JPH032652U - - Google Patents

Info

Publication number
JPH032652U
JPH032652U JP1989061963U JP6196389U JPH032652U JP H032652 U JPH032652 U JP H032652U JP 1989061963 U JP1989061963 U JP 1989061963U JP 6196389 U JP6196389 U JP 6196389U JP H032652 U JPH032652 U JP H032652U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
cold air
nozzle
cooling structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989061963U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0727638Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989061963U priority Critical patent/JPH0727638Y2/ja
Publication of JPH032652U publication Critical patent/JPH032652U/ja
Application granted granted Critical
Publication of JPH0727638Y2 publication Critical patent/JPH0727638Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1989061963U 1989-05-30 1989-05-30 集積回路素子の冷却構造 Expired - Lifetime JPH0727638Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989061963U JPH0727638Y2 (ja) 1989-05-30 1989-05-30 集積回路素子の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989061963U JPH0727638Y2 (ja) 1989-05-30 1989-05-30 集積回路素子の冷却構造

Publications (2)

Publication Number Publication Date
JPH032652U true JPH032652U (enExample) 1991-01-11
JPH0727638Y2 JPH0727638Y2 (ja) 1995-06-21

Family

ID=31590687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989061963U Expired - Lifetime JPH0727638Y2 (ja) 1989-05-30 1989-05-30 集積回路素子の冷却構造

Country Status (1)

Country Link
JP (1) JPH0727638Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011119395A (ja) * 2009-12-02 2011-06-16 Fujitsu Telecom Networks Ltd 電子部品の冷却構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011119395A (ja) * 2009-12-02 2011-06-16 Fujitsu Telecom Networks Ltd 電子部品の冷却構造

Also Published As

Publication number Publication date
JPH0727638Y2 (ja) 1995-06-21

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