JPH0433297U - - Google Patents

Info

Publication number
JPH0433297U
JPH0433297U JP7497190U JP7497190U JPH0433297U JP H0433297 U JPH0433297 U JP H0433297U JP 7497190 U JP7497190 U JP 7497190U JP 7497190 U JP7497190 U JP 7497190U JP H0433297 U JPH0433297 U JP H0433297U
Authority
JP
Japan
Prior art keywords
panel
base material
adhesive layer
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7497190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7497190U priority Critical patent/JPH0433297U/ja
Publication of JPH0433297U publication Critical patent/JPH0433297U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本考案による一実施例のELパネル
の概略部分側面図、第2図は、第1図の外皮フイ
ルムの周縁部を切断するための切断刃の断面図、
第3図は、第1図の外皮フイルムの周縁部を作製
するための概略断面図、第4図は、第1図のEL
パネルの強制劣化試験結果を示すグラフ図であり
、第5図は、従来例のELパネルの概略部分断面
図である。 14′,16′……外皮フイルム、20′,2
2′……基材層、24′,26′……接着剤層、
30……接合部。
1 is a schematic partial side view of an EL panel according to an embodiment of the present invention; FIG. 2 is a sectional view of a cutting blade for cutting the peripheral edge of the outer skin film of FIG. 1;
FIG. 3 is a schematic cross-sectional view for producing the peripheral edge of the outer skin film in FIG. 1, and FIG.
FIG. 5 is a graph showing the results of a forced deterioration test of a panel, and FIG. 5 is a schematic partial cross-sectional view of a conventional EL panel. 14', 16'...Outer skin film, 20', 2
2'...base material layer, 24', 26'...adhesive layer,
30...Joint part.

Claims (1)

【実用新案登録請求の範囲】 (1) 三フツ化塩化エチレン樹脂フイルム(PC
TFE)を基材層とし、この基材層に熱可塑性ポ
リオレフイン樹脂からなる接着剤層を被覆してな
る一対の外皮フイルムにて、その周縁部がシール
されてなるELパネルにおいて、外皮フイルムの
シール部が熱融着によつて接着剤層を貫通して基
材層を互いに接合されてなることを特徴とするE
Lパネル。 (2) 上記シール部の基材接合部は、加熱された
切断刃によつて周縁部の切断時に形成されること
を特徴とする実用新案登録の範囲第1項に記載の
ELパネル。
[Scope of claims for utility model registration] (1) Trifluorochloroethylene resin film (PC
In an EL panel, the outer edges of the outer films are sealed by a pair of outer films, each of which has a base layer made of TFE) and which is coated with an adhesive layer made of thermoplastic polyolefin resin. E, characterized in that the parts penetrate the adhesive layer and join the base material layers to each other by heat fusion.
L panel. (2) The EL panel according to item 1 of the scope of utility model registration, wherein the base material joint portion of the seal portion is formed when the peripheral portion is cut by a heated cutting blade.
JP7497190U 1990-07-14 1990-07-14 Pending JPH0433297U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7497190U JPH0433297U (en) 1990-07-14 1990-07-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7497190U JPH0433297U (en) 1990-07-14 1990-07-14

Publications (1)

Publication Number Publication Date
JPH0433297U true JPH0433297U (en) 1992-03-18

Family

ID=31615139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7497190U Pending JPH0433297U (en) 1990-07-14 1990-07-14

Country Status (1)

Country Link
JP (1) JPH0433297U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015046385A (en) * 2013-08-01 2015-03-12 株式会社半導体エネルギー研究所 Light-emitting device, electronic apparatus, and illuminating device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03266392A (en) * 1990-03-14 1991-11-27 Seikosha Co Ltd Sealing of el board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03266392A (en) * 1990-03-14 1991-11-27 Seikosha Co Ltd Sealing of el board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015046385A (en) * 2013-08-01 2015-03-12 株式会社半導体エネルギー研究所 Light-emitting device, electronic apparatus, and illuminating device
US10276826B2 (en) 2013-08-01 2019-04-30 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, electronic device, and lighting device

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