating eccentrically with respect to the axis, and more accurate angular displacement control can be performed.

In addition, in each of the above embodiments, the support member 12 having flexibility and extensibility is
The link elements A, B, and C are integrally connected using an elastic rod-like member, but the present invention is not limited to this.

As described above, any member may be used as long as the intermediate point undergoes primary displacement and at least one end thereof undergoes secondary displacement. for example,
Even something like connecting two link elements with a pin,
Any minute displacement mechanism that does not require very high precision can be applied.

In addition, in the above embodiment, a reduction projection exposure apparatus was illustrated as an application system of the minute displacement mechanism, but the system is not limited to this, and other applications include, for example, optical axis adjustment of an optical interferometer, a distortion correction system for a telescope image, a microscope stage, VT
It can be applied to a system for correcting misalignment between an R head and a track, a submicron displacement meter, increasing the displacement of a hydraulic mechanism, etc., and is not limited to its uses.

〔Effect of the invention〕

As described above, according to the micro-displacement mechanism of the present invention, by generating primary displacement and secondary displacement using a mechanical bending/stretching mechanism, it is possible to eliminate variations in characteristics like piezo elements and achieve ultra-fine displacement at the sub-micron level. This enables displacement, reduces the number of parts, and reduces manufacturing costs.

Further, by using a support member in which the link elements A, B, and C are integrally connected and notches are made therein, it is possible to improve the accuracy of minute displacement and eliminate errors as much as possible, thereby increasing reliability. Incidentally, in terms of performance, while the average minimum displacement of a piezo element is at the level of 0.1 μm, the present invention allows ultra-fine displacement of 0.001 μm.

Furthermore, according to the projection exposure apparatus of the present invention which applies the above-mentioned minute displacement mechanism, by attaching the wafer holding table to the column via an elastic plate and by adopting the above-mentioned support member structure, it is possible to reduce errors. This makes it possible to achieve high-precision wafer leveling control with a small number of steps and excellent responsiveness.

[Brief explanation of the drawing]

1 is an explanatory diagram in which a minute displacement mechanism is applied to a wafer leveling mechanism for reduction projection exposure in a first embodiment of the present invention, and FIG.
The figure is an overall configuration diagram of a reduction projection exposure apparatus to which the first embodiment is applied, FIG. 3 is an explanatory diagram showing an example of displacement control of the wafer holding table of the first embodiment, and FIG. The 1-1 line arrow view, FIGS. 5 and 6 are explanatory diagrams showing the operating principle of the present invention. FIG. 7 is a front view of the support member used in the first embodiment. FIG. 8 is a schematic diagram showing a second embodiment of the present invention, and FIG. 9 is a schematic diagram showing a third embodiment of the present invention. FIG. 10 is a diagram showing a comparison between actually measured values and calculated values of the goo-order displacement amount and the secondary displacement amount of the fine-hole displacement mechanism used in the first embodiment. 2... Support stand, 3... Wafer holding stand (displaced object),
3A... Space part, 4... Wafer, 6... Reticle, 7... Reduction projection exposure optical system, 8... Elastic plate, 1
0... Strut 12 = Support member, 12 A-... Ball, 13a, 13b... Notch, 14... Screw mechanism, 15 Return mechanism (ring-shaped spring), 18... Controller, 19...Motor 30...Rotating body, 31...Axis.

Claims (1)

[Scope of Claims] 1. In a mechanism for angularly or linearly displacing a displaced body, the displaced body is supported by a supporting member capable of bending and stretching around an intermediate point, and the supporting member is A micro-displacement mechanism comprising: means for applying a force necessary for bending and stretching at an intermediate point; and means for variably controlling the force applied to the intermediate point. 2. In a mechanism for adjusting the position of a movable body in the vertical or horizontal direction, a support member capable of bending and extending positions at equal intervals in the circumferential direction at two or more of the ends of the movable body, centering on a midpoint. A micro-displacement mechanism, comprising: means for applying a force necessary for bending and stretching operations to an intermediate point of the support member; and means for variably controlling the force applied to the intermediate point. 3. In the second aspect, the movable body has a space formed in the center of its back surface, and an elastic plate is attached to the back surface of the movable body to cover this space, and this elastic plate is installed on the base. A micro-displacement mechanism, which is connected to one end of a support column and supports the movable body on the base. 4. In a mechanism for angularly displacing a rotating body rotatably attached via a shaft, at least one end of the rotating body is supported by a support member capable of bending and extending around an intermediate point, and A micro-displacement mechanism comprising: means for applying a force necessary for bending and stretching at an intermediate point; and means for variably controlling the force applied to the intermediate point. 5. In the fourth aspect, two or more locations to be supported (supported portions) of the rotating body are set at equal intervals in the circumferential direction on the outer periphery of the rotating body, and a plurality of supporting members are provided correspondingly, and these A micro-displacement mechanism in which a supported portion is supported by each of the supporting members. 6. In any one of claims 1 to 5, the flexible support member is an elastic support member integrally formed with an intermediate link element A and link elements B and C located on both sides thereof. A rod-shaped member, in which cuts are provided between the link elements A and B and between the link elements A and C of the elastic rod-shaped member, and cuts are also provided near the connection portions with other members at both ends of the rod-shaped member. Micro displacement mechanism. 7. In any one of claims 1 to 6, the means for applying the force necessary for bending and stretching the intermediate point of the support member comprises a screw mechanism that is capable of reciprocating motion while contacting the intermediate point. Micro displacement mechanism. 8. In any one of claims 1 to 7, at a position crossing the intermediate point of the support member, means for applying a force necessary for the bending and stretching to one position sandwiching the intermediate point. and a spring mechanism for applying a return force to the support member is disposed at the other position, and the spring mechanism is a ring-shaped elastic member with one outer peripheral end touching the intermediate point, and the ring-shaped elastic member The minute displacement mechanism is configured to apply a preload to the ring-shaped elastic member in the operating direction (direction crossing the intermediate point) when the intermediate point is at the origin position, thereby accumulating a spring force. 9. The member supporting the displaced object is constituted by an elastic rod-shaped member integrally formed with an intermediate link element A and link elements B and C located on both sides thereof, and among this elastic rod-shaped member, the link element A - A support member characterized in that a notch is provided between B and between the link elements A and C, and also notches are provided at both ends of the rod-shaped member. 10. In a projection exposure apparatus comprising a wafer holder on which a wafer is placed, and an optical system disposed above the wafer holder to reduce and project a circuit pattern on a reticle, the wafer holder is moved in the vertical direction. As a mechanism,
A space is formed in the center of the lower surface of the wafer holder, and an elastic plate is attached to the lower surface of the wafer holder so as to cover the space, and the upper end is joined to the elastic plate to support the wafer holder. It is composed of a support column and two or more flexible support members arranged around the column and supporting the end portions of the wafer holding table at equal intervals in the circumferential direction, and the support member is an intermediate link element A. and link elements B and C located on both sides thereof are integrally molded, and cuts are provided between the link elements A and B and between the link elements A and C in this elastic rod member, and
A notch is also provided at both ends of the rod-shaped member near the connection with another member, and a mechanism for applying the force necessary for bending and stretching to the midpoint of the support member; a spring mechanism that applies a force; a detector that detects a vertical distance between the reticle and the wafer; A reduction projection exposure apparatus comprising a control section that variably controls applied force.