JPH032665U - - Google Patents
Info
- Publication number
- JPH032665U JPH032665U JP6252689U JP6252689U JPH032665U JP H032665 U JPH032665 U JP H032665U JP 6252689 U JP6252689 U JP 6252689U JP 6252689 U JP6252689 U JP 6252689U JP H032665 U JPH032665 U JP H032665U
- Authority
- JP
- Japan
- Prior art keywords
- module
- hybrid integrated
- board
- integrated circuit
- corners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989062526U JPH0710510Y2 (ja) | 1989-05-31 | 1989-05-31 | 混成集積回路用モジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989062526U JPH0710510Y2 (ja) | 1989-05-31 | 1989-05-31 | 混成集積回路用モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH032665U true JPH032665U (enrdf_load_html_response) | 1991-01-11 |
| JPH0710510Y2 JPH0710510Y2 (ja) | 1995-03-08 |
Family
ID=31591755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989062526U Expired - Lifetime JPH0710510Y2 (ja) | 1989-05-31 | 1989-05-31 | 混成集積回路用モジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710510Y2 (enrdf_load_html_response) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53104316A (en) * | 1977-02-23 | 1978-09-11 | Shinozaki Kougeishiya Yuugen | Method of producing cover of case* binder* file or like |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6280366U (enrdf_load_html_response) * | 1985-11-08 | 1987-05-22 | ||
| JPS62147526U (enrdf_load_html_response) * | 1986-03-12 | 1987-09-18 | ||
| JPS6416640U (enrdf_load_html_response) * | 1987-07-21 | 1989-01-27 |
-
1989
- 1989-05-31 JP JP1989062526U patent/JPH0710510Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6280366U (enrdf_load_html_response) * | 1985-11-08 | 1987-05-22 | ||
| JPS62147526U (enrdf_load_html_response) * | 1986-03-12 | 1987-09-18 | ||
| JPS6416640U (enrdf_load_html_response) * | 1987-07-21 | 1989-01-27 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53104316A (en) * | 1977-02-23 | 1978-09-11 | Shinozaki Kougeishiya Yuugen | Method of producing cover of case* binder* file or like |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0710510Y2 (ja) | 1995-03-08 |