JPH03275576A - Method for removing adhesive for ceramics plate - Google Patents
Method for removing adhesive for ceramics plateInfo
- Publication number
- JPH03275576A JPH03275576A JP7568590A JP7568590A JPH03275576A JP H03275576 A JPH03275576 A JP H03275576A JP 7568590 A JP7568590 A JP 7568590A JP 7568590 A JP7568590 A JP 7568590A JP H03275576 A JPH03275576 A JP H03275576A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- base plate
- plate
- adhesives
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 53
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 53
- 239000000919 ceramic Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000007787 solid Substances 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 13
- 239000012530 fluid Substances 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 3
- 239000002202 Polyethylene glycol Substances 0.000 abstract description 2
- 229920001223 polyethylene glycol Polymers 0.000 abstract description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000010730 cutting oil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000003949 liquefied natural gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
- B08B7/0092—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by cooling
Landscapes
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Ceramic Products (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
セラ５ツクス板の砥石切断、より詳しくは、砥石切断の
際にセラミック板をベース板に接着する接着剤のはみ出
し部分を除去する方法に関し、セラミックス板接着時に
はみ出した接着剤を簡単にかつ確実に除去する方法を提
供することを目的とし、
ベース板の上に切断予定のセラミックス板を、常温にて
固体状態であって５０〜１５０℃にて液化する接着剤で
もって接着させて、前記ベース板と前記セラミックス板
との間からはみ出した前記接着剤を除去する方法におい
て、はみ出して固化した前記接着剤に液化ガスを懸けて
剥離するように構成する。[Detailed Description of the Invention] [Summary] This invention relates to grindstone cutting of ceramic plates, more specifically, to a method for removing protruding portions of adhesive used to bond ceramic plates to base plates during grindstone cutting. The aim is to provide a method for easily and reliably removing the protruding adhesive.The ceramic plate to be cut is placed on the base plate using an adhesive that is solid at room temperature and liquefies at 50 to 150°C. In the method of removing the adhesive that protrudes from between the base plate and the ceramic plate by adhering the base plate and the ceramic plate, the adhesive is peeled off by applying liquefied gas to the adhesive that has protruded and solidified.
本発明は、セラミックス板の砥石切断、より詳しくは、
砥石切断の際にセラミック板をベース板に接着する接着
剤のはみ出し部分を除去する方法に関する。The present invention relates to grindstone cutting of ceramic plates, more specifically,
The present invention relates to a method for removing the protruding portion of adhesive used to bond a ceramic plate to a base plate during cutting with a grindstone.
セラミックス板は各種用途に、例えば、集積回路の基板
に採用されており、焼成後に所定寸法に切断されること
が多い。Ceramic plates are used for various purposes, for example, as substrates for integrated circuits, and are often cut into predetermined dimensions after firing.
セラミックス板は硬脆材料であり、回転砥石によって水
溶性切削油をかけながら切断する際には、セラ５ツタ板
の裏面の切断箇所に欠けが発生し易い、そのような欠け
を防止するために、切断するセラミックス板をベース板
（例えば、ガラス板）にイエローワックス（８化精工■
の商品名）のような接着剤で接着しておいて、セラミッ
クス板の切断と同時にその下のベース板の一部を切削す
る。Ceramic plates are hard and brittle materials, and when cutting them with a rotary whetstone while applying water-soluble cutting oil, chips tend to occur at the cut point on the back of the Ceramic board.To prevent such chips, , place the ceramic plate to be cut on the base plate (e.g. glass plate) with yellow wax (8 Kaseiko ■).
(trade name), and at the same time as cutting the ceramic plate, cut a part of the base plate underneath.
接着するためには、第２Ａ図に示すように、接着剤ｌを
加熱して液状にして、ベース板２の上に注ぐ。接着剤１
が固化しないうちに、セラミックス板３をその上に載せ
、押し付けて、第２Ｂ図のように、空冷（自然に冷却）
して接着剤が固化してセラミックス板３をベース板２に
接着する。For bonding, the adhesive l is heated to a liquid state and poured onto the base plate 2, as shown in FIG. 2A. Adhesive 1
Before it solidifies, place the ceramic plate 3 on top of it, press it down, and let it air cool (naturally cool) as shown in Figure 2B.
The adhesive is then solidified and the ceramic plate 3 is bonded to the base plate 2.
接着剤としては、ｔＩＲ蝋を主成分とした上述のイエロ
ーワックスが最適であるが、常温にて固体状態であり、
５０−１５０℃にて流動化しかつ溶剤に可溶である接着
剤（例えば、蝋ワックス、ポリエチレングリコールなど
）であれば良い。As an adhesive, the above-mentioned yellow wax, which is mainly composed of tIR wax, is most suitable, but it is in a solid state at room temperature,
Any adhesive that is fluidized at 50-150°C and soluble in a solvent (for example, wax, polyethylene glycol, etc.) may be used.
第２Ｂ図に示すように接着すると、セラミックス板３の
押し付けによって接着剤１がセラミックス板３の周囲に
はみ出して固化する。このはみ出した接着剤１は回転砥
石切断の開始時および終了時に砥石の目すまりを招く。When bonded as shown in FIG. 2B, the adhesive 1 protrudes around the ceramic plate 3 due to the pressing of the ceramic plate 3 and hardens. This protruding adhesive 1 causes the grindstone to become clogged at the beginning and end of cutting with the rotary grindstone.
そこで、はみ出した接着剤１をヘラによって削ぎ落とし
、次に、トリエタン等の溶剤で残りを拭き取るといった
手間のかかる作業を必要としている。さらに、削ぎ落と
しの際にセラミックス板３に余計な力が掛かると、セラ
ミックス板が剥がれてしまうことがある。Therefore, it is necessary to scrape off the protruding adhesive 1 with a spatula, and then wipe off the remaining portion with a solvent such as triethane, which is a time-consuming process. Furthermore, if extra force is applied to the ceramic plate 3 during scraping, the ceramic plate may peel off.
本発明の目的は、セラミックス板接着時にはみ出した接
着剤を簡単にかつ確実に除去する方法を提供することで
ある。An object of the present invention is to provide a method for simply and reliably removing adhesive that protrudes when bonding ceramic plates.
上述の目的が、ベース板の上に切断予定のセラミックス
板を、常温にて固体状態であって５０〜１５０℃にて液
化する接着剤でもって接着させて、ベース板と前記セラ
ミックス板との間からはみ出した接着剤を除去する方法
において、はみ出して固化した接着剤に液化ガスを懸け
て剥離することを特徴とするセラごツクス板用接着剤の
除去方法によって達成される。The above purpose is to bond a ceramic plate to be cut onto a base plate with an adhesive that is solid at room temperature and liquefies at 50 to 150°C, and to create a bond between the base plate and the ceramic plate. This is accomplished by a method for removing adhesive for ceramic boards, which is characterized by applying liquefied gas to the adhesive that has protruded and solidified to remove it.
液化ガスとしては、液体窒素が好ましく、液体酸素、液
体水素、液体ヘリウム、液化天然ガスなどの使用も考え
られるが、安全性、取扱性およびコストの点で液体窒素
よりも劣る。As the liquefied gas, liquid nitrogen is preferable, and liquid oxygen, liquid hydrogen, liquid helium, liquefied natural gas, etc. may also be used, but they are inferior to liquid nitrogen in terms of safety, ease of handling, and cost.
（作用〕
液化ガスはその温度が非常に低く、例えば、液体窒素の
液化温度（沸点）は−１９６℃（７７Ｋ）であり、これ
をはみ出して固化した接着剤に注ぐと、接着剤は急激に
冷やされて収縮し、自然と剥がれ落ちる。(Function) The temperature of liquefied gas is very low. For example, the liquefaction temperature (boiling point) of liquid nitrogen is -196°C (77K), and when it spills out and is poured onto the solidified adhesive, the adhesive rapidly melts. It cools, shrinks, and falls off naturally.
以下、添付図面を参照して、本発明の実施態様例によっ
て本発明の詳細な説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail by way of embodiments with reference to the accompanying drawings.
所定寸法に切断するセラ〔ツクス板（例えば、半導体素
子搭載用の多層回路セラミック基板）３、該セラミック
板３よりも大きいガラスのベース板ｌおよび接着剤（イ
エローワックス）２を従来通りに用意する。第２図に示
すように、５０〜１５０℃に加熱して液状にした接着剤
２を容器４からベース板ｌの上に垂らす、接着剤２が流
動状態にあるうちに、セラミックス板３を、第３図に示
すように、ベース板１の上に載せ、押し付けて接着剤２
がはみ出すようにする。この状態で放置すれば、接着剤
２が冷却されて固化し、セラミックス板３をベース板１
に接着する。接着剤２の接着層厚さは数十マイクロメー
トルであり、セラミックス板３の周囲に固化したはみ出
し接着剤２が存在する。A ceramic board (for example, a multilayer circuit ceramic board for mounting semiconductor elements) 3 to be cut into predetermined dimensions, a glass base plate 1 larger than the ceramic board 3, and an adhesive (yellow wax) 2 are prepared in the conventional manner. . As shown in FIG. 2, the adhesive 2 that has been liquefied by heating to 50 to 150°C is dripped onto the base plate l from the container 4. While the adhesive 2 is in a fluid state, the ceramic plate 3 is As shown in Fig. 3, place it on the base plate 1 and press it with adhesive 2.
Make sure that it sticks out. If left in this state, the adhesive 2 will cool and solidify, and the ceramic plate 3 will be attached to the base plate 1.
Glue to. The thickness of the adhesive layer of the adhesive 2 is several tens of micrometers, and the solidified adhesive 2 is present around the ceramic plate 3.
次に、本発明に従って、第３図に示すように、はみ出し
た接着剤２に液体窒素（液化ガス）５を容器６から懸け
る。すると、接着剤２は急冷されて収縮し、小片７とな
って自然と剥がれ落ちる。Next, according to the present invention, as shown in FIG. 3, liquid nitrogen (liquefied gas) 5 is poured from a container 6 onto the overflowing adhesive 2. Then, the adhesive 2 is rapidly cooled and contracts, forming small pieces 7 and peeling off naturally.
全てのはみ出し接着剤２に液体窒素５を振り懸けて剥が
し落としてから、圧縮空気をベース板ｌに吹き付け、ベ
ース板ｌ上に残っている接着剤小片を完全に吹き飛ばす
。After sprinkling liquid nitrogen 5 on all the protruding adhesive 2 and peeling it off, compressed air is blown onto the base plate 1 to completely blow away the small pieces of adhesive remaining on the base plate 1.
上述の説明では、容器４および６を用いたが、必要な量
および位置に接着剤および液体窒素に正確に滴下するよ
うに適切な滴下装置を使用するのが望ましい。Although the above description uses containers 4 and 6, it is desirable to use a suitable dripping device to drip the adhesive and liquid nitrogen precisely in the required amount and location.
（発明の効果）
上述したように、本発明によれば、余計なはみ出し接着
剤の除去が液化ガスの滴下（注ぎ）で簡単にかつ容易に
出来る。(Effects of the Invention) As described above, according to the present invention, unnecessary protruding adhesive can be easily removed by dropping (pouring) liquefied gas.
第１図は、本発明の除去方法を説明するセラミックス板
を接着したベース板の斜視図であり、第２図は、ベース
板に接着剤を注いでいる状態を示す斜視図であり、
第３図は、セラミックス板をベース板に接着した状態を
示す斜視図である。
１・・・ベース板 ２・・・接着剤３・・・セラ
ミックス板 ５・・・液体窒素７・・・接着剤小片1 is a perspective view of a base plate to which a ceramic plate is bonded to explain the removal method of the present invention; FIG. 2 is a perspective view showing a state in which adhesive is poured onto the base plate; The figure is a perspective view showing a state in which a ceramic plate is adhered to a base plate. 1... Base plate 2... Adhesive 3... Ceramic board 5... Liquid nitrogen 7... Adhesive small piece
Claims (1)
３）を、常温にて固体状態であって５０〜１５０℃にて
液化する接着剤（２）でもって接着させて、前記ベース
板と前記セラミックス板との間からはみ出した前記接着
剤を除去する方法において、はみ出して固化した前記接
着剤（２）に液化ガス（５）を懸けて剥離することを特
徴とするセラミックス板用接着剤の除去方法。1. Place the ceramic plate to be cut on the base plate (1) (
3) is adhered with adhesive (2) that is solid at room temperature and liquefies at 50 to 150°C, and the adhesive protruding from between the base plate and the ceramic plate is removed. A method for removing an adhesive for a ceramic plate, characterized in that a liquefied gas (5) is applied to the adhesive (2) that has protruded and solidified to remove the adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7568590A JPH03275576A (en) | 1990-03-27 | 1990-03-27 | Method for removing adhesive for ceramics plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7568590A JPH03275576A (en) | 1990-03-27 | 1990-03-27 | Method for removing adhesive for ceramics plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03275576A true JPH03275576A (en) | 1991-12-06 |
Family
ID=13583296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7568590A Pending JPH03275576A (en) | 1990-03-27 | 1990-03-27 | Method for removing adhesive for ceramics plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03275576A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5563190A (en) * | 1994-08-04 | 1996-10-08 | Sumitomo Bakelite Company Limited | Phenolic resin molding material |
-
1990
- 1990-03-27 JP JP7568590A patent/JPH03275576A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5563190A (en) * | 1994-08-04 | 1996-10-08 | Sumitomo Bakelite Company Limited | Phenolic resin molding material |
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