JPH03276799A - Circuit device for electronic apparatus - Google Patents
Circuit device for electronic apparatusInfo
- Publication number
- JPH03276799A JPH03276799A JP7727690A JP7727690A JPH03276799A JP H03276799 A JPH03276799 A JP H03276799A JP 7727690 A JP7727690 A JP 7727690A JP 7727690 A JP7727690 A JP 7727690A JP H03276799 A JPH03276799 A JP H03276799A
- Authority
- JP
- Japan
- Prior art keywords
- outside
- wiring board
- printed wiring
- shield container
- board unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 239000010408 film Substances 0.000 abstract description 17
- 230000005855 radiation Effects 0.000 abstract description 10
- 230000002238 attenuated effect Effects 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 abstract description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- -1 filters Substances 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0043—Casings being flexible containers, e.g. pouch, pocket, bag
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子機器用回路装置に係り、さらに詳しくは
、作用時に回路構成電子素子から発生する輻射ノイズ信
号を遮断するのに適したプリンタ装置などの電子機器用
回路装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a circuit device for electronic equipment, and more specifically, to a printer suitable for blocking radiation noise signals generated from circuit-constituting electronic elements during operation. The present invention relates to circuit devices for electronic devices such as devices.
コンピュータの出力碑器などで代表されるプリンタ装置
では、供給される信号発生に忠、実にプリンタユニット
が動作することが必要とされている。BACKGROUND ART In printer devices, such as computer output devices, the printer unit is required to operate faithfully and faithfully to the signal generation supplied.
そのため、回路ユニットでは各回路素子などから発生す
る輻射ノイズが、隣合っているプリント配線基板の回路
素子に対して影響することがないように、ノイズ遮断機
能が施されている。Therefore, the circuit unit is provided with a noise blocking function so that the radiation noise generated from each circuit element does not affect the circuit elements of the adjacent printed wiring board.
このノイズ遮断機能をもたせるためには、コンデンサー
やフィルタ、さらにはコアやインダクタンス素子などを
、回路を形成する導電パターンに付加したり、あるいは
回路装置全体を導電性の金属板で覆って輻射ノイズの伝
播を防いでいる。In order to provide this noise blocking function, it is necessary to add capacitors, filters, cores, inductance elements, etc. to the conductive patterns that form the circuit, or cover the entire circuit device with a conductive metal plate to reduce radiated noise. Preventing spread.
元来、電子回路においては、輻射ノイズの発生源を特定
することが大変困難である。このため、回路を構成する
全素子を輻射ノイズの発生源と仮定した上で対策を施す
ことが必要となる。そのため、従来例ムこあっては多数
のノイズ対策用の素子を組込むことを余儀なくされてお
り、これが原因して、動作速度の低下や、回路装置のコ
ストの上昇や、装置全体の大形化を招くという不都合が
生じていた。Originally, in electronic circuits, it is very difficult to identify the source of radiation noise. Therefore, it is necessary to assume that all the elements constituting the circuit are sources of radiation noise and take countermeasures. Therefore, in the conventional case, it is necessary to incorporate a large number of noise suppression elements, which results in a decrease in operating speed, an increase in the cost of the circuit device, and an increase in the size of the entire device. This caused the inconvenience of inviting
本発明は、かかる従来例の有する不都合を改善し、とく
に装置の動作速度の低下を招くことなく、プリント配線
基板からの輻射ノイズの放射を有効に低減させることの
できる電子機器用回路装置を提供することにある。The present invention improves the disadvantages of the conventional example and provides a circuit device for electronic equipment that can effectively reduce radiation noise from a printed wiring board without causing a decrease in the operating speed of the device. It's about doing.
本発明では、回路素子が装備された回路基板と、この回
路基板全体を収納するシールド用袋容器とを備え、シー
ルド用袋容器を、外側に導電体を配するとともに内側に
絶縁体を配して成る柔軟構造体により形成する、等の構
成を採っている。The present invention includes a circuit board equipped with circuit elements and a shielding bag container that houses the entire circuit board, and the shielding bag container is provided with a conductor on the outside and an insulator on the inside. The structure is made of a flexible structure made of
発生源の特定が困難な輻射ノイズ信号であってもプリン
ト配線基板ユニット全体を、内側が絶縁膜であり外側が
導電性金属膜であるフレキシブルなシールド容器中に収
納しているので、隣合っているフレキシブル配線基板ユ
ニットに対して輻射ノイズ信号が影響することがなく、
また、シールド容器と、これに並設された導電性の金属
板とを同電位に保持することでシールド容器のインピー
ダンスを低くすることが可能となり、従って輻射ノイズ
はより低減される。Even if there is a radiated noise signal whose source is difficult to identify, the entire printed wiring board unit is housed in a flexible shielded container with an insulating film on the inside and a conductive metal film on the outside, so it can be easily detected by The radiation noise signal does not affect the flexible wiring board unit,
Further, by maintaining the shield container and the conductive metal plate arranged in parallel thereto at the same potential, it becomes possible to lower the impedance of the shield container, and therefore, radiation noise is further reduced.
以下、添付した図面に沿って本発明の詳細な説明する。 Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
先ず、第１図は本発明による電子機器用回路装置の全体
斜視口であり、第２図は同−分の拡大断面図である。こ
れらの図において符号１０はプリント配線基板ユニット
を示し、各種の電子素子１１が導電パターンをもつプリ
ント配線基板１２に対してハンダ付けなど搭載されて構
成されている。さらに、プリント配線基板ユニットの端
部には装置外部信号接続ケーブル１３、装置内信号接続
ケーブル１４が接続されている。First, FIG. 1 is an overall perspective view of a circuit device for electronic equipment according to the present invention, and FIG. 2 is an enlarged sectional view of the same portion. In these figures, reference numeral 10 indicates a printed wiring board unit, which is constructed by mounting various electronic elements 11 on a printed wiring board 12 having a conductive pattern by soldering or the like. Furthermore, a device external signal connection cable 13 and an internal device signal connection cable 14 are connected to the ends of the printed wiring board unit.
そして、プリント配線基板ユニット１０ばフレキシブル
なシールド容器２０中に収容される。このシールド容器
２０は、外側が金属などの導電膜２１で、その内側が絶
縁膜２２を層設した０、２（ｍｍ）程度の薄膜状のもの
を袋状としたものにより形成されている。そして、この
袋状のシールド容器２０には、その開口部２０Ａから前
記プリント配線基板ユニット１０が挿入されて収容され
ると共に、装置外部信号接続ケーブル１３と装置内信号
接続ケーブル１４とが、外部へと延出されるようになっ
ている。The printed wiring board unit 10 is housed in a flexible shield container 20. This shield container 20 is formed of a bag-shaped thin film of about 0.2 (mm), with a conductive film 21 made of metal or the like on the outside and an insulating film 22 layered on the inside. The printed wiring board unit 10 is inserted and housed in the bag-shaped shield container 20 through its opening 20A, and the device external signal connection cable 13 and the device internal signal connection cable 14 are connected to the outside. It is now being extended.
このシールド容器２０は内側が絶縁膜２２であるから、
プリント配線基板ユニット１０に搭載された回路素子１
１に密着させることが可能となり、きわめて薄型に実装
することができるようになっている。Since this shield container 20 has an insulating film 22 on the inside,
Circuit element 1 mounted on printed wiring board unit 10
1, and can be mounted extremely thinly.
第３図、第４図に本発明の第２の実施例を示す。A second embodiment of the present invention is shown in FIGS. 3 and 4.
この内、第３図は一部を破断した全体斜面図であり、第
４図は第３図のＩＶ−ＩＶ線に沿う拡大断面図である。Of these, FIG. 3 is a partially cutaway overall perspective view, and FIG. 4 is an enlarged sectional view taken along line IV--IV in FIG. 3.
この第３図ないし第４図において、シールド容器２０と
これに収容されているプリント配線基板１０に共通して
穿けた孔に、ワッシャ３１を介してねじ３２が挿通され
ている。このねじ３２の先端部３２Ａはスペーサ機能を
もつ筒型で導電性のガイド３３を貫いて、プリント配線
基板ユニット１０と並設された導電性の金属板３４のね
し孔にねじ込まれている。これにより、ガイド３３上に
前記プリント配線基板ユニット１０が支持された状態に
おかれると共に、シールド容器２０の導電膜２１と金属
板３４とが、導通状態におかれて同電位になっている。In FIGS. 3 and 4, a screw 32 is inserted through a washer 31 into a hole commonly drilled in the shield container 20 and the printed wiring board 10 housed therein. The tip 32A of this screw 32 passes through a cylindrical conductive guide 33 having a spacer function and is screwed into a screw hole in a conductive metal plate 34 arranged in parallel with the printed wiring board unit 10. As a result, the printed wiring board unit 10 is placed in a supported state on the guide 33, and the conductive film 21 of the shield container 20 and the metal plate 34 are placed in a conductive state and have the same potential.
なお、以上の実施例のほか、シールド容器２０を複数重
ねて使用することや、一つのシールド容器２０中に一つ
のプリント配線基板ユニッ目Ｏの収納ではなく、複数の
プリント配線基板ユニット１０を収納して使用すること
もでき、さらには−枚のプリント配線基板ユニット１０
を一つのシールド容器２０中に収納し、これを複数個重
ねて回路装置を構成することもできる。In addition to the above embodiments, it is also possible to use a plurality of shield containers 20 in a stacked manner, or to store a plurality of printed wiring board units 10 in one shield container 20 instead of storing one printed wiring board unit O. It can also be used as a printed wiring board unit 10.
A circuit device can also be constructed by storing a plurality of shield containers 20 in one shield container 20 and stacking a plurality of the shield containers.
このように第１の実施例によれば、各電子素子から発生
する輻射ノイズ信号はシールド容器２０により封じ込め
られると共に、漏洩する輻射ノイズ信号は導電膜２１に
より著しく減衰させられて外部の回路素子に影響を与え
ることがなく、また、第２の実施例によれば、プリント
配線基板ユニット１０ならびに、シールド容器２０の外
側と金属板３４とが電気的に接続されて、両者が同電位
に保持されているので、インピーダンスが低いシールド
が可能となり、輻射ノイズは一層低減される。As described above, according to the first embodiment, the radiation noise signal generated from each electronic element is contained by the shield container 20, and the leaking radiation noise signal is significantly attenuated by the conductive film 21 and transmitted to external circuit elements. According to the second embodiment, the printed wiring board unit 10 and the outside of the shield container 20 are electrically connected to the metal plate 34, and both are held at the same potential. This enables shielding with low impedance, further reducing radiated noise.
以上のように、本発明によると、回路素子を搭載したプ
リント配線基板ユニットを、内側が絶縁膜であり外側が
導電膜で層設されたフレキシブルなシールド容器中に収
容する構成としたから、プリント配線基板ユニットから
放射される輻射ノイズ信号はシールド容器内に封じ込め
られると共に、漏洩するノイズ信号は導電膜で減衰され
て外部に影響を与えることがきわめて少なくなり、シー
ルド容器が薄い膜状であるので回路素子に密着させるこ
とができ、これにより全体を薄形に形成することができ
るという従来にない優れた電子機器用回路装置を提供す
ることができる。As described above, according to the present invention, a printed wiring board unit equipped with circuit elements is housed in a flexible shield container layered with an insulating film on the inside and a conductive film on the outside. The radiated noise signal emitted from the wiring board unit is contained within the shield container, and the leaked noise signal is attenuated by the conductive film and has very little influence on the outside.Since the shield container is a thin film, It is possible to provide a circuit device for an electronic device that is unprecedented and excellent in that it can be brought into close contact with a circuit element, and thereby the entire device can be formed in a thin shape.
第１図は本発明の第１実施例を示す一部破断した斜視図
、第２図は同じく第１図における回路素子の一部を含む
拡大部分断面図、第３図は第２実施例を示す一部破断し
た断面図、第４図は同じく第３図の一部の側断面図であ
る・。
１０・・・プリント配線基板ユニット、１１・・・回路
素子、１２・・・プリント配線基板、１３・・・装置外
部信号接続ケーブル、１４・・・装置内信号接続ケーブ
ル、２０・・・シールド容器、２０Ａ・・・開口部、２
１・・・導電膜、２２・・・絶縁膜。FIG. 1 is a partially broken perspective view showing a first embodiment of the present invention, FIG. 2 is an enlarged partial cross-sectional view including a part of the circuit element in FIG. 1, and FIG. 3 is a partially broken perspective view showing the second embodiment. The partially broken sectional view shown in FIG. 4 is also a side sectional view of a part of FIG. 3. DESCRIPTION OF SYMBOLS 10... Printed wiring board unit, 11... Circuit element, 12... Printed wiring board, 13... Device external signal connection cable, 14... Device internal signal connection cable, 20... Shield container , 20A... opening, 2
1... Conductive film, 22... Insulating film.
Claims (2)
板全体を収納するシールド用袋容器とを備え、 前記シールド用袋容器を、外側に導電体を配するととも
に内側に絶縁体を配して成る柔軟構造体により形成した
ことを特徴とする電子機器用回路装置。(1). The present invention comprises a circuit board equipped with circuit elements and a shielding bag container for housing the entire circuit board, and the shielding bag container is made of a flexible material having a conductor on the outside and an insulator on the inside. A circuit device for electronic equipment, characterized in that it is formed of a structure.
板全体を収納するシールド用袋容器とを備え、 前記シールド用袋容器を、外側に導電体を配するととも
に内側に絶縁体を配して成る柔軟構造体により形成し、 前記シールド用袋容器を備えた回路基板の所定箇所を、
導電性部材から成るスペーサを介して金属板に固定した
ことを特徴とする電子機器用回路装置。(2). The present invention comprises a circuit board equipped with circuit elements and a shielding bag container for housing the entire circuit board, and the shielding bag container is made of a flexible material having a conductor on the outside and an insulator on the inside. A predetermined portion of the circuit board formed of a structure and provided with the shielding bag container,
A circuit device for electronic equipment, characterized in that it is fixed to a metal plate via a spacer made of a conductive member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7727690A JPH03276799A (en) | 1990-03-27 | 1990-03-27 | Circuit device for electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7727690A JPH03276799A (en) | 1990-03-27 | 1990-03-27 | Circuit device for electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03276799A true JPH03276799A (en) | 1991-12-06 |
Family
ID=13629340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7727690A Pending JPH03276799A (en) | 1990-03-27 | 1990-03-27 | Circuit device for electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03276799A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5319522A (en) * | 1992-12-17 | 1994-06-07 | Ford Motor Company | Encapsulated product and method of manufacture |
| US5394304A (en) * | 1992-10-06 | 1995-02-28 | Williams International Corporation | Shielded self-molding package for an electronic component |
| US5436803A (en) * | 1993-12-16 | 1995-07-25 | Schlegel Corporation | Emi shielding having flexible conductive envelope |
| US5519585A (en) * | 1993-04-12 | 1996-05-21 | Dell Usa, L.P. | Sandwiched insulative/conductive layer EMI shield structure for printed circuit board |
| US5597979A (en) * | 1995-05-12 | 1997-01-28 | Schlegel Corporation | EMI shielding having flexible condustive sheet and I/O Gasket |
| JP2010165867A (en) * | 2009-01-15 | 2010-07-29 | Denso Corp | Board surrounding device |
-
1990
- 1990-03-27 JP JP7727690A patent/JPH03276799A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5394304A (en) * | 1992-10-06 | 1995-02-28 | Williams International Corporation | Shielded self-molding package for an electronic component |
| US5319522A (en) * | 1992-12-17 | 1994-06-07 | Ford Motor Company | Encapsulated product and method of manufacture |
| US5519585A (en) * | 1993-04-12 | 1996-05-21 | Dell Usa, L.P. | Sandwiched insulative/conductive layer EMI shield structure for printed circuit board |
| US5436803A (en) * | 1993-12-16 | 1995-07-25 | Schlegel Corporation | Emi shielding having flexible conductive envelope |
| US5597979A (en) * | 1995-05-12 | 1997-01-28 | Schlegel Corporation | EMI shielding having flexible condustive sheet and I/O Gasket |
| JP2010165867A (en) * | 2009-01-15 | 2010-07-29 | Denso Corp | Board surrounding device |
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