JPH0327346B2 - - Google Patents
Info
- Publication number
- JPH0327346B2 JPH0327346B2 JP58054004A JP5400483A JPH0327346B2 JP H0327346 B2 JPH0327346 B2 JP H0327346B2 JP 58054004 A JP58054004 A JP 58054004A JP 5400483 A JP5400483 A JP 5400483A JP H0327346 B2 JPH0327346 B2 JP H0327346B2
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- grains
- whetstone
- grinding
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000006061 abrasive grain Substances 0.000 claims description 27
- 239000011224 oxide ceramic Substances 0.000 claims description 7
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 5
- 239000011800 void material Substances 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 239000006260 foam Substances 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000997 High-speed steel Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Description
【発明の詳細な説明】
本発明は、砥粒の他に含泡粒および導電粒を加
え焼結成形して成る砥石に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a whetstone formed by adding foam-containing grains and conductive grains in addition to abrasive grains and sintering them.
従来の砥石は、砥粒として、SiC、Al2O3、
CrC、Dia、cBN、cBNとBNとの共晶体などの
砥粒を、所要の結合材と加圧結合し所定の形状体
に成形したものが提供されてきた。この種従来の
砥石の欠点としては例えば、機械電解研削性の不
良、研磨砥石面の急速劣化、チツプ排除の不良化
などであり、これらに改良を加え、さらに加工速
度を向上させ且つ良好な加工が得られる改良砥石
が求められてきた。 Conventional whetstones use abrasive grains such as SiC, Al 2 O 3 ,
Abrasive grains such as CrC, Dia, cBN, and a eutectic of cBN and BN have been bonded under pressure with a required bonding material and molded into a predetermined shape. The drawbacks of conventional grinding wheels of this type include, for example, poor mechanical electrolytic grindability, rapid deterioration of the grinding wheel surface, and poor chip removal. There has been a need for an improved whetstone that can provide the following.
本発明は、前記の現状にかんがみ、砥石の研削
加工による表面不良化を防ぎ、チツプポケツトを
有し、砥粒と砥粒間との間に導電ができ、電解研
削時に表面研削が容易にでき且つ砥石面の劣化を
防止することができるように、普通の砥粒と含泡
酸化物セラミツクス粒と導電性砥粒とを、適当な
割合で混合しチツプポケツトを有する組成物を結
合することで得られる砥石の提供を目的とする。 In view of the above-mentioned current situation, the present invention prevents surface defects caused by grinding of a whetstone, has a chip pocket, allows conduction between abrasive grains, facilitates surface grinding during electrolytic grinding, and It is obtained by mixing ordinary abrasive grains, foam-containing oxide ceramic grains, and conductive abrasive grains in an appropriate ratio and combining them with a composition having chip pockets so as to prevent deterioration of the grinding wheel surface. The purpose is to provide whetstones.
次に、本発明を一実施例について説明する。第
１図Ａ，Ｂ，Ｃの各図は、本発明に利用する砥粒
の断面モデル図、第２図は結合砥粒の一部拡大断
面側面図である。 Next, one embodiment of the present invention will be described. Each of FIGS. 1A, B, and C is a cross-sectional model diagram of an abrasive grain used in the present invention, and FIG. 2 is a partially enlarged cross-sectional side view of a bonded abrasive grain.
第１図Ａは、SiC、Al2O3、Dia、cBNなどの
前記の普通の砥粒または共晶体砥粒の断面モデル
砥粒Ｂで、第１図Ｂは気泡孔を有する粒子の断面
モデルＣで、第１図Ｃは導電粒の断面モデルＡ
で、この粒ＡはTiN、TiC、B4C等の導電性砥粒
が用いられ、または普通のフリツト、例えばガラ
ス粒またはほうけい酸塩などと、ともに用いるこ
とができ、いずれのときも、所要の比抵抗のもの
を選んで用いる。 Figure 1A is a cross-sectional model abrasive grain B of the above-mentioned ordinary abrasive grains or eutectic abrasive grains such as SiC, Al 2 O 3 , Dia, cBN, etc., and Figure 1B is a cross-sectional model of particles with bubble pores. Figure 1C is a cross-sectional model A of conductive particles.
The grains A can be conductive abrasive grains such as TiN, TiC, B 4 C, etc., or they can be used together with ordinary frits, such as glass grains or borosilicate; in either case, Select and use the one with the required specific resistance.
粒Ｃは、発泡したAl2O3、SiO2、CaO、MgO
等の含泡酸化物セラミツクス粒が用いられ発泡気
孔を適度の空間率をもたせて外孔を内部に形成し
たものを用いる。空間率は、通常は20〜60％のも
のが適当であるが、砥粒の混合割合、加工条件な
どと砥石の使用目的に応じて、任意に選定して用
いる。次に直径200mm砥石の場合を説明する。 Particles C are foamed Al 2 O 3 , SiO 2 , CaO, MgO
A foam-containing oxide ceramic grain such as the above is used, and the foamed pores are provided with an appropriate porosity and outer pores are formed inside. The void ratio is normally appropriate to be 20 to 60%, but it can be arbitrarily selected depending on the mixing ratio of abrasive grains, processing conditions, etc., and the purpose of use of the grindstone. Next, the case of a 200mm diameter grindstone will be explained.
いま、空間率40vol％を有する含泡アルミナ
（Al2O3）粒で直径1.5mmのＣ粒が30vol％と、200
メツシユ形状のcBNが6vol％と、TiNの極細粉
35vol％を含ませたほうけい酸塩の3000メツシユ
のものが16vol％と、残部を成す砥石砥粒である
SiCとB4Cとの共晶体で200メツシユのものとを十
分に混合して第一組成体を形成する。次に、この
第一組成体を焼結して、第２図にその一部切断面
を示す砥石に成形する。このときは、フリツトに
含有させたTiNは砥粒として研削性を有すると
共に導電粒子の役割りをも期待したものである。 Now, C grains with a diameter of 1.5 mm are 30 vol% of foamed alumina (Al 2 O 3 ) grains with a void ratio of 40 vol%, and 200 vol.
6vol% mesh-shaped cBN and ultrafine TiN powder
The 3000 mesh of borosilicate containing 35vol% is 16vol%, and the remainder is the abrasive grains of the whetstone.
A first composition is formed by thoroughly mixing 200 meshes of a eutectic of SiC and B 4 C. Next, this first composition is sintered and formed into a grindstone, a partially cut section of which is shown in FIG. In this case, the TiN contained in the frit is expected to have abrasive properties as an abrasive grain and also to function as a conductive particle.
こうして直径200mm砥石を製造した。この砥石
を、被研削材ハイス材のロツクウエル硬度６４に
対し、2.800rpmで、NaCl3％溶液を用いて6V、
40Aで、電気研削をした。切込み４ミクロン、速
度12ｍ／minで研削加工した。この場合の加工速
度は、在来法で、SiCとB4C共晶体200メツシユの
砥粒だけで製作した砥石の加工速度に対し、2.2
倍に良好に向上した。なお前記のフリツトの比抵
抗は63μΩcmであり、在来のフリツトの比抵抗
108Ωcmに比較してきわめて小で、砥石の導電性
が良好であつた。又導電をオフして機械研削を行
なつたときは従来の銅電鋳砥石に比較して約２倍
の研削速度で砥石磨耗量が1/3以下であつた。 In this way, a grindstone with a diameter of 200 mm was manufactured. This whetstone was heated at 2.800 rpm and 6V using a 3% NaCl solution against a Rockwell hardness of 64 for the material to be ground, high-speed steel.
I did electric grinding with 40A. Grinding was performed at a depth of cut of 4 microns and a speed of 12 m/min. In this case, the machining speed is 2.2% compared to the machining speed of a grinding wheel manufactured using only SiC and B 4 C eutectic 200 mesh abrasive grains using the conventional method.
It has improved twice as much. The resistivity of the above-mentioned frit is 63μΩcm, which is higher than that of conventional frits.
It was extremely small compared to 10 8 Ωcm, and the conductivity of the grindstone was good. Furthermore, when mechanical grinding was performed with the conductivity turned off, the grinding speed was approximately twice that of a conventional copper electroformed grindstone, and the amount of grindstone wear was less than 1/3.
なお導電性砥粒のTiN、TiC、B4C等は約70〜
500μΩcm程度である。 In addition, conductive abrasive grains such as TiN, TiC, B 4 C, etc. are approximately 70~
It is about 500μΩcm.
すでに説明したように、フリツトに導電性の砥
粒を含むものを用いて、砥石砥粒と含泡酸化物セ
ラミツクス粒とを混合した組成物を焼結して得た
本発明の砥石は、砥粒間に導電部分が有効に作用
し得て、また多孔質粒の気孔がチツプポケツトの
役割をし、容易に所要のチツプポケツトを形成す
ることができ、研削加工の場合に、きわめて顕著
に加工速度を向上する。砥石の強度は、含泡酸化
物セラミツクス粒と砥石砥粒の混合割合、含泡酸
化物セラミツクス粒の空間率の所要割合の調整を
して、必要な強度に維持することができる。 As already explained, the grinding wheel of the present invention is obtained by sintering a composition in which grinding wheel abrasive grains and foamed oxide ceramic particles are mixed using a frit containing conductive abrasive grains. The conductive parts can effectively act between the grains, and the pores in the porous grains act as chip pockets, making it easy to form the required chip pockets, which significantly improves the processing speed during grinding. do. The strength of the whetstone can be maintained at the required strength by adjusting the mixing ratio of the foamed oxide ceramic grains and the abrasive grains of the whetstone, and the required ratio of the void ratio of the foamed oxide ceramic grains.
第１図Ａ，Ｂ，Ｃは本発明の一実施例の構成砥
粒などの断面側面モデル図。第２図は焼結した本
発明の砥石の一部拡大断面側面図。
Ａ；導電性砥粒、Ｂ；砥粒、Ｃ；含泡酸化物セ
ラミツクス粒。
1A, B, and C are cross-sectional side model views of constituent abrasive grains, etc. of one embodiment of the present invention. FIG. 2 is a partially enlarged cross-sectional side view of a sintered grindstone of the present invention. A: conductive abrasive grains, B: abrasive grains, C: foamed oxide ceramic grains.
Claims (1)
得る砥石に於て、前記砥石砥粒に、任意に選定し
た所要空間率を有する含泡酸化物セラミツクス粒
の所要量と所定の硬度を有する導電性砥粒とを含
ませて焼結し所定形状に成形してなることを特徴
とする砥粒から成る砥石。1. In a whetstone obtained by mixing fine abrasive grains with frits and sintering the mixture, the abrasive grains of the whetstone are mixed with a required amount of foamed oxide ceramic grains having a desired void ratio and a predetermined hardness. What is claimed is: 1. A whetstone made of abrasive grains, characterized in that it is impregnated with conductive abrasive grains, sintered and formed into a predetermined shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5400483A JPS59182065A (en) | 1983-03-31 | 1983-03-31 | Grind stone made of abrasive grains |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5400483A JPS59182065A (en) | 1983-03-31 | 1983-03-31 | Grind stone made of abrasive grains |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59182065A JPS59182065A (en) | 1984-10-16 |
| JPH0327346B2 true JPH0327346B2 (en) | 1991-04-15 |
Family
ID=12958436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5400483A Granted JPS59182065A (en) | 1983-03-31 | 1983-03-31 | Grind stone made of abrasive grains |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59182065A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108247553B (en) * | 2017-12-30 | 2020-11-17 | 义乌市安航科技有限公司 | Preparation method of wear-resistant artificial oilstone |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3510994A (en) * | 1967-05-18 | 1970-05-12 | Norton Co | Method of manufacturing an electrolytic grinding wheel |
| JPS495719A (en) * | 1972-05-10 | 1974-01-18 | ||
| JPS5413090A (en) * | 1977-06-30 | 1979-01-31 | Mitsui Kensaku Toishi Kk | Special grinding wheel |
-
1983
- 1983-03-31 JP JP5400483A patent/JPS59182065A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3510994A (en) * | 1967-05-18 | 1970-05-12 | Norton Co | Method of manufacturing an electrolytic grinding wheel |
| JPS495719A (en) * | 1972-05-10 | 1974-01-18 | ||
| JPS5413090A (en) * | 1977-06-30 | 1979-01-31 | Mitsui Kensaku Toishi Kk | Special grinding wheel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59182065A (en) | 1984-10-16 |
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