JPH08162798A - Electronic part, its mounting method and mounter htereof - Google Patents

Abstract

PURPOSE: To provide an electronic part, its mounting method and a mounter thereof, by which the electronic part difficult to be mounted onto a substrate by an automatic mounter is mounted efficiently onto the substrate by a suitable means. CONSTITUTION: A sucking surface 21 is formed in a shape that the irregularities of the sucking surface 21 are buried by using a material having high sublimating properties, a sucking section 20 is vaporized after the mounting of a part, the sucking section 20 is formed of a previously cooled and solidified substance, the sucking section 20 is conserved at a low temperature before the mounting of the part, and a substrate, on which the part is mounted completely, is exposed to a low-pressure atmosphere and the vaporization of the sucking section 20 is promoted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounted on a board by an automatic mounting machine, a mounting method for the electronic component, and a mounting apparatus.

[0002]

2. Description of the Related Art In recent years, automatic mounting of electronic parts on a substrate has been advanced, and automatic mounting by a chip mounter has been widely performed.

A general mounting line of components on a board will be described below with reference to the drawings.

FIG. 4 is a flowchart showing a mounting procedure of a conventional electronic component. In FIG. 4, 1 is a solder coating process, 2 is a component mounting process, and 3 is a reflow process.

Further, FIG. 5 is a schematic view showing a state of a solder coating step 1 of a conventional example. In FIG. 5, 4 is a metal mask, 5 is a hole formed in the metal mask 4, 6 is a squeegee [skid dy], 7 is cream solder, 8 is a substrate, 9 is a substrate 8
It is the cream solder applied on top.

Further, FIG. 6 is a schematic diagram showing the state of the conventional component mounting step 2 [see FIG. 4].

In FIG. 6, 10 is an electronic component, and 11 is a taping reel [tapi] in which the electronic component 10 is wound in a tape shape.
ng reel] and 12 are nozzles for adsorbing and moving electronic components.

The substrate 8 is first solder-applied step 1 [see FIG. 5].
The paste-like solder called the cream solder 7 is applied to a predetermined position on the substrate 8. That is, the cream solder 9 is applied to the position where the component is mounted on the substrate 8 in the subsequent component mounting step 2 according to the terminal shape of the component. At this time, it is general to use a thin metal plate called a metal mask 4 in which holes 5 are formed at solder application positions and a spatula called a squeegee 6.

According to the drawings, the cream solder 7 is stored at one end of the metal mask 4 in which the holes 5 are formed in FIG. 5A, the squeegee 6 is applied to the cream solder 7, and the substrate 8 is separated. ) To bring the substrate 8 into contact with the metal mask 4,
In FIG. 5C, the squeegee 6 is slid from the left end to the right end, the cream solder 7 is filled in the hole 5, the cream solder 9 remains in the hole 5, and the cream solder 9 is determined in FIG. 5D. The substrate 8 applied at the different positions is separated from the metal mask 4 for mounting electronic components.

Next, the substrate 8 is sent to the component mounting step 2 [see FIG. 6]. In this component mounting step 2, an automatic mounter called a chip mounter is used. Also generally,
The surface mount component is supplied in a packaging form such as a taping reel 11 or a tube [not shown]. In this state, the component is set in the mounting machine, is in a mounting standby state, is taken out from here, and is mounted in a predetermined position on the substrate 8.

Here, a method for taking out the parts in the mounting standby state from the package [FIG. 6 (a)] and carrying them onto the substrate 8 will be described. The nozzle 12 of the mounting machine sucks the electronic component 10 from the taping reel 11 [FIG. 6 (b)], and places the electronic component 10 at a pre-programmed position on the substrate 8 coated with the cream solder 9 [FIG. 6 (c), (d)]. Here, the substrate 8 and the electronic component 10 are not completely fixed, but due to the viscosity of the cream solder 9, the electronic component 10 has a bonding force to the extent that the electronic component 10 does not drop off from the substrate 8 during the transportation to the next reflow step 3. ing.

Finally, the substrate 8 on which the electronic component 10 is mounted
Goes to a reflow process 3 and is put into a high temperature furnace called a reflow furnace [not shown]. In this reflow furnace, the cream solder 9 is melted by infrared rays or temperature to bond the substrate 8 and the electronic component 10. Generally 200-250 ° C
Can be heated at peak temperatures of the order of magnitude.

In addition, if necessary, a bonding [bo] for temporarily fixing the electronic component 10 mounted in the component mounting step 2 so as not to drop off from the substrate 8 before the reflow step 3.
[nding] step, a check step of inspecting whether the electronic component 10 is mounted reliably, and the like are added.

The work in these steps and the transfer of the substrate 8 between the steps are automatically performed to enable efficient production.

The above-mentioned technology is called surface mounting technology, and the number of surface mounting parts corresponding to this is increasing. By using the surface mounting technique, there are advantages such as a reduction in the size of the board due to an increase in the density of parts mounted, and an improvement in productivity due to the speeding up of parts mounting.

Next, details of component suction in the component mounting step 2 will be described. FIG. 7 is a perspective view showing a state of suctioning a nozzle of a conventional electronic component.

In FIG. 7, 13 is the suction surface of the electronic component 10, 12 is the nozzle of the mounting machine, and 14 is the suction port provided at the tip of the nozzle 12. Component mounting process 2 [See Fig. 5]
Then, the nozzle 12 picks up the electronic component 10 in the mounting standby state and carries it to a predetermined mounting position on the substrate 8. Electronic component 10
When picking up, the nozzle 12 sucks air from the suction port 14 and sucks the electronic component 10 by this negative pressure. After the electronic component 10 is sucked and moved to a predetermined position on the substrate 8, the negative pressure is reduced when the nozzle 12 stops sucking intake air, and the suction force is reduced accordingly. Therefore, the electronic component 10 is placed on the substrate 8 apart from the suction port 14 by its own weight.

In practice, since the electronic components 10 mounted on the substrate 8 have various sizes and shapes, several types of nozzles 1 are used.
The electronic component 10 is mounted while properly using two.

If there is a gap between the suction port 14 and the suction surface 13, a sufficient suction force cannot be obtained.
Is required to be smooth and have an area larger than at least the suction port 14. Further, when the suction point is separated from the center of gravity of the electronic component 10, the balance becomes poor, and the electronic component 10 is likely to fall off when the nozzle 12 moves to the substrate 8. As described above, a large number of shape restrictions occur for adsorption.

However, the shape of the electronic component 10 is limited due to the functions of the connector, jack, switch, light emitting element and the like, and it is difficult to provide the suction surface 13 having a smooth and sufficient area at an appropriate position. There are also things. Such an electronic component 10 is called a deformed component, and a conventional method for mounting the deformed component on the substrate 8 will be described below.

Here, as an example, a method of mounting a component having a concave portion on the top surface will be described with reference to the perspective view of FIG.

In FIG. 8, reference numeral 15 is a deformed part, 16 is a top surface of the deformed part 15, 17 is a recess provided in the top surface 16,
Reference numeral 18 is a suction cover, and 19 is a suction surface of the suction cover 18. The difference in sucking the odd-shaped component 15 is that the odd-shaped component 15 alone does not have good contact with the suction port 14 because the recess 17 exists on the top surface 16, and the suction force is insufficient. Therefore, the suction cover 18 is engaged with the odd-shaped component 15 in advance, and the top surface 1
6 is provided with a suction surface 19. Since the suction surface 19 is smooth and has a sufficient area, it is possible to maintain good contact with the suction port 14 and thereby suction the deformed component 15. Alternatively, a similar effect can be obtained even if the suction surface is provided by a method such as attaching an adhesive tape to the top surface 16.

As another method, there is also used a method of sucking the odd-shaped component 15 by using a special nozzle having a suction port 14 formed in a shape along the concave portion 17 of the odd-shaped component 15 [hereinafter, these will be described. Collectively referred to as "conventional example"].

[0024]

However, the above-mentioned conventional means for processing odd-shaped electronic components has a problem that the suction cover must be removed after reflow. The same applies to the method using the suction tape. Further, in the method of using the special nozzle, it is necessary to create an individual nozzle for each of different types of odd-shaped parts. Further, since there is a limit to the number of nozzles that can be installed in the mounting machine, there is a problem in that the types of odd-shaped parts that can be mounted are limited. SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems of the conventional example, and to provide an electronic component that does not require removal of a suction cover or the like in a later step even if it is a deformed component, a mounting method and a mounting apparatus therefor. .

[0025]

In order to achieve this object, the present invention provides an electronic component with a suction portion which is vaporized after the component is mounted. That is, it is an electronic component including a suction portion that vaporizes after the component mounting process. Further, it is preferable that the adsorption part is an electronic component formed of a substance having a sublimation property at room temperature. More preferably, the adsorption portion for adsorbing the component by the automatic mounter is formed of a cooled and solidified material, and the adsorption portion is an electronic component that is naturalized after the component mounting process. Furthermore, preferably, a suction part is formed in the electronic component, and the suction part is a mounting method of the electronic component in which the electronic component is vaporized after being mounted on the substrate. And preferably, the electronic parts are formed by cooling and solidifying the suction parts for automatic mounting on the electronic parts, the electronic parts are cooled to the parts mounting process, and the suction parts are vaporized after the parts mounting process. is there. Also, preferably, a suction unit for an automatic mounting machine is used for mounting an electronic component formed by cooling and solidifying on a substrate, and an electronic component mounting apparatus provided with a component storage device for cooling and storing the electronic component. Is. It is desirable to mount the electronic component in which the suction portion is vaporized after the component mounting process, and to mount the electronic component in which the substrate, which has finished the component mounting process, is exposed to a low-pressure atmosphere to promote vaporization of the suction portion. . It is also preferable that the device is used for mounting on a substrate an electronic component having a suction portion that vaporizes after the component mounting process, and exposes the substrate after the component mounting process to a low pressure atmosphere to promote vaporization of the suction portion. It is an electronic component mounting apparatus provided with.

[0026]

With the above-described structure, the present invention makes it possible to adsorb the adsorption portion formed in an appropriate shape in the component mounting step, and vaporize the adsorption portion in the subsequent reflow step, so that the adsorption portion removal step can be omitted.

[0027]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing how electronic components are mounted on a substrate according to the first embodiment of the present invention.

In FIG. 1, reference numeral 20 denotes a suction portion formed so as to fill the concave portion 17 of the top surface 16 of the odd-shaped component 15, and reference numeral 21 denotes a suction surface on the top surface of the suction portion 20.

In this embodiment, the adsorbing portion 20 is made of a substance such as naphthalene which has a significantly high sublimation property. Sublimation is a phenomenon that is noticeable in simple molecular crystals such as naphthalene, camphor, and solid carbon dioxide. For example, although naphthalene has a melting point of 80 ° C. and a boiling point of 218 ° C., it transforms directly from solid to gas even at room temperature.

In the component mounting step 2, the suction section 20 is previously prepared.
When the electronic odd-shaped component 15 that has been formed and is hermetically stored by a taping reel or the like is mounted, the nozzle 12 sucks the suction surface 21 of the suction unit 20. The suction surface 21 is formed in a suitable position in a smooth and sufficient area to maintain good contact with the suction port 14. Since the degree of freedom of formation is high, it is possible to easily form the suction portion 20 having a smooth and sufficient area at an appropriate position.

Next, the substrate 8 on which the components are mounted is sent to the reflow process 3 and heated, and the sublimation phenomenon of the adsorption part 20 becomes very active due to the temperature rise at this time. Further, not only the sublimation phenomenon but also the vaporization phenomenon progresses. For example, when the adsorption part 20 is formed of naphthalene, the sublimation phenomenon becomes active as the melting point approaches 80 ° C. from room temperature, and the adsorption part 20 melts at the melting point of 80 ° C.
The adsorption part 20 vaporizes at 18 ° C.

As described above, in the reflow step 3, the suction portion 2
Since 0 sublimes or vaporizes, the step for removing the adsorption portion 20 which is necessary in the conventional example can be omitted. In addition, parts can be mounted without changing existing equipment. Here, it is necessary to set the temperature condition of the reflow process 3 so that the adsorption unit 20 is completely vaporized. However, even if the adsorption unit 20 is not completely vaporized, the adsorption unit 20 sublimes at room temperature. It is not necessary to remove the remaining suction section 20.

Although it has been described here that the adsorbing portion 20 is formed of a substance having a high sublimation property, the adsorbing portion 20 is formed by using a substance that is vaporized at a temperature equal to or lower than the reflow temperature, and the adsorbing portion 20 is formed under an appropriate temperature condition. Even if the reflow is performed, the adsorbing portion 20 is vaporized, so that substantially the same effect can be obtained.

Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 2 is a flow chart showing a mounting procedure of electronic components in the second embodiment of the present invention.

In FIG. 2, reference numeral 22 is a component storing process. The method of forming the adsorbing portion 20 is the same as that of the first embodiment, but in this embodiment, the adsorbing portion 20 is formed of a substance that is a gas at room temperature. For example, carbon dioxide is known as such a substance. Carbon dioxide-57
It is solid below ° C and is called dry ice, but it becomes a gas at room temperature.

The odd-shaped component 15 is in the component storing step 22 until just before it is mounted on the substrate 8. In the component storing step 22, the odd-shaped component 15 is stored at a low temperature, and the amount of sublimation and vaporization of the adsorption unit 20 is suppressed to be low.

When the odd-shaped component 15 is mounted on the substrate 8, sublimation and vaporization of the adsorption portion 20 become active. Further, the substrate 8
Is sent to the reflow step 3 and heated, the adsorption section 20 extremely sublimates and vaporizes.

According to the above method, the sublimation and vaporization of the adsorption part 20 can be performed faster and more reliably than in the first embodiment. Since sublimation and vaporization are performed at high speed, the process time is shortened, which contributes to the improvement in the productivity of board mounting.

Further, a third embodiment of the present invention will be described using the process procedure of FIG. FIG. 3 shows the third aspect of the present invention.
5 is a flowchart showing a mounting procedure of electronic components in the embodiment of FIG.

In FIG. 3, reference numeral 23 is a vaporization promoting step provided in the reflow step 3 and exposing the substrate 8 to a low pressure atmosphere. The procedure until the substrate 8 finishes the reflow is the same as in the conventional example and the first and second embodiments. In this embodiment, the substrate 8 that has completed the reflow process 3 is sent to the vaporization promoting process 23. In the vaporization promoting step 23, the substrate 8 is exposed to a low pressure atmosphere.

In the low-pressure atmosphere, sublimation and vaporization of the adsorption section 20 actively proceed, and the adsorption section 20 is removed at high speed. In addition, the above method does not require complicated control and thus can be easily incorporated into an automation line.

Further, since the adsorbing portion 20 is removed at a high speed, the same effect can be obtained even if the reflow step 3 is performed in a low pressure atmosphere.

As described above, according to the present invention, a suction surface having a smooth and sufficient area can be formed at an appropriate position of an odd-shaped electronic component, and the suction portion can be easily removed after mounting on a substrate. .

[0045]

EFFECTS OF THE INVENTION As is clear from the above description, according to the present invention, since the suction surface having a smooth and sufficient area is formed at an appropriate position, it is suitable for the component mounting itself to be sucked, and it is possible to attach it to the substrate. Since the suction portion can be easily removed after mounting, it is possible to provide a special effect that it is possible to provide an electronic component that greatly contributes to productivity improvement.

[Brief description of drawings]

FIG. 1 is a perspective view showing how an electronic component is mounted on a substrate according to a first embodiment of the present invention.

FIG. 2 is a flowchart showing a mounting procedure of electronic components according to a second embodiment of the present invention.

FIG. 3 is a flowchart showing a mounting procedure of electronic components according to a third embodiment of the present invention.

FIG. 4 is a flow chart showing a mounting procedure of a conventional electronic component.

FIG. 5 is a schematic diagram showing a state of a solder application process of a conventional example. (A) is a preparation stage diagram (b) is a cream solder application start state diagram (c) is a cream solder application end state diagram (d) is the next process Transition state diagram

FIG. 6 is a schematic view showing a state of a component mounting process of a conventional example, (a) is a state diagram in which a nozzle is brought into contact with a taping reel, and (b) is a nozzle which sucks an electronic component with a negative pressure and takes it out from the taping reel. State diagram (c) is a state diagram where the nozzle has applied the electronic component to the substrate (d) is a state diagram where the electronic component is mounted on the substrate and the nozzle leaves

FIG. 7 is a perspective view showing a state of suctioning a nozzle of an electronic component of a conventional example.

FIG. 8 is a perspective view showing a state of suctioning a nozzle of an odd-shaped electronic component of a conventional example.

[Explanation of symbols]

 1 Solder Application Process 2 Component Mounting Process 3 Reflow Process 4 Metal Mask 5 Hole 6 Squeegee 7, 9 Cream Solder 8 Substrate 10 Electronic Component 11 Taping Reel 12 Nozzle 13, 19, 21 Adsorption Surface 14 Adsorption Port 15 Deformed Component 16 Top Surface 17 Recess 18 Adsorption cover 20 Adsorption

Claims (8)

[Claims] 1. An electronic component comprising a suction portion that vaporizes after a component mounting step. 2. The electronic component according to claim 1, wherein the adsorption part is formed of a substance having a sublimation property at room temperature. 3. An electronic component, wherein an adsorption portion for adsorbing a component by an automatic mounting machine is formed of a cooled and solidified material, and the adsorption portion is naturalized after a component mounting step. 4. A method of mounting an electronic component, wherein the suction portion is formed on the electronic component, and the suction portion vaporizes after mounting the electronic component on a substrate. 5. The electronic component is formed by cooling and solidifying the suction portion for automatic mounting on a substrate, the electronic component is cooled to a component mounting step, and the suction portion is vaporized after the component mounting step. A method for mounting an electronic component, comprising: 6. A component storage device for cooling and storing the electronic component, wherein the suction portion for an automatic mounting machine is used for mounting the electronic component formed by cooling and solidifying on the substrate. An electronic component mounting device characterized by the above. 7. The mounting of the electronic component, wherein the suction portion is vaporized after the component mounting step, wherein the substrate after the component mounting step is exposed to a low pressure atmosphere to promote vaporization of the suction portion. A method for mounting an electronic component, comprising: 8. The substrate, which is used for mounting the electronic component having the suction portion that is vaporized after the component mounting process on the substrate, and which has been subjected to the component mounting process is exposed to a low-pressure atmosphere to expose the substrate. An electronic component mounting apparatus comprising a device for promoting vaporization of a suction portion.