JPH03270289A - Box type electronic circuit module and its manufacture - Google Patents
Box type electronic circuit module and its manufactureInfo
- Publication number
- JPH03270289A JPH03270289A JP7150190A JP7150190A JPH03270289A JP H03270289 A JPH03270289 A JP H03270289A JP 7150190 A JP7150190 A JP 7150190A JP 7150190 A JP7150190 A JP 7150190A JP H03270289 A JPH03270289 A JP H03270289A
- Authority
- JP
- Japan
- Prior art keywords
- box
- wiring pattern
- box body
- circuit module
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 17
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims abstract description 17
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 8
- 239000000057 synthetic resin Substances 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 238000007747 plating Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Casings For Electric Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【発明の詳細な説明】
（ＩＩ要〕
水晶発振器等の箱型の電子回路モジュール及びその製造
方法に関し、
小型化を可能とすることを目的とし、
合成＠ＩＩ製の箱体の内側の面に、液晶ポリマに金属め
っきを施した配線パターンとランドとが埋設されており
、且つ電子部品が上記ランドと接続されて上記内側の面
に実装されて構成する。[Detailed Description of the Invention] (Required II) For the purpose of miniaturizing a box-shaped electronic circuit module such as a crystal oscillator and a method for manufacturing the same, this invention is made on the inner surface of a box made of synthetic@II. A metal-plated wiring pattern and a land are embedded in a liquid crystal polymer, and an electronic component is connected to the land and mounted on the inner surface.
〔産業上の利用分野）
本発明は水晶発振器等の箱型の電子回部モジュール及び
その＠遊方法Ｇ−関する。[Industrial Application Field] The present invention relates to a box-shaped electronic circuit module such as a crystal oscillator, and a method thereof.
近年、電子装置においては、電子部品の高密度実装が進
んでいる。これに伴って、電子装置に組込まれる箱型の
電子回路モジュールについては、小型化が要求されてい
る。In recent years, high-density packaging of electronic components in electronic devices has progressed. Along with this, there is a demand for miniaturization of box-shaped electronic circuit modules that are incorporated into electronic devices.
第１３図に示すように、従来の箱型電子回路モジュール
（例えば水晶発振器〉１は、電子部品２がプリント基板
３上に実装され、プリント基板３に金属板製の蓋４を被
せた構成である。As shown in FIG. 13, a conventional box-shaped electronic circuit module (for example, a crystal oscillator) 1 has an electronic component 2 mounted on a printed circuit board 3, and the printed circuit board 3 is covered with a lid 4 made of a metal plate. be.
電子部品２はプリント基板３上にだけ設けであるため、
電子部品２の数に対応した大きさのプリント基板３を必
要とし、箱型電子回路モジコール１の小型化を図る上で
自ずと限界があり、小型化が困難であった。Since the electronic component 2 is provided only on the printed circuit board 3,
Since the printed circuit board 3 is required to have a size corresponding to the number of electronic components 2, there is a limit to the miniaturization of the box-shaped electronic circuit module 1, and miniaturization is difficult.
本発明は小型化を可能とした箱型電子回路モジュール及
びその製造方法を提供することを目的とする。An object of the present invention is to provide a box-shaped electronic circuit module that can be miniaturized and a method for manufacturing the same.
請求項１の発明は、合成樹脂製の箱体の内側の面に、液
晶ポリマに金属めっきを施した配線パターンとランドと
が埋設されており、且つ電子部品が上記ランドと接続さ
れて上記内側の面に実装して構成する。In the invention of claim 1, a wiring pattern and a land made of metal plating on a liquid crystal polymer are buried in the inner surface of a synthetic resin box, and an electronic component is connected to the land and the inner surface of the box is made of synthetic resin. Implement and configure on the surface.
請求項２の発明は、液晶ポリマの成形品に金属めっきを
施したランドと配線パターンの骨組体を、その表面に埋
め込んで、組み合わされて箱体を形成する分割体を樹脂
成形する工程と、
該分割体の表面の上記ランド上に電子部品を実装する工
程と、
該電子部品が実装された分割体を上記配線パターン同士
が接続された状態で箱体となるように組合わせる工程と
より構成する。The invention according to claim 2 includes the steps of: embedding a frame body of metal-plated lands and wiring patterns on the surface of a liquid crystal polymer molded product, and resin-molding a divided body that is combined to form a box body; The method includes the steps of: mounting an electronic component on the land on the surface of the divided body; and assembling the divided body on which the electronic component is mounted to form a box with the wiring patterns connected to each other. do.
（作用）
請求項１において、電子部品を箱体の内側面に実装する
構成は、電子部品実装面積を広くし、箱型電子回路モジ
ュールの小型化を特徴とする請求項２において、分割体
に対して電子部品を実装し最後にこれを箱体となるよう
に組合わせることにより、電子部品の実装が容易となる
。(Function) In claim 1, the configuration in which the electronic components are mounted on the inner surface of the box increases the electronic component mounting area and reduces the size of the box-shaped electronic circuit module. By mounting electronic components on the box and finally combining them to form a box, it becomes easy to mount the electronic components.
第１図は本発明の第１実施例になる箱型電子モジュール
１０を示す。FIG. 1 shows a box-shaped electronic module 10 according to a first embodiment of the present invention.
この箱型電子回路モジュール１ｏは、底板部１１と四方
の鋼板部１２，１３，１４．１５とよりなり、上方が開
口１６とされた箱体１７と、この箱体１７の内側の面に
実装される電子部品１８〜２２と、下面に電子部品３１
．３２．３３が実装されており、上記開口１６を塞ぐ板
体４０とよりなる。This box-shaped electronic circuit module 1o consists of a bottom plate part 11 and four steel plate parts 12, 13, 14. electronic components 18 to 22 and an electronic component 31 on the bottom surface.
．． 32 and 33 are mounted, and consists of a plate body 40 that closes the opening 16.
第２図は箱体１７を示す。箱体１７は、合成樹脂（例え
ば液晶ポリマ）製の箱体本体５ｏの内側の面に、第３図
に示す立体構造の配線パターン骨組体５１が埋設されて
いる構成である。FIG. 2 shows the box body 17. The box body 17 has a structure in which a three-dimensional wiring pattern frame body 51 shown in FIG. 3 is embedded in the inner surface of a box body 5o made of synthetic resin (for example, liquid crystal polymer).
配線パターン骨組体５１は、液晶ポリマ製であり、配線
パターン５２とランド５３とよりなり、各配線パターン
５２は連結リブ５４により連結されている。The wiring pattern frame body 51 is made of liquid crystal polymer and consists of wiring patterns 52 and lands 53, and each wiring pattern 52 is connected by a connecting rib 54.
板体４０も、上記の箱体１７と同様に、合成樹脂（例え
ば液晶ポリマ）の板体本体５５の表面に、配線パターン
骨組体５６が埋設されている構造である。Similarly to the box 17 described above, the plate 40 has a structure in which a wiring pattern frame 56 is embedded in the surface of a plate main body 55 made of synthetic resin (for example, liquid crystal polymer).
第１図中、配線パターン、箱体及び板体に金属めっきが
施され電子部品２１は鋼板部１２の内側面に、電子部品
２２は＃Ｉ板部１３の内側面に実装されている。電子部
品３１．３２．３３は、天板の下面に実装されている。In FIG. 1, the wiring pattern, the box body, and the plate body are plated with metal, and the electronic component 21 is mounted on the inner surface of the steel plate portion 12, and the electronic component 22 is mounted on the inner surface of the #I plate portion 13. Electronic components 31, 32, and 33 are mounted on the lower surface of the top plate.
板体４０はその配線パターン骨組体５６の端部を、箱体
１７の配線パターン骨組体５１の端部と導通接続させて
、箱体１７に固定しである。The plate body 40 is fixed to the box body 17 by electrically connecting the end portion of the wiring pattern frame body 56 to the end portion of the wiring pattern frame body 51 of the box body 17.
これにより、箱型電子回路モジュール１０は、電子部品
が底板部１１の上面に限らず、側板部１２〜１５の内側
面にも、更に天板部の下面にも実装された構造となる。As a result, the box-shaped electronic circuit module 10 has a structure in which electronic components are mounted not only on the upper surface of the bottom plate part 11 but also on the inner surfaces of the side plate parts 12 to 15 and further on the lower surface of the top plate part.
即ち、箱体の６面金部の内側の面を電子部品の実装面と
して利用したｌｌ造である。In other words, it is a ll structure in which the inner surface of the six-sided metal part of the box body is used as a mounting surface for electronic components.
従って、箱型電子回路モジュール１０は、底面だけを電
子部品実装面として利用した従来の箱型電子回路モジュ
ールに比べて大幅に小型化された構造となる。なお、外
部接続端子は図示を省略している。Therefore, the box-shaped electronic circuit module 10 has a structure that is significantly smaller than a conventional box-shaped electronic circuit module that uses only the bottom surface as an electronic component mounting surface. Note that external connection terminals are not shown.
第４ＷＪは本発明の第２実施例である箱型電子回路モジ
ュール６０を、その箱体６１を表裏反転した状態で示す
。The fourth WJ shows a box-shaped electronic circuit module 60 according to a second embodiment of the present invention, with its box body 61 turned upside down.
底板６２は、合成樹ＩＩ（例えば液晶ポリマ）の底板本
体６３に、液晶ポリマ製の配線パターン６４とランド（
図示せず）と、表面実装用端子６５とよりなる配線パタ
ーン骨組体６６が埋設された構成である。The bottom plate 62 includes a bottom plate main body 63 made of synthetic wood II (for example, liquid crystal polymer), and a wiring pattern 64 made of liquid crystal polymer and a land (
(not shown) and a wiring pattern frame body 66 consisting of a surface mounting terminal 65 is embedded.
端子６５は、底１１６２の側面と下面とに突出している
。The terminals 65 protrude from the side and bottom surfaces of the bottom 1162.
また、底板６２上には、電子部品６７が実装されている
。Furthermore, electronic components 67 are mounted on the bottom plate 62.
箱体６１．は、合成樹脂（例えば液晶ポリマ）の箱体本
体６８に、液晶ポリマ製の配線パターン６９と、ランド
（図示せず〉と、コンタクトビン部７０とよりなる配線
パターン骨組体７１が埋設された構成である。Box body 61. 1 has a structure in which a wiring pattern frame body 71 consisting of a wiring pattern 69 made of liquid crystal polymer, a land (not shown), and a contact bin portion 70 is embedded in a box body 68 made of synthetic resin (for example, liquid crystal polymer). It is.
箱体６１の底面及び側面に電子部品７２が実装されてい
る。Electronic components 72 are mounted on the bottom and side surfaces of the box 61.
フンタクトビン部７０は、開口側に突き出しており、コ
ンタクトビン、配線パターン、箱体及び底板にめっきさ
れている。The contact bin part 70 protrudes toward the opening side, and is plated on the contact bin, the wiring pattern, the box body, and the bottom plate.
箱体６１と底板６２とは、コンタクトビン部７０と、底
板６２上のコンタクトボール７３に嵌合させ、このコン
タクトホール７３より突出した部分を半田付けして固定
しである。The box body 61 and the bottom plate 62 are fitted into the contact bottle portion 70 and the contact ball 73 on the bottom plate 62, and the portions protruding from the contact holes 73 are fixed by soldering.
第５図は本発明の第３実施例の箱型電子回路モジュール
８０を示す。なお、外部接続端子は図示を省略している
。FIG. 5 shows a box-shaped electronic circuit module 80 according to a third embodiment of the present invention. Note that external connection terminals are not shown.
この箱型電子回路モジュール８０は、隣り合う二つの銅
板部８１．８２と一つの底板部８３とよりなる一つの分
割体８４と、同じく隣り合う二つの鋼板部８５．８６と
−の天板部８７とよりなる別の分割体８８とをその櫛歯
状部８９．９０同士を係合させて組合わせて箱型したも
のである。This box-shaped electronic circuit module 80 consists of one divided body 84 consisting of two adjacent copper plate parts 81.82 and one bottom plate part 83, and a top plate part 84 made up of two adjacent steel plate parts 85.86 and -. 87 and another divided body 88 are combined by engaging their comb-like portions 89 and 90 to form a box shape.
−の分割体８４の底板部８３の上面及び倒板部８１．８
２の内側面には、電子部品９１が実装されている。- The upper surface of the bottom plate part 83 of the divided body 84 and the folded plate part 81.8
An electronic component 91 is mounted on the inner surface of 2.
別の分割体８８の内例の各面にも、電子部品（図示せず
）が実装されている。Electronic components (not shown) are also mounted on each inner surface of another divided body 88 .
この箱型電子回路モジュール８０は、６面の各面の内側
面に電子部品９１が実装された構成であり、従来に比べ
て電子部品の実装面積が増え、その分出型となっている
。This box-shaped electronic circuit module 80 has a configuration in which electronic components 91 are mounted on the inner surfaces of each of the six surfaces, and the mounting area of the electronic components is increased compared to the conventional one, and the module is of an extruded type.
ここで、−の分割体８４は最初に、液晶ポリマにより一
次成形を行って第６図に示す立体構造の配線パターン骨
組体９２を成形し、次いで、配線パターン骨組体９２を
成形金型に組み付けて液晶ポリマ樹脂により二次成形す
ることにより、第７図に示すように製造される。Here, the - divided body 84 is first formed by primary molding using a liquid crystal polymer to form a wiring pattern frame body 92 having a three-dimensional structure shown in FIG. 6, and then the wiring pattern frame body 92 is assembled into a molding die. By performing secondary molding using a liquid crystal polymer resin, the product is manufactured as shown in FIG. 7.
配線パターン骨組体９２は、配線パターン９３と、ラン
ド９４とが連結り、プ９５により一体化された構成であ
る。The wiring pattern frame body 92 has a structure in which a wiring pattern 93 and a land 94 are connected and integrated by a pulley 95.
上記の二次成形により、配線パターン骨組体９２は、第
８図に併せて示すように、分割体８４の内側面に露出し
た状態で分割体８４に埋設された構造となる。As a result of the above secondary forming, the wiring pattern frame 92 has a structure in which it is embedded in the divided body 84 while being exposed on the inner surface of the divided body 84, as also shown in FIG.
次に、ランド９４上に半田ペーストを塗布し、電子部品
を実装する。Next, solder paste is applied onto the lands 94 and electronic components are mounted.
ここで、分割体８４の向きを適宜変えることにより、底
板部８３の上面、鋼板部８１．８２の内側面を上方に向
き、且つその上方側に障害物が無い状態とすることが出
来る。従って半田ペースト塗布装置及び部品実ｉｉ＠厘
を、上方から上記各面に接近させることが出来る。従っ
て、電子部品の実装を自動的に行うことができる。Here, by appropriately changing the direction of the divided body 84, the upper surface of the bottom plate part 83 and the inner surfaces of the steel plate parts 81 and 82 can be directed upward, and there can be no obstruction on the upper side thereof. Therefore, the solder paste applicator and the component assembly can be approached from above to each of the above surfaces. Therefore, electronic components can be mounted automatically.
第９図は本発明の第４実施例の箱型電子回路モジュール
１０Ｇを示す。なお、外部接続端子は図示を省略しであ
る。FIG. 9 shows a box-shaped electronic circuit module 10G according to a fourth embodiment of the present invention. Note that external connection terminals are not shown.
この箱型電子回路モジュール１００は、実装されている
ーの底板部１０１と、４つの側板部１０２〜１０５と、
−の天板部１０６とを組合わせて箱型としたものである
。This box-shaped electronic circuit module 100 includes a bottom plate portion 101, four side plate portions 102 to 105, and
- is combined with the top plate part 106 to form a box shape.
底板部１０１、側板部１０２〜１０５、及び天板部１０
Ｂが夫々分割体を構成する。Bottom plate part 101, side plate parts 102 to 105, and top plate part 10
Each of B constitutes a divided body.
各銅板部１０２〜１０５の上側線及び下側縁には夫々コ
ンタクトビン部１０７．１０８が突出しである。Contact bin portions 107 and 108 protrude from the upper line and lower edge of each of the copper plate portions 102 to 105, respectively.
底板部１０１の周縁部にコンタクトホール１０９、天板
部１０６の周縁部にコンタクトホール１１０を有する。A contact hole 109 is provided at the periphery of the bottom plate portion 101, and a contact hole 110 is provided at the periphery of the top plate portion 106.
各側板部１０２〜１０５は、下側縁のコンタクトビン部
１０８に嵌合させて底板部１０１の周囲部に立設されて
いる。Each of the side plate parts 102 to 105 is erected around the bottom plate part 101 so as to fit into a contact bin part 108 on the lower edge.
天板部１０６は、そのコンタクトホール１１Ｇを、各側
板部１０２〜１０５の上側線のコンタクトビン部１０８
に嵌合させて取り付けられる。The top plate part 106 connects the contact hole 11G to the contact bin part 108 of the upper line of each side plate part 102 to 105.
It can be installed by fitting it into the
コンタクトビン部１０７．１０８とコンタクトホール１
０９．１１０との嵌合部は、粕記と同様に半田付けされ
る。Contact bin parts 107 and 108 and contact hole 1
The fitting part with 09.110 is soldered in the same way as Kasuki.
こ）で、底板部１０１、側板部１０２〜１０５、天板部
１０６の製造方法について説明する。In this section, a method for manufacturing the bottom plate part 101, the side plate parts 102 to 105, and the top plate part 106 will be explained.
まず、第１０図に示すように、液晶ポリマにより、配線
パターン骨組体１２０を平面的に一次成形し、金属めっ
きを施す。First, as shown in FIG. 10, a wiring pattern frame 120 is primarily formed into a two-dimensional shape using a liquid crystal polymer, and then metal plating is applied.
配線パターン骨組体１２０は、配線パターン１２１とラ
ンド１２２とコンタクトビン部１０７．１０８とが連結
リブ１２３により連結された構造である。The wiring pattern frame 120 has a structure in which the wiring pattern 121, the land 122, and the contact bin portions 107 and 108 are connected by a connecting rib 123.
次いで、この配線パターン骨組体１２０を金型にセット
して液晶ポリマ樹脂により二次成形する。Next, this wiring pattern frame body 120 is set in a mold and secondarily molded using a liquid crystal polymer resin.
これにより、第１１図に示すように、底板部１０１と４
つの側板部１０２〜１０５とが連結リブ１２３により連
結された、箱体が展開された状態の平面的な、底板部−
側板部集合体１２４を得る。As a result, as shown in FIG.
A planar bottom plate portion in which the box body is expanded, in which the two side plate portions 102 to 105 are connected by a connecting rib 123.
A side plate assembly 124 is obtained.
次いで、第１２図に示すように、この集合体１２４の配
線パターン及び箱体にめっきし、半田ペーストを塗布し
、電子部品１１１を実装する。Next, as shown in FIG. 12, the wiring pattern and box of this assembly 124 are plated, solder paste is applied, and electronic components 111 are mounted.
上記集合体１２５は平面であるため、電子部品１１１の
実装は容易である。Since the assembly 125 is flat, it is easy to mount the electronic components 111 thereon.
この後、連結リブ１２３の個所で折って、側板部１０２
〜１０５を底板部１０１より切り離す。After that, fold it at the connecting rib 123 and attach the side plate part 102.
- 105 are separated from the bottom plate portion 101.
また、シールド効果と放熱性を良くするために、箱体に
シールド板をインサート底形することもできる。またこ
の代わりに、外側面に金属めっきを施すこともできる。Furthermore, in order to improve the shielding effect and heat dissipation, a shield plate can be inserted into the bottom of the box. Alternatively, the outer surface may be plated with metal.
また、箱体が樹１１ｆｆｌ形品であるため、外側面を凹
凸面とし、放熱面積を大とすることもできる。Further, since the box body is a tree-shaped product, the outer surface can be made uneven to increase the heat dissipation area.
以上説明した様に、請求項１の発明によれば、箱体の内
側の面を電子部品の実装に利用することができるため、
電子部品の実装可能な面積を効果的に増やすことが出来
、これにより、実装すべき同じ数の電子部品に対して箱
体の大きさを小さくすることが出来、小型化を効果的に
図ることが出来る。As explained above, according to the invention of claim 1, since the inner surface of the box can be used for mounting electronic components,
The area in which electronic components can be mounted can be effectively increased, and the size of the box body can be reduced for the same number of electronic components to be mounted, thereby effectively achieving miniaturization. I can do it.
請求項２の発明によれば、分割体に対して電子部品を実
装するため、実装を容易に行うことが出来る。従って、
内側の面に電子部品が実装された箱型の電子回路モジュ
ールを容易に製造することが出来る。According to the invention of claim 2, since electronic components are mounted on the divided bodies, mounting can be easily performed. Therefore,
A box-shaped electronic circuit module with electronic components mounted on the inner surface can be easily manufactured.
第１図は本発明の箱型電子回路モジュールの第１実施例
を示す図、
第２図は第１図中の箱体を一部切截して示す図、第３図
は配線パターン骨組体を示を図、第４図は本発明の箱型
電子回路モジュールの第２実施例を示す図、
第５図は本発明の第３実施例を示す図、第６図は第５図
中の−の分割体を成形するときの一次成形による配線パ
ターン骨組体を示す図、第７図は二次成形後の−の分割
体を示す図、第８図は第７図中■−■線に沿う断面図、
第９図は本発明の第４実施例の箱型電子回路モジュール
を示す図、
第１０図は一次成形による配線パターン組立体を示す図
、
第１１図は二次成形による底板部−側板部集合体を示す
図、
第１２図は電子部品が実装された状態を示す図、第１３
図は従来例を示す図である。
図において、
１０．６０．８０．１００は箱型電子回路モジュール、
１１．８３．１０１は底板部、
１２〜１５，８１．８２，１０２〜１０５は側板部、１
７．６１は箱体、
１８〜２２．３１〜３３．６７．７２．９１゜１１１は
電子部品、
５０は箱体本体、
５２．６４．６９．９３．１２１は配線パターン、５３
．６４．１２２はランド、
５４．９５．１２３は連結リブ、
８４．８８は分割体、
１２４は底板部−側板部集合体
を示す。Fig. 1 is a diagram showing a first embodiment of the box-shaped electronic circuit module of the present invention, Fig. 2 is a partially cutaway view of the box in Fig. 1, and Fig. 3 is a wiring pattern frame. 4 is a diagram showing a second embodiment of the box-type electronic circuit module of the present invention, FIG. 5 is a diagram showing a third embodiment of the present invention, and FIG. Figure 7 shows the wiring pattern frame body obtained by primary molding when forming the divided body of -. Figure 7 shows the divided body of - after secondary molding. Figure 8 shows the line ■-■ in Figure 7. A cross-sectional view along
FIG. 9 is a diagram showing a box-shaped electronic circuit module according to the fourth embodiment of the present invention, FIG. 10 is a diagram showing a wiring pattern assembly formed by primary molding, and FIG. 11 is a diagram showing a bottom plate-side plate assembly formed by secondary molding. Figure 12 is a diagram showing the state in which electronic components are mounted, Figure 13 is a diagram showing the body.
The figure shows a conventional example. In the figure, 10.60.80.100 is a box-shaped electronic circuit module, 11.83.101 is a bottom plate part, 12-15, 81.82, 102-105 are side plate parts, 1
7.61 is the box body, 18~22.31~33.67.72.91°111 is the electronic component, 50 is the box body, 52.64.69.93.121 is the wiring pattern, 53
．． 64.122 is a land, 54.95.123 is a connecting rib, 84.88 is a divided body, and 124 is a bottom plate-side plate assembly.
Claims (2)
液晶ポリマに金属めっきを施した配線パターン（５２，
６４，６９，９３，１２１）とランド（５３，９４，１
２２）とが埋設されており、且つ電子部品（２１，６７
，１１１）が上記ランドと接続されて上記内側の面に実
装されてなる構成の箱型電子回路モジュール。(1) On the inside surface of the synthetic resin box (17, 61),
Wiring pattern (52,
64, 69, 93, 121) and Rand (53, 94, 1
22) are buried, and electronic components (21, 67) are buried.
, 111) are connected to the land and mounted on the inner surface.
（９４，１２２）と配線パターン（９２，１２１）の骨
組体（９３，１２０）を、表面に埋め込んで組み合わさ
れて箱体を形成する分割体（８４，８８，１０１〜１０
６）を樹脂成形する工程と、該分割体の表面の上記ラン
ド（９４，１２２）上に電子部品（９１，１１１）を実
装する工程と、該電子部品が実装された分割体を上記配
線パターン同士が接続された状態で箱体となるように組
合わせる工程とよりなる構成の箱型電子回路モジュール
の製造方法。(2) A frame body (93, 120) of a metal-plated land (94, 122) and a wiring pattern (92, 121) on a liquid crystal polymer molded product is embedded in the surface and combined to form a box. Divided body (84, 88, 101-10
6) with resin molding, a step of mounting an electronic component (91, 111) on the land (94, 122) on the surface of the divided body, and a step of molding the divided body with the electronic component mounted on the above wiring pattern. A method for manufacturing a box-shaped electronic circuit module comprising the steps of assembling the modules in a connected state to form a box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7150190A JPH03270289A (en) | 1990-03-20 | 1990-03-20 | Box type electronic circuit module and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7150190A JPH03270289A (en) | 1990-03-20 | 1990-03-20 | Box type electronic circuit module and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03270289A true JPH03270289A (en) | 1991-12-02 |
Family
ID=13462489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7150190A Pending JPH03270289A (en) | 1990-03-20 | 1990-03-20 | Box type electronic circuit module and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03270289A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100430077B1 (en) * | 2004-01-15 | 2004-05-04 | 구일에인텍(주) | The control box of air pump for foul water treatment plant |
| CN102627141A (en) * | 2012-03-31 | 2012-08-08 | 哈尔滨市平房区南海机械加工厂 | Wireless communication electronic box for oceanographic buoy |
-
1990
- 1990-03-20 JP JP7150190A patent/JPH03270289A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100430077B1 (en) * | 2004-01-15 | 2004-05-04 | 구일에인텍(주) | The control box of air pump for foul water treatment plant |
| CN102627141A (en) * | 2012-03-31 | 2012-08-08 | 哈尔滨市平房区南海机械加工厂 | Wireless communication electronic box for oceanographic buoy |
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