JPH03266392A - Sealing of el board - Google Patents
Sealing of el boardInfo
- Publication number
- JPH03266392A JPH03266392A JP2063545A JP6354590A JPH03266392A JP H03266392 A JPH03266392 A JP H03266392A JP 2063545 A JP2063545 A JP 2063545A JP 6354590 A JP6354590 A JP 6354590A JP H03266392 A JPH03266392 A JP H03266392A
- Authority
- JP
- Japan
- Prior art keywords
- moisture
- board
- films
- hot
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title claims description 9
- 239000004831 Hot glue Substances 0.000 claims abstract description 16
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000012943 hotmelt Substances 0.000 abstract description 3
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 2
- 230000009545 invasion Effects 0.000 abstract 2
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 13
- 239000002245 particle Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- -1 polyfluorochloroethylene Polymers 0.000 description 2
- 239000013543 active substance Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000000816 ethylene group Polymers [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、時計の発光針等に用いられるＥＬ板の封止
方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for sealing an EL plate used in luminescent hands of watches and the like.
［従来の技術］
ＥＬ板は、ベースフィルム上に形成した透明電極に発光
層、絶縁層、背面電極をこの順に積層形成し、その外側
に捕水フィルムを配置したものである。ここに発光層は
例えば、ＺｎＳにＣｕ等の活性物質を付与した発光粒子
をバインダーである高誘電性プラスチック樹脂中に均質
分散したものである。そして背面電極と透明電極との間
に電圧か印加されると、発光層の中の発光粒子か発光す
る。[Prior Art] An EL board has a transparent electrode formed on a base film, a light-emitting layer, an insulating layer, and a back electrode laminated in this order, and a water-trapping film is placed on the outside. The light-emitting layer is made by homogeneously dispersing light-emitting particles, for example, ZnS to which an active substance such as Cu has been added, in a highly dielectric plastic resin as a binder. When a voltage is applied between the back electrode and the transparent electrode, the luminescent particles in the luminescent layer emit light.
、ところで、発光粒子は水分が加わると加水分解を起こ
し発光輝度が衰えるため、ＥＬ板の全周をポリフッ化塩
化エチレン等の材質の防湿フィルムで包んでいる。By the way, when moisture is added to the luminescent particles, they undergo hydrolysis and the luminance decreases, so the entire circumference of the EL board is wrapped with a moisture-proof film made of a material such as polyfluorochloroethylene.
その方法としては従来、防湿フィルムの間にＥＬ板を挟
み、かつ防湿フィルム間にナイロン系。The conventional method is to sandwich an EL board between moisture-proof films and use a nylon-based film between the moisture-proof films.
オレフィン系等の熱溶融型（ホットメルト）接着剤を介
在させておき、両防湿フィルムを加熱・加圧して封止し
ている。A hot-melt adhesive such as an olefin adhesive is interposed, and both moisture-proof films are sealed by heating and pressurizing them.
［解決しようとする課題〕
しかし、ナイロン系、オレフィン系等のホットメルト接
着剤はポリフッ化塩化エチレン等の防湿フィルムに対し
て透湿度が約１００〜１００００倍高いため、端部より
防湿フィルム間のホットメルト接着剤を介して水分か浸
入し、発光粒子がそれにより劣化し、発光輝度が経時的
に衰えるという問題点かあった。[Problem to be solved] However, the moisture permeability of hot melt adhesives such as nylon and olefin adhesives is approximately 100 to 10,000 times higher than that of moisture-proof films such as polyfluorochlorinated ethylene. There was a problem in that moisture entered through the hot melt adhesive, causing the luminescent particles to deteriorate and the luminance to decline over time.
従ってホットメルト接着剤を介した水分の浸入量を少な
くするため、封止部に通常的２１１１ｍの幅を必要とし
、その分ＥＬ素子の幅が大きくなり、ＥＬ素子の小型化
は困難であり、ＥＬ素子を用いた製品のデザインに制約
を生じていた。Therefore, in order to reduce the amount of water infiltration through the hot melt adhesive, the sealing part typically requires a width of 2111 m, which increases the width of the EL element, making it difficult to miniaturize the EL element. This has created restrictions on the design of products using EL elements.
そこで本発明の目的は、水分の浸入量を少なくしてＥＬ
素子の寿命を長くし、また小型化が可能なＥＬ板の封止
方法を提供することにある。Therefore, the purpose of the present invention is to reduce the amount of water intrusion and improve the EL.
It is an object of the present invention to provide a method for sealing an EL board that can extend the life of the element and also enable miniaturization.
［課題を解決するための手段］
上記目的を達成するために、本発明のＥＬ板の封止方法
は、防湿フィルムによりＥＬ板を両側から挟み、ＥＬ板
の外周部において防湿フィルムをホットメルト接着剤を
介して互いに重ね合わせる工程と、ホットメルト接着剤
を介して重なり合う防湿フィルムを加熱しながら加圧し
て互いに固着させる工程と、熱ツールによって上記固着
部を再び加圧し薄型化する工程とを具備する。[Means for Solving the Problems] In order to achieve the above object, the method for sealing an EL board of the present invention involves sandwiching the EL board from both sides with moisture-proof films, and hot-melting the moisture-proof film on the outer periphery of the EL board. A process of stacking the moisture-proof films on top of each other using a hot melt adhesive, a process of applying pressure while heating the overlapping moisture-proof films to fix them to each other, and a process of pressurizing the bonded parts again using a heat tool to make them thinner. do.
［実施例］
以下、本発明の一実施例を図面に基づいて詳細に説明す
る。[Example] Hereinafter, an example of the present invention will be described in detail based on the drawings.
ＥＬ板１は、ベースフィルム２上に形成された透明電極
３に、発光層４．絶縁層５．背面電極６が順次積層形成
され、その外側が捕水フィルム７により挟まれたもので
ある（第１図参照）。The EL board 1 includes a transparent electrode 3 formed on a base film 2, a light emitting layer 4. Insulating layer 5. Back electrodes 6 are successively laminated and sandwiched between water-trapping films 7 on the outside (see FIG. 1).
そして、ポリフッ化塩化エチレンからなる、２枚の防湿
フィルム９及び１０をホットメルト接着剤層８を介して
対向させて、その間にＥＬ板１を挟む。そしてＥＬ板１
の外周部において防湿フィルム９及び１０をホットメル
ト接着剤層８を介して互いに重ね合わせる。次にラミネ
ータに通す、または熱プレスする等によりホットメルト
接着剤層８を介して重なり合う防湿フィルム９及び１０
を例えば約１２０〜１３０℃、０．５ｋｇ／ｃ−の条件
で加熱・加圧する。するとホットメルト接着剤層８が溶
融して防湿フィルム９及び１０が固着される。Then, two moisture-proof films 9 and 10 made of polyfluorochloroethylene are opposed to each other with a hot-melt adhesive layer 8 in between, and the EL board 1 is sandwiched between them. And EL board 1
Moisture-proof films 9 and 10 are stacked on each other with a hot-melt adhesive layer 8 in between at the outer periphery of the film. Moisture-proof films 9 and 10 are then overlapped via a hot-melt adhesive layer 8 by passing through a laminator or hot-pressing.
is heated and pressurized, for example, at about 120 to 130°C and 0.5 kg/c-. Then, the hot-melt adhesive layer 8 melts and the moisture-proof films 9 and 10 are fixed.
次に、熱ツール１２及び１３を用意する。第２゜３図に
示すように熱ツール１２及び１３はＥＬ板１の全周を端
部封止部の所定位置で囲む枠形状の輪郭を有しており、
その断面形状は第１．２図に示されているように、枠部
材１２ａ、１３ａの先端面がプレス面１２ｂ、１３ｂと
なっており、その中央部に半円形状の突出部１２ｃ及び
１３ｃを有している。熱ツール１２及び１３は所定手段
により２３０℃前後に加熱することができるようになっ
ており、また互いに接離自在である。Next, the thermal tools 12 and 13 are prepared. As shown in FIG. 2-3, the thermal tools 12 and 13 have a frame-shaped outline that surrounds the entire circumference of the EL plate 1 at a predetermined position of the end sealing part.
As shown in Fig. 1.2, the cross-sectional shape of the frame members 12a and 13a are pressed surfaces 12b and 13b, and semicircular protrusions 12c and 13c are formed in the center thereof. have. The thermal tools 12 and 13 can be heated to around 230° C. by a predetermined means, and can be moved toward and away from each other.
第１図に示すようにＥＬ素子１１を熱ツール１２と１３
との間に保持して熱ツール１２及び１３によりプレスす
る。そして防湿フィルム９及び１０は加熱され、防湿フ
ィルム９及び１０の溶融点に達し、特に突出部１２ｃ、
１３ｃにより防湿フィルム９及びｌＯが押圧されてその
位置のホットメルト接着剤層８が両側へ移動し、防湿フ
ィルム同士が接触し熱溶融する。その後熱ツール１２及
び１３を離して、端部固着部が熱ツールにより再加工さ
れたＥＬ素子１１を取り出す。防湿フィルム同士が溶融
しているため、ホットメルト層より浸入してきた水分は
ほとんと遮断される。As shown in FIG.
and is pressed by the heat tools 12 and 13. The moisture-proof films 9 and 10 are then heated to reach the melting point of the moisture-proof films 9 and 10, and in particular, the protrusions 12c,
13c presses the moisture-proof films 9 and 1O, and the hot-melt adhesive layer 8 at that position moves to both sides, and the moisture-proof films come into contact with each other and are thermally melted. Thereafter, the thermal tools 12 and 13 are separated, and the EL element 11 whose end fixed portions have been reworked by the thermal tool is taken out. Since the moisture-proof films are fused together, most of the moisture that enters from the hot melt layer is blocked.
従って水分の浸入量を極端に減少させることか可能であ
る。熱ツールはＥＬ板１より十分離れた部分の防湿フィ
ルム９．ｌＯのみを熱するよう設定されているため、熱
ツールの熱がＥＬ板１へ伝わることはなく、ＥＬ板１か
破損するのが防止される。Therefore, it is possible to extremely reduce the amount of water intrusion. The thermal tool is covered with a moisture-proof film 9 in a portion sufficiently far away from the EL board 1. Since it is set to heat only IO, the heat of the thermal tool will not be transmitted to the EL plate 1, and damage to the EL plate 1 will be prevented.
上記実施例では熱ツール１２及び１３の温度を２３０℃
前後としたが、それより低い温度とし、防湿フィルム９
及び１０を変形させ、ホットメルト接着剤を両側に移動
させ、接着剤層８の一部を薄くするのみてもよい。これ
によっても、その部分のホットメルト接着剤層８が薄く
なるため、その部分からの水分の浸入量か減り、ＥＬ素
子の寿命を長くすることが可能である。In the above embodiment, the temperature of the thermal tools 12 and 13 is 230°C.
However, the temperature was lower than that, and the moisture-proof film 9
and 10 may be modified to move the hot melt adhesive to both sides and only partially thin the adhesive layer 8. This also makes the hot-melt adhesive layer 8 thinner in that area, which reduces the amount of moisture that enters from that area, making it possible to extend the life of the EL element.
また熱ツールの形状は種々考えられ、例えば熱ツールの
プレス面は平面状であってもよく、また、いずれか一方
の熱ツールのみによって加熱・加圧してもよく、また、
ロール側面に断面くさび形の突起を何する一対の熱ロー
ルの間にＥＬ素子を通すことにより再加工を施してもよ
い。また、多数のＥＬ板を防湿フィルムに挟んで封止し
た後、切断して多数のＥＬ素子を作ることも可能である
。In addition, various shapes of the thermal tool can be considered; for example, the pressing surface of the thermal tool may be flat, heating and pressure may be applied only by one of the thermal tools, and
Reprocessing may be performed by passing the EL element between a pair of heated rolls that have protrusions with a wedge-shaped cross section on the side surfaces of the rolls. It is also possible to make a large number of EL elements by sandwiching and sealing a large number of EL plates between moisture-proof films and then cutting them.
この場合には、切断前に防湿フィルム全体に熱ツールに
より再加熱・加圧加工を行った後、各ＥＬ素子に切断分
離してもよい。In this case, the entire moisture-proof film may be reheated and pressurized using a heat tool before cutting, and then the film may be cut and separated into individual EL elements.
［効果コ
本発明はＥＬ板を両側より挟んだ防湿フィルムを固着し
た後、固着部を熱ツールにより再び加圧して加圧部が薄
型化するため、ホットメルト層を介した水分の浸入量が
減少し、ＥＬ板の寿命を長くすることが可能である。[Effects] In the present invention, after fixing the moisture-proof film sandwiching the EL board from both sides, the fixed part is again pressurized with a hot tool to make the pressed part thinner. It is possible to increase the life of the EL plate.
また水分の浸入量が減るため、その分ＥＬ板の端部封止
部の幅を狭くすることができ、ＥＬ素子を用いた製品の
デザイン上の制約を小さくすることができる。Furthermore, since the amount of moisture infiltration is reduced, the width of the end sealing portion of the EL plate can be reduced accordingly, and restrictions on the design of products using EL elements can be reduced.
第１図は本発明の実施の状態を説明する断面図、第２図
は本発明に係る熱ツールの断面図、第３図はその熱ツー
ルの平面図である。
１ ・ＥＬ板、
８・ ・ホットメルト接着剤、
９１０・ ・防湿フィルム、
１２．１３・ ・熱ツール。
以FIG. 1 is a cross-sectional view illustrating the state of implementation of the present invention, FIG. 2 is a cross-sectional view of a thermal tool according to the present invention, and FIG. 3 is a plan view of the thermal tool. 1. EL board, 8. Hot melt adhesive, 910. Moisture proof film, 12.13. Heat tool. Below
Claims (1)
板の外周部において上記防湿フィルムをホットメルト接
着剤を介して互いに重ね合わせる工程と、 上記ホットメルト接着剤を介して重なり合う上記防湿フ
ィルムを加熱しながら加圧して互いに固着させる工程と
、 熱ツールによって、上記固着部を再び加圧し薄型化する
工程とを具備することを特徴とするＥＬ板の封止方法。[Claims] The above EL board is sandwiched between moisture-proof films from both sides.
a step of overlapping the moisture-proof films on the outer periphery of the board with a hot-melt adhesive; a step of applying pressure while heating the overlapping moisture-proof films to adhere to each other with the hot-melt adhesive; A method for sealing an EL board, comprising the steps of: pressurizing the fixed portion again to make it thinner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2063545A JPH0754746B2 (en) | 1990-03-14 | 1990-03-14 | EL plate sealing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2063545A JPH0754746B2 (en) | 1990-03-14 | 1990-03-14 | EL plate sealing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03266392A true JPH03266392A (en) | 1991-11-27 |
| JPH0754746B2 JPH0754746B2 (en) | 1995-06-07 |
Family
ID=13232302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2063545A Expired - Lifetime JPH0754746B2 (en) | 1990-03-14 | 1990-03-14 | EL plate sealing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0754746B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03275723A (en) * | 1990-03-25 | 1991-12-06 | Matsushita Electric Ind Co Ltd | Organic polymer, photoconductive material using same polymer and production thereof |
| JPH0433297U (en) * | 1990-07-14 | 1992-03-18 | ||
| JPH0992463A (en) * | 1995-09-26 | 1997-04-04 | Seikosha Co Ltd | Electroluminescent device |
| JP2000268954A (en) * | 1999-03-17 | 2000-09-29 | Matsushita Electric Ind Co Ltd | Electroluminescent element |
| KR100556274B1 (en) * | 2004-04-01 | 2006-03-03 | 엘지전자 주식회사 | Method for passivation of organic electroluminescent device |
| KR100670256B1 (en) * | 2004-12-23 | 2007-01-16 | 삼성에스디아이 주식회사 | Flat display device and manufacturing method thereof |
| US20160111485A1 (en) * | 2014-10-17 | 2016-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Light-Emitting Device, Module, Electronic Device, and Method for Manufacturing Light-Emitting Device |
| WO2017017553A1 (en) * | 2015-07-30 | 2017-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of light-emitting device, light-emitting device, module, and electronic device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60153497U (en) * | 1984-03-22 | 1985-10-12 | 関西日本電気株式会社 | electroluminescent lamp |
| JPS60156695U (en) * | 1984-03-28 | 1985-10-18 | 関西日本電気株式会社 | electroluminescent lamp |
-
1990
- 1990-03-14 JP JP2063545A patent/JPH0754746B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60153497U (en) * | 1984-03-22 | 1985-10-12 | 関西日本電気株式会社 | electroluminescent lamp |
| JPS60156695U (en) * | 1984-03-28 | 1985-10-18 | 関西日本電気株式会社 | electroluminescent lamp |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03275723A (en) * | 1990-03-25 | 1991-12-06 | Matsushita Electric Ind Co Ltd | Organic polymer, photoconductive material using same polymer and production thereof |
| JPH0433297U (en) * | 1990-07-14 | 1992-03-18 | ||
| JPH0992463A (en) * | 1995-09-26 | 1997-04-04 | Seikosha Co Ltd | Electroluminescent device |
| JP2000268954A (en) * | 1999-03-17 | 2000-09-29 | Matsushita Electric Ind Co Ltd | Electroluminescent element |
| KR100556274B1 (en) * | 2004-04-01 | 2006-03-03 | 엘지전자 주식회사 | Method for passivation of organic electroluminescent device |
| KR100670256B1 (en) * | 2004-12-23 | 2007-01-16 | 삼성에스디아이 주식회사 | Flat display device and manufacturing method thereof |
| US20160111485A1 (en) * | 2014-10-17 | 2016-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Light-Emitting Device, Module, Electronic Device, and Method for Manufacturing Light-Emitting Device |
| US11778850B2 (en) | 2014-10-17 | 2023-10-03 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, module, electronic device, and method for manufacturing light-emitting device |
| CN106797684A (en) * | 2014-10-17 | 2017-05-31 | 株式会社半导体能源研究所 | The manufacture method of light-emitting device, module, electronic equipment and light-emitting device |
| US9847505B2 (en) * | 2014-10-17 | 2017-12-19 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, module, electronic device, and method for manufacturing light-emitting device |
| US11189817B2 (en) | 2014-10-17 | 2021-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, module, electronic device, and method for manufacturing light-emitting device |
| CN111710794A (en) * | 2014-10-17 | 2020-09-25 | 株式会社半导体能源研究所 | Light-emitting device, module, electronic apparatus, and method for manufacturing light-emitting device |
| TWI667784B (en) * | 2014-10-17 | 2019-08-01 | 日商半導體能源研究所股份有限公司 | Light-emitting device, module, electronic device, and method for manufacturing light-emitting device |
| US10629843B2 (en) | 2014-10-17 | 2020-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, module, electronic device, and method for manufacturing light-emitting device |
| US10270057B2 (en) | 2014-10-17 | 2019-04-23 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, module, electronic device, and method for manufacturing light-emitting device |
| CN108738377A (en) * | 2015-07-30 | 2018-11-02 | 株式会社半导体能源研究所 | Manufacturing method, light-emitting device, module and the electronic equipment of light-emitting device |
| US10135037B2 (en) | 2015-07-30 | 2018-11-20 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of light-emitting device, light-emitting device, module, and electronic device |
| US9917282B2 (en) | 2015-07-30 | 2018-03-13 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of light-emitting device, light-emitting device, module, and electronic device |
| US10804503B2 (en) | 2015-07-30 | 2020-10-13 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of light-emitting device, light-emitting device, module, and electronic device |
| CN108738377B (en) * | 2015-07-30 | 2020-11-10 | 株式会社半导体能源研究所 | Method for manufacturing light-emitting device, module, and electronic apparatus |
| JP2021093366A (en) * | 2015-07-30 | 2021-06-17 | 株式会社半導体エネルギー研究所 | Manufacture method of light-emitting device |
| JP2017228512A (en) * | 2015-07-30 | 2017-12-28 | 株式会社半導体エネルギー研究所 | Method of manufacturing light-emitting device, light-emitting device, module, and electronic apparatus |
| US11411208B2 (en) | 2015-07-30 | 2022-08-09 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of light-emitting device, light-emitting device, module, and electronic device |
| WO2017017553A1 (en) * | 2015-07-30 | 2017-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of light-emitting device, light-emitting device, module, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0754746B2 (en) | 1995-06-07 |
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